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WO/2012/053668A1 |
The present invention relates to an electrode structure including a plurality of electrode plates having a flat shape. The electrode plates are spaced apart from each other by insulating washers, and are coupled together by insulating co...
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WO/2012/047102A2 |
The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the ...
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WO/2012/047316A1 |
The invention relates generally to carbon nano-tube composites and particularly to carbon nano-tube compositions for electrochemical energy storage devices and a method for making the same.
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WO/2012/043514A1 |
Provided are a cylinder plating method and device with which it is possible to form a plating layer of uniform thickness using cylinder plating technology, and in addition to combine with plating technology that uses a divided insoluble ...
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WO/2012/043513A1 |
Provided is an apparatus for plating a cylinder, wherein service life of the whole apparatus can be improved with a technology of plating a cylinder, hardness nonuniformity of the plating layer on the cylinder surface can be eliminated b...
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WO/2012/039817A2 |
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body (102 and 202) on which the substrates are held, and conductive lines (128) ar...
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WO/2012/035763A1 |
The present invention provides an apparatus for continuous electrolytic treatment of a steel sheet and a method of producing a surface treated steal sheet using the apparatus. The steel sheet is suitable for producing a surface-treated s...
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WO/2012/036196A1 |
The purpose of the present invention is to provide an electrolysis electrode used in electrolytic oxidation reactions, the electrode having a high oxygen overvoltage and extended service life. The electrolysis electrode has an electrode ...
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WO/2012/031753A1 |
The invention relates to an anode and to the use thereof in an alkaline electroplating bath. In the application in electroplating, said anode is suitable for use in highly alkaline electroplating electrolytes based on sodium hydroxide or...
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WO/2012/024438A2 |
Embodiments of the inventions provide methods and apparatus to electroplate films of tellurides such as CdTe, or its alloys on multiple large area workpieces. In one embodiment a method of forming a solar cell absorber film on multiplewo...
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WO/2012/021695A2 |
An electroplating apparatus having improved contact deplating features includes a bowl assembly (26) having a bowl (30) for holding an electroplating solution. A head (22) having a rotor (34) including a contact ring (40) and a head moto...
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WO/2012/013362A1 |
The invention relates to a device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment. The device comprises a flow distributor body (1) which is disposed, with the front...
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WO/2012/014774A1 |
Disclosed is a manufacturing device for a nanoimprint mold, wherein said device anodises an aluminium substrate with electrolytic solution, and which is characterised in that at least the material on the surface of a portion which comes ...
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WO/2012/011727A2 |
The present invention relates to an electroplating apparatus comprising: a plating vessel for accommodating an electrolyte containing ions of the metal to be plated; an electrolyte spraying part for receiving the electrolyte and spraying...
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WO/2012/007524A1 |
A chuck (100) for holding a substrate or master electrode in an ECPR process is provided. The chuck comprises an interaction surface (101) for holding a master electrode or a substrate; a buffer surface (102) circumferentially of the int...
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WO/2012/007521A1 |
A contact sheet (100) for making electrical contact to a master electrode in an ECPR process is provided. Said contact sheet (100) has a first proximal side (101) and a second distal side (102). The contact sheet (100) comprises an insul...
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WO/2012/007520A1 |
A chuck (100, 200, 500) for holding a master electrode (107, 207) or a substrate (111, 211) during an ECPR process is provided. The chuck comprises an interaction surface (102, 201) onto which the master electrode (107, 207) or the subst...
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WO/2012/007523A1 |
A chuck for holding a substrate or master electrode in an ECPR process is provided. The chuck has a proximal and a distal end, and comprises an interaction surface (205) for holding the substrate or master electrode positioned in a first...
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WO/2011/156676A2 |
Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles ma...
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WO/2011/148685A1 |
Disclosed is a surface treatment apparatus that is provided with: either one of a positive electrode member and a negative electrode member, which are electrically connected to a metallic subject to be treated, said subject having, on th...
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WO/2011/149144A1 |
Provided is a dangler assembly for use in a plating barrel, which includes a wire, a connecting terminal electrically connected to a part at one end of the wire and an electrode terminal electrically connected to a part at the other end ...
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WO/2011/145033A1 |
A method for anodising a profiled section (8) of aluminium or alloys thereof comprising the following steps : - electrically connecting a negative pole of a direct current generator (7) to a cathode (5) and a positive pole of the direct ...
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WO/2011/139893A1 |
A hydrogen generating system includes a cell box defining an interior chamber and an electrolyte solution contained within the interior chamber. An electrode plate assembly is disposed in the interior chamber and at least in part is subm...
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WO/2011/125336A1 |
In order to form at high speed an anodic oxidation film as an insulating layer on one side of a metal substrate, an anodic oxidation device is configured to comprise: a power supply drum (2) that supports through close contact a band-sha...
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WO/2011/122493A1 |
Disclosed are a high-purity copper anode for electroplating that can reduce the generation of slime and other particles and plating failure caused thereby, a method for producing the same, and a copper electroplating method using the sam...
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WO/2011/121240A1 |
Arranged in the bath (3) contained in a tank (2) are respectively an anodic electrode (5) and a cathodic electrode (6), which are connected to an electric current generator (4). Advantageously, said cathodic electrode (6) is composed of ...
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WO/2011/119818A1 |
An apparatus and method for the synthesis and treatment of electrocatalyst particles in batch or continuous fashion is provided. In one embodiment, the apparatus is comprised of a three-electrode cell which includes a reference electrode...
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WO/2011/109020A1 |
Electrochemical nitridation of metals and the produced metals are disclosed. An exemplary method of electrochemical nitridation of metals comprises providing an electrochemical solution at low temperature. The method also comprises provi...
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WO/2011/105072A1 |
A substrate treating apparatus (1) is provided with: a bath (11) wherein a substrate treatment solution (TL) is supplied thereto, and a substrate (PB) is immersed in the supplied substrate treatment solution (TL); and a holding section (...
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WO/2011/099426A1 |
Disclosed is a pure copper plate production method wherein post-hot-forging and post-hot-rolling cold forging and cold rolling, and subsequent heat processing are unnecessary. Further disclosed is a pure copper plate having a fine struct...
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WO/2011/099427A1 |
Disclosed is a production method for a pure copper plate having a fine crystal structure, a suitable hardness, and a high special grain boundary length ratio. Further disclosed is a pure copper plate which is obtained according to the di...
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WO/2011/094886A1 |
In the electroplating of metals, the use of anodes having surfaces that have been increased by means of protuberances on the faces thereof increases the possibility of short-circuits occurring by reducing the anode-cathode distance, said...
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WO/2011/093023A1 |
An electrolytic plating device (2) is provided with: a cathode (20) which is connected to an electroconductive layer (12); an anode (21) which is arranged below a substrate (1) so as to face the other surface of the substrate (1); and an...
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WO/2011/092160A1 |
The anodizing treatment station (3) in a vertical pain plant (2) of aluminium profiles hanging in succession by means of hooks (8) on a main overhead conveyor (4) moving along a main conveyor line (5) which passes through at least one pr...
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WO/2011/089005A1 |
The invention relates to a lateral profile section for an electrode for the electrolytic deposition of metals, wherein the lateral profile section is designed such that it encloses the electrode at the edge. In order to provide a lateral...
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WO/2011/086978A1 |
Disclosed are a phosphorus-containing copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using this all for enabling reduction of the plating defectives due to the...
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WO/2011/086089A1 |
The invention relates to a tool for galvanically coating sliding bearings comprising at least one cover (34), to which a thief (36) is attached.
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WO/2011/080485A1 |
According to the invention, the following elements are provided: a blade (120, 130) forming the cathode and having a surface to be coated defining a critical area (21), an anode (19), an electrolyte bath including insoluble particles, an...
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WO/2011/069683A1 |
The invention relates to a method and to an equipment for restoring a portion (11) of a metal body (1), said equipment including: an anode; a cathode; a current generator (7) for electrolysis between the cathode and the anode that can be...
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WO/2011/066824A1 |
The invention relates to the electrical contacting of band-shaped or plate-shaped material (1), which can be conveyed through an electroplating system on a transport track. The cathodically polarized contact means (6) are located, for ex...
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WO/2011/054037A1 |
A light induced plating system (LIP) for creating front contacts on a photovoltaic is disclosed. The system involves the use of a patterned metal electrode with a plurality of raised contact areas that are in electrical contact with elec...
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WO/2011/049086A1 |
A barrel plating device capable of providing a satisfactory plating film irrespective of the quantity of objects to be plated. A barrel plating device (1) comprises: a barrel (4) which contains therein objects to be plated and has a nega...
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WO/2011/049066A1 |
A barrel electroplating method is provided in which a deposition failure and an adhesion failure such as blistering or delamination are less apt to occur regardless of the amount of a work to be plated and it is possible to obtain an eve...
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WO/2011/039596A1 |
A surface preparation unit for metal strips processing lines comprises a tank (12), suitable to contain an electrolyte solution, a system for the suspension/submersion of a strip (11) to be treated, which is continuously fed into the tan...
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WO/2011/033303A2 |
Electrolytic process apparatus comprises a voltage source for electrically coupling to first and second electrodes, a detection circuit electrically coupled to the voltage source and a guard for providing a barrier between the first and ...
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WO/2011/031494A2 |
A discrete sacrificial zinc anode is fabricated from one or more slotted and slatted metal plates. The plates are fixed in a parallel planar configuration using conventional fasteners. One or more electrical connection wires are formed w...
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WO/2011/030945A1 |
The present invention relates to an electrolytic bath which is configured so as to effectively electrodeposit recyclable valuable metals from electroplating waste water or waste water containing valuable metals to recover the same, and m...
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WO/2011/027612A1 |
Provided is a device for treating the inner surface of a cylinder barrel. A cover member (32) is provided, at the lower surface (59) thereof, with seal rings (54, 55, 56). The seal rings (54, 55, 56) are disposed concentrically about the...
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WO/2011/026696A1 |
The present invention provides a system for electrochemically processing non-flat samples (1) and/or samples that can change shape during the electrochemical processing. The system comprises a sample holder for providing an electrical co...
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WO/2011/027528A1 |
Disclosed is a plating device which makes it possible to effectively form a plated layer of uniform thickness on base particles having an electrically conductive surface. The plating device is a device for plating base particles having a...
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