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WO/2022/255012A1 |
Provided is an adhesive agent composition having high adhesion strength and an excellent storage life. The adhesive agent composition according to the present invention comprises a binder composition containing a cation-polymerizable com...
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WO/2022/255414A1 |
An adhesive tape 11 is a long adhesive tape 11 comprising an adhesive layer 13 on one surface side of a substrate 12, wherein a terminal part of the adhesive tape 11 does not have the adhesive layer 13, but does have an exposed area K wh...
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WO/2022/244812A1 |
A purpose of the present invention is to provide a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer which is less apt to have failures regarding transparency, appearance, or durability, exhib...
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WO/2022/224934A1 |
Provided is an adhesive composition containing a polymerizable compound, a thermal polymerization initiator, and a dicarboxylic acid diester compound.
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WO/2022/220498A1 |
The present application may provide a pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer that is applied to a flexible device to effectively cope with repeated deformation and recovery, does not cause...
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WO/2022/220285A1 |
A hardener comprising a pyridinium salt, wherein the pyridinium salt has a benzyl group at the 1-position and has an electron-attracting group at the 2-position, the benzyl group having an electron-donating group; an adhesive composition...
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WO/2022/218630A1 |
The present application is directed to a bonded structure comprising: a first substrate having an electrically conductive surface; and, a second substrate having an electrically conductive surface; wherein an electrochemically-debondable...
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WO/2022/207300A1 |
The present invention is directed to a curable and electrochemically debondable two-component (2K) adhesive composition comprising: a first component comprising: i) at least one polyol selected from the group consisting of fatty alcohols...
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WO/2022/208317A1 |
A transparent heat resistive adhesive tape with antistatic performance and a method of use thereof are provided. The adhesive tape includes at least a transparent backing film layer, an electrically conductive transparent layer disposed ...
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WO/2022/210055A1 |
The present invention pertains to an adhesive sheet having a band shape and provided with an adhesive layer, said adhesive sheet comprising a slanted part formed in a tapering shape such that the width thereof tapers toward one end of th...
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WO/2022/202560A1 |
The purpose of the present invention is to provide an electroconductive adhesive layer which has excellent connection stability between adherends that are electroconductive members and which, even at high temperatures, retains the connec...
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WO/2022/202479A1 |
The present invention provides an electrically debondable adhesive sheet that includes a conductive substrate having a support body, an intermediate layer, and a conduction layer in the stated order, with an electrically debondable first...
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WO/2022/200534A1 |
The present invention relates to a composition comprising an oligo(ethylene glycol)-based polymers microgel crosslinked with a catechol cross-linker, said microgel comprises microgel particles, and wherein the microgel particles have a s...
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WO/2022/202505A1 |
This electrically conductive resin composition contains (A) silver-containing particles, (B) a (meth)acrylic compound, and (C) at least one polyfunctional epoxy compound selected from compounds represented by general formula (1).
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WO/2022/196328A1 |
Provided are: a resin composition which has a low modulus, can cure at low temperatures, and has a long pot-life and which is useful as electroconductive adhesives, materials for mounting components, sealants for protecting components, a...
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WO/2022/191109A1 |
A bonding sheet according to the present invention contains a matrix resin, solder particles, and a flux agent. With respect to this bonding sheet, the solder particles are dispersed in the matrix resin, and the flux agent is unevenly di...
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WO/2022/188504A1 |
The present application relates to the field of conductive adhesives, and specifically relates to a heat-cured conductive adhesive and a preparation method therefor. The preparation method for the heat-cured conductive adhesive mainly co...
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WO/2022/191212A1 |
This anticorrosion adhesive tape of the present invention is provided with an adhesive layer, does not generate rust in a cyclic corrosion test complying with a cycle D in JIS K5600-7-9, and has adhesion of 20N/25 mm or more after the cy...
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WO/2022/191110A1 |
A bonding sheet according to the present invention contains a matrix resin, solder particles and a flux agent. This bonding sheet has a surface that has a surface roughness Sa of 2.5 μm or less.
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WO/2022/168916A1 |
The present invention pertains to: an adhesive composition that contains a base polymer and a material discolored by water or water vapor; an adhesive sheet that includes an adhesive layer composed of said adhesive composition; a method ...
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WO/2022/158091A1 |
This piezoelectric oscillator comprises a piezoelectric vibrating element having an excitation electrode and a connection electrode electrically connected to the excitation electrode, a base member having an electrode pad, and a conducti...
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WO/2022/158594A1 |
Provided is a film-like adhesive 1 for connecting a circuit, the film-like adhesive 1 containing: solder particles 2 having a Bi content of 20-60 mass% and an Sn content of 40-80 mass%; a radically polymerizable compound; and a thermal r...
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WO/2022/145935A1 |
The present invention relates to an aqueous flame retardant adhesive composition and a method for preparing same, wherein the adhesive composition is eco-friendly and can reduce costs through replacement of an organic flame retardant, am...
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WO/2022/135994A1 |
The invention relates to a method for producing an adhesive connection (100) between a first component (1) and a second component (2). The first component (1) has at least one cavity (10), and the second component (2) has at least one pi...
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WO/2022/138747A1 |
This method for manufacturing a circuit connection structure comprises: a step for preparing an adhesive film for circuit connection, which includes a first adhesive layer containing conductive particles and a second adhesive layer provi...
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WO/2022/139222A1 |
The present invention relates to a self-adhesive fire-extinguishing tape comprising fire-extinguishing microcapsules, and a fire-extinguishing product using same, wherein, more specifically, the fire-extinguishing tape has self-adhesive ...
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WO/2022/140407A1 |
An encapsulated adhesive for inserting into a cavity having a first volume and a method of making the encapsulated adhesive are presented. The encapsulated adhesive includes an adhesive material of a second volume, and a non-adhesive enc...
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WO/2022/140589A1 |
A microfiber array comprising a plurality of fibers with roughened tips, where the microfiber array is adapted to provide enhanced grip to the surface of a semiconductor device and other smooth, flat objects. The microfiber array provide...
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WO/2022/123999A1 |
This conductive adhesive film includes a support body and a conductive layer; the conductive layer contains a thermosetting resin composition, and the thermosetting resin composition contains (a) an epoxy resin, (b) a polymer resin that ...
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WO/2022/122964A1 |
The present invention relates to absorbent articles comprising an absorbent core wherein absorbent material is contained within at least one core wrap substrate enclosing said absorbent material, and wherein a top layer of said core wrap...
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WO/2022/119083A1 |
An electronic device according to various embodiments disclosed herein comprises: a display panel; a first window disposed on the display panel; a second window that is smaller than the first window and is disposed on the display panel s...
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WO/2022/119135A1 |
Various embodiments of the present invention relate to an electronic device comprising a discharge structure for connecting static electricity to ground, wherein a flexible display disposed in a first housing and a second housing may com...
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WO/2022/114894A1 |
The present invention relates to an epoxy-curing electrically conductive adhesive capable of high-temperature detachment, and a solar cell module using same. More specifically, the present invention relates to: a solvent-free conductive ...
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WO/2022/114647A1 |
Various embodiments of the present invention relate to an electronic device comprising a rollable display, the electronic device comprising: a first housing; a second housing; a rollable display having a display area that is adjusted in ...
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WO/2022/114494A1 |
An electronic device according to various embodiments of the present disclosure comprises: a housing including a first housing, and a second housing accommodating at least a portion of the first housing and guiding a sliding movement of ...
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WO/2022/108055A1 |
An electronic device according to an embodiment of the present invention comprises: a window; a display panel arranged under the window; and a cushion member arranged under the display panel, wherein the cushion member includes a barrier...
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WO/2022/108198A1 |
Disclosed is an electronic device. The electronic device comprises: a housing; and a display module disposed in the housing, the display module including a substantially planar flat region and a curved region extending from an edge of th...
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WO/2022/102672A1 |
A method of manufacturing an adhesive film for circuit connection, the method comprising: preparing a substrate having a plurality of recesses on a surface thereof and having conductive particles in at least a portion of the plurality of...
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WO/2022/098058A1 |
An electronic device according to various embodiments of the present disclosure comprises a housing, and a display visible from the outside of the electronic device, wherein the display includes: a plurality of layers of which at least o...
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WO/2022/097940A1 |
According to various embodiments, the electronic device may comprise: a first housing including a first support member; a second housing foldably coupled to the first housing; a flexible display including a display panel disposed to be s...
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WO/2022/097955A1 |
An electronic device according to various embodiments of the present disclosure may comprise: a first housing; a second housing which accommodates at least a part of the first housing and guides a sliding movement of the first housing; a...
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WO/2022/098844A1 |
Some embodiments of the present disclosure relate to an adhesive formulation comprising a high viscosity silyl modified polymer. In some embodiments, the adhesive formulation may further comprise additional components, such as but not li...
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WO/2022/098159A1 |
An electronic device according to various embodiments of the present disclosure may comprise a housing, a flexible display, and a roller part. The flexible display may comprise a first part, a second part extending from the first part in...
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WO/2022/092047A1 |
Provided is an electrically conductive adhesive able to achieve good solder wettability and electrical conductivity. Also provided are: an anisotropic electrically conductive film which can achieve good solder wettability, electrical con...
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WO/2022/082251A1 |
Tape for mitigating passive intermodulation, the tape including: a metalized polymer substrate; an adhesive layer bonded to a first face of the substrate; and, a plurality of apertures extending through the substrate and the adhesive lay...
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WO/2022/085915A1 |
Disclosed is an electronic apparatus comprising: a display panel having a folded state and an unfolded state; glass arranged in a first direction in which the front side of the display panel faces; a protective layer arranged in the firs...
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WO/2022/085563A1 |
A resin composition comprising a polyester-polyurethane resin (A) and an epoxy resin (B), in which an isocyante component constituting the polyester-polyurethane resin (A) comprises an isocynate compound that has a hydrocarbon group havi...
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WO/2022/080712A1 |
Various embodiments of the present invention comprise a speaker module, a display having at least a portion disposed on the speaker module, and a rear plate having at least a portion disposed beneath the speaker module, wherein the speak...
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WO/2022/080618A1 |
The present disclosure relates to a display device comprising a piezoelectric film-type actuator, and having a structure in which a groove is provided on a rear metal layer for supporting and sealing a rear surface of a display panel, an...
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WO/2022/080885A1 |
Various embodiments of the present disclosure relate to an electronic device and, more particularly, to the internal structure of an electronic device including a flexible display. An embodiment may provide an electronic device comprisin...
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