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WO/2019/013230A1 |
The purpose of the present invention is to provide a conductive adhesive composition that, even when repeatedly subjected to temperature changes, is unlikely to result in peeling off of an adherend material. The present invention pertain...
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WO/2019/013336A1 |
Disclosed is an electroconductive adhesive composition comprising (A) electroconductive particles, (B) a thermosetting resin, (C) a flux activator, and (D) a curing catalyst. The electroconductive particles include a metal having a melti...
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WO/2019/013231A1 |
The purpose of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is inhibited from causing adher...
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WO/2018/236055A1 |
The present invention provides: a color liquid glue, which is nontoxic so as to be harmless to the human body and the environment, and has a pH of 10-11 and contains any one of phenolphthalein, o-cresolphthalein and thymolphthalein such ...
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WO/2018/225773A1 |
The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is used as a die bonding material and which has adhesiveness at high temperatures and high thermal conductiv...
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WO/2018/222877A1 |
An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal ...
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WO/2018/211887A1 |
This conductive adhesive contains: an acrylic resin having a weight-average molecular weight of 500,000-1,000,000 and an epoxy group; a thermosetting resin having a glass transition temperature of 0-50ºC; a number-average molecular weig...
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WO/2018/207060A1 |
The present disclosure relates to an acrylic pressure sensitive adhesive tape including a moisture barrier layer in a release layer, and to an acrylic pressure sensitive adhesive tape, which can enhance adhesion by the moisture barrier l...
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WO/2018/205127A1 |
An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than ab...
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WO/2018/205107A1 |
The present application relates to a vulcanization label that can be used to label tires. The label comprises a facestock layer, a first primer layer, a second primer layer comprising a zinc oxide, and a reactive adhesive layer. The two ...
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WO/2018/203629A1 |
The present invention relates to a flame retardant tape for a ship and, more specifically, to a flame retardant tape for a ship, comprising: a sheet layer including polyvinyl chloride, a plasticizer, a flame resistant agent, and a flame ...
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WO/2018/199639A1 |
The present invention relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conduct...
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WO/2018/199329A1 |
An aspect of the present invention relates to an adhesive composition which comprises an adhesive component and electroconductive particles, wherein the electroconductive particles each comprise a plastic particle and a metal layer cover...
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WO/2018/190624A1 |
A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disp...
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WO/2018/181536A1 |
The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxe...
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WO/2018/181625A1 |
The present invention addresses the problem of providing an electrically conductive adhesive composition comprising a thermoplastic resin and having a high heat dissipation ability, wherein a bleed out phenomenon, i.e., exudation of a no...
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WO/2018/181589A1 |
An adhesive composition which contains (a) a thermoplastic resin having a urethane bond, (b) a radically polymerizable compound, (c) a radical polymerization initiator, (d) polyurethane beads and (e) non-conductive inorganic fine particles.
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WO/2018/180685A1 |
The present invention provides: an anisotropic electroconductive adhesive which improves the reaction rate at a light-shielding part and which is capable of achieving excellent conduction resistance; and a production method for a connect...
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WO/2018/181694A1 |
The present invention provides conductive particles that are capable of effectively enhancing conduction reliability. The conductive particles according to the present invention each have: a first configuration wherein the ratio of 20% K...
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WO/2018/170471A1 |
Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a chan...
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WO/2018/170371A1 |
Provided herein are novel polyaromatic compounds which, upon cure, produce high refractive index polymers. In accordance with certain aspects of the present invention, there are provided high refractive index formulations containing the ...
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WO/2018/165445A1 |
An electrically conductive adhesive composition with one or more epoxy resins, one or more nanoparticulate conductive metals having a functionalized coating, and one or more electrically conductive nanoscopic carbon materials with a coat...
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WO/2018/163921A1 |
Provided are: an anisotropic conductive adhesive in which conductive particles are able to be dispersed by a simple method, and which is capable of suppressing short-circuit between electrode terminals of an electronic component; a metho...
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WO/2018/159784A1 |
The purpose of the present invention is to provide an electrically peelable adhesive composition for producing an electrically peelable adhesive layer suitable for suppressing corrosion of a metal adherend surface. In addition, the prese...
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WO/2018/159608A1 |
Provided is an alumina-based thermally conductive oxide which has not only excellent thermal conductivity but also excellent chemical resistance, water resistance and electrical insulation properties, while exhibiting excellent kneadabil...
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WO/2018/161025A1 |
The present disclosure generally relates to ionic compositions which may be used in or as an adhesive material for selectively adhering two items together. More particularly, but not exclusively, the present disclosure relates to ionic c...
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WO/2018/156878A1 |
A nanofiber structure is described that is composed of a substrate and a layer of oriented nanofibers. Nanofibers of the layer can be oriented in a common direction. An angle of the common direction can be selected so that nanofibers of ...
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WO/2018/151139A1 |
One aspect of the present invention is an adhesive film provided with: a first adhesive layer which includes a first adhesive component, first conductive particles that are dendritic conductive particles, and second conductive particles ...
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WO/2018/151131A1 |
One aspect of the present invention is an adhesive film provided with: a first adhesive layer which includes first conductive particles that are dendritic conductive particles; and a second adhesive layer which includes second conductive...
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WO/2018/143501A1 |
The present invention relates to a method for manufacturing a fine-pitch anisotropic conductive adhesive, and a fine-pitch anisotropic conductive adhesive manufactured by the method. The method for manufacturing a fine-pitch anisotropic ...
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WO/2018/139552A1 |
According to the present invention, each one of insulation covered conductive particles comprises a conductive base material particle and insulating fine particles that cover the surface of the base material particle, and has a sparse re...
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WO/2018/138084A1 |
In a component or retaining element which is usable for the plasma processing or the thermal processing of workpieces using an electric arc, on a component that is mechanically connectable by way of a retaining element in a region formed...
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WO/2018/129899A1 |
A safe explosion-proof easy-to-disassemble adhesive tape and a preparation method therefor. The adhesive tape comprises a flame-retardant, current conducting, heat conducting, and heat-expanding pressure-sensitive adhesive layer, a flame...
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WO/2018/124578A1 |
The present invention relates to a method for preparing a hot-melt adhesive resin composition having improved thermal stability. According to the preparation method, an SBS resin and an aromatic component-added dicyclopentadiene resin ar...
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WO/2018/116813A1 |
The present invention provides: a bonding film which is capable of bonding a semiconductor element to a substrate to produce a semiconductor device having improved mechanical strength and thermal cycling characteristics; and a tape for w...
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WO/2018/118880A1 |
Conductive particles, articles including such particles, and methods of making such conductive particles, are provided; wherein the conductive particles include: a core particle including at least one of a glass, a glass-ceramic, or a me...
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WO/2018/110285A1 |
The problem that the present invention attempts to address is to provide a thin-profile electroconductive adhesive tape having exceptional adhesive strength, said thin-profile electroconductive adhesive tape allowing air bubbles to quick...
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WO/2018/110754A1 |
The present invention relates to an adhesive sheet or an adhesive tape which has an electromagnetic wave-blocking function, and provides a method for producing a UV-curable adhesive sheet in which an electromagnetic wave filler has enhan...
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WO/2018/110755A1 |
The present invention relates to an adhesive tape exhibiting electromagnetic wave absorption anisotropy by imparting orientation to an electromagnetic wave-absorbing filler, and to a method for producing the adhesive tape, and provides a...
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WO/2018/101003A1 |
Provided is an anisotropic electrically-conductive adhesive agent that has excellent heat resistance and light energy resistance. An anisotropic electrically-conductive adhesive agent for connecting a light-emitting element on an electro...
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WO/2018/101438A1 |
The purpose of the present invention is to provide: an electrode structure which is free of the problem of dryness caused by the volatilization of water or an organic solvent and is provided with an adhesive agent layer having sufficient...
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WO/2018/092671A1 |
The present invention provides: a bonding film which gives connections having sufficient heat resistance and high reliability and which facilitates a step for bonding a semiconductor element to a substrate; a tape for wafer processing; a...
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WO/2018/087858A1 |
Provided is a semiconductor-bonding resin composition that exhibits superior thermal conductivity and electrical conductivity, and is optimal for bonding a power semiconductor element and an element-supporting member. The semiconductor-b...
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WO/2018/069512A1 |
The invention relates to a thermally conductive acrylic adhesive tape, which comprises 600 - 800 parts by weight of a metal hydroxide, and 100 parts by weight of an acrylic copolymer that is based on least one alkyl (meth)acrylate and 1 ...
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WO/2018/066411A1 |
An electroconductive film which comprises a continuous release film and, disposed on the release film, a plurality of adhesive film pieces having electroconductivity. The plurality of adhesive film pieces have been arranged along the lon...
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WO/2018/053828A1 |
An adhesive agent and a preparation method therefor. The adhesive agent consists of the following formula ingredients in parts by mass: a non-diluted starch 30-40 parts, zirconium sulfate solution 3-5 parts, limonene 6-8 parts, carvone 5...
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WO/2018/053802A1 |
Disclosed herein are adhesive compositions comprising : (a) a continuous insulating binder phase, (b) a plurality of conductive particles, (c) a first particulate non-conductive phase formed of a plurality of insulating particles, and (d...
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WO/2018/051799A1 |
The purpose of the invention is, in a filler-containing film in which filler is dispersed in a resin layer, to limit filler flow due to unnecessary flow of the resin layer during pressure bonding of the filler-containing film and an obje...
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WO/2018/047598A1 |
In the past, it was necessary to add many electroconductive particles in order to improve electroconductivity, and adding many particles caused the initial viscosity to rise and made it difficult to stabilize storage stability. In the pr...
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WO/2018/047957A1 |
A conductive adhesive composition which contains at least one of a thermoplastic resin and a thermosetting resin, a conductive filler and inorganic particles. The inorganic particles have a cumulative frequency of 40% or less at the part...
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