| Document |
Document Title |
|
WO/2021/227853A1 |
Provided are an electrode structure used in an electrochemical deposition device. The electrode structure comprises: a support frame; and a metal mesh and a plurality of conductive strips arranged on the support frame, wherein the conduc...
|
|
WO/2021/228604A1 |
The disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate, an electrochemical deposition system for a chemical and/or electrolytic surface treatment of...
|
|
WO/2021/225259A1 |
The present invention relates to a multilayer copper foil, a method for manufacturing same, and an electroplating apparatus therefor. A multilayer copper foil according to an aspect of the present invention comprises: a recrystallization...
|
|
WO/2021/225821A1 |
An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtua...
|
|
WO/2021/215939A1 |
In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period t...
|
|
WO/2021/202392A1 |
An apparatus and method of adjusting a plating solution are described. Suppressor is added to the plating solution until a comparison to reference data of an RDE potential taken at a first time during a constant current experiment indica...
|
|
WO/2021/199468A1 |
The purpose of the present invention is to provide: a laminate which does not contain hexavalent chromium and has excellent corrosion resistance and abrasion resistance; and a laminate manufacturing method. To achieve the purpose, a lami...
|
|
WO/2021/190804A1 |
The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate. The method for a chemic...
|
|
WO/2021/190250A1 |
An electrochemical deposition device, comprising: a first tank body (10), the first tank body (10) being used for performing electrochemical deposition, an anode (101) and a cathode (102) which are provided oppositely to each other at in...
|
|
WO/2021/184114A1 |
An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits ...
|
|
WO/2021/170851A1 |
The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a subst...
|
|
WO/2021/164894A1 |
The invention relates to an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, a module for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of th...
|
|
WO/2021/156415A1 |
An electrode for an apparatus (1) for electrolytically treating a workpiece (3), the apparatus (1) being of a type arranged to convey the workpiece (3) with a surface to be treated past and directed towards a surface of the electrode, is...
|
|
WO/2021/140857A1 |
A surface treatment device (1) having: a jig (10) for holding a workpiece (W) so as to surround the peripheral edge thereof, the workpiece (W) having a first main surface (WF) and a second main surface (WB) as surfaces to be treated; a s...
|
|
WO/2021/140688A1 |
Provided are: composite plated materials in which a composite plating layer formed from a composite material in which carbon particles are contained within an Ag layer is formed on a base material, the composite plated material being suc...
|
|
WO/2021/133013A2 |
The present invention relates to a system for electrochemically treating a surface of a base material. The surface treatment system comprises: an electrochemical surface treatment unit that electrochemically treats the surface of the bas...
|
|
WO/2021/123059A1 |
The present inventions refers to a method for reducing the concentration of iron ions in a trivalent chromium electroplating bath, the method comprising the following steps: (i) providing the trivalent chromium electroplating bath compri...
|
|
WO/2021/123129A1 |
The present invention is directed to a method for depositing a zinc-nickel alloy on a substrate, the method comprising the steps: (a) providing the substrate, (b) providing an aqueous zinc-nickel deposition bath as a catholyte in a depos...
|
|
WO/2021/110567A1 |
This invention relates to a rinsing apparatus for use in a metal strip processing line and to a method of using said rinsing apparatus.
|
|
WO/2021/110822A1 |
The invention relates to the field of metal ion capture, and more particularly the selective capture of Ni(ll) nickel ions, by a polymeric compound made from a polymer chosen from the styrene polymers and the chloropolymers. In the polym...
|
|
WO/2021/107100A1 |
This method of manufacturing a plated member comprises a plating step for plating a member to be plated while jetting and stirring the member together with an electrolytic solution from a bottom part to the upper side, inside a basket of...
|
|
WO/2021/106920A1 |
A method for suppressing a biofilm, said method being characterized by irradiating ultrasonic waves having a frequency of from 20 kHz to 100 kHz within a plating tank, a recovery tank and a water washing tank, which are used for a wet pl...
|
|
WO/2021/099389A1 |
The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process flui...
|
|
WO/2021/066413A1 |
The present invention relates to a measuring method, an electrochemical measurement cell, and a measurement apparatus, wherein the concentration of monovalent copper ion (Cu+), 3-mercaptopropyl sulfonate (MPS), or Cu+-MPS, which is a deg...
|
|
WO/2021/057475A1 |
Embodiments of the present application provide an electroplating anode and an electroplating method using same. An electroplating anode and a cathode awaiting electroplating form an electric field so as to form an electroplated layer on ...
|
|
WO/2021/048184A1 |
The invention relates to the field of liquid phase synthesis of diamond or all other allotropic forms of carbon and more particularly to a method for liquid phase synthesis of carbonaceous films, according to which a voltage is applied, ...
|
|
WO/2021/024548A1 |
Provided is a substrate processing apparatus capable of reducing the outflow rate of a liquid from a processing tank during the transportation of a substrate holder. A substrate processing apparatus 100 according to the present inventi...
|
|
WO/2021/019862A1 |
The present invention provides a method for producing an aqueous tin methanesulfonate solution by dissolving tin (II) oxide in an aqueous methanesulfonic acid solution, wherein if A is the number of moles of the tin (II) oxide and B is t...
|
|
WO/2020/263795A1 |
Systems and methods for electroplating are provided. An electroplating system may include an electroplating cell configured to contain an anode and an electroplating solution, a wafer holder configured to support a wafer within the elect...
|
|
WO/2020/250696A1 |
Proposed are an anode holder and plating device such that depletion of additives on the plating device can be suppressed. The anode holder, which is for holding an anode used in a plating device, is provided with: an internal space whi...
|
|
WO/2020/250650A1 |
A method for performing plating, the method including: a step in which a substrate having different patterns on a first surface and a second surface thereof is prepared; a plating step in which currents having a first plating current den...
|
|
WO/2020/242838A1 |
An electrochemical deposition system includes: an electrochemical deposition chamber including an electrolyte for electrochemical deposition; a substrate holder configured to hold a substrate and including a first cathode that is electri...
|
|
WO/2020/236497A1 |
In one example, the disclosed apparatus is a substrate contact-ring to support a substrate. The substrate contact-ring includes a peripheral structure sized and configured to support the substrate within the substrate contact-ring. The p...
|
|
WO/2020/235406A1 |
The present invention provides a plating method whereby consumption of an additive in a plating solution can be suppressed during plating of a substrate having a via or hole for forming a through electrode, and provides an insoluble anod...
|
|
WO/2020/230036A1 |
Galvanic tank (100) with double casing adapted to contain leaks of toxic fluids, comprising: - external casing (20) with suction hole (22), connected to a suction duct (45) which, by means of a common suction pump (44), suctions air from...
|
|
WO/2020/226116A1 |
This structure is provided with a copper plating layer or copper alloy plating layer in which formation of a Kirkendall void is suppressed. The copper plating layer or copper alloy plating layer is formed by carrying out an electroplatin...
|
|
WO/2020/217796A1 |
Provided is an anode holder with which a valve can be operated without using a link mechanism. This anode holder has: an internal space that is formed inside the anode holder and is for accommodating an anode; a diaphragm configured to...
|
|
WO/2020/216410A1 |
The invention relates to a temperature treatment stage (100) for treating a fluid, in particular for thermally treating a treatment fluid (512) of a treatment device (510) for treating components, comprising a cooling stage (200) and a h...
|
|
WO/2020/191958A1 |
Disclosed is an electroplated board deplating apparatus, comprising multiple clamps arranged in sequence, and a transport mechanism used to support and drive motion of the multiple clamps, and further comprising a first fixing frame and ...
|
|
WO/2020/184289A1 |
This microporous plating solution, characterized by containing non-conductive particles and polyaluminum chloride, allows for easy preparation of positively charged nonconductive particles and is safe. Also, this method for performing mi...
|
|
WO/2020/175352A1 |
A high-concentration aqueous tin sulfonate solution according to the present invention has a bivalent tin ion (Sn2+) concentration of 360 to 420 g/L, a tetravalent tin ion (Sn4+) concentration of 10 g/L or less, a free methanesulfonic ac...
|
|
WO/2020/175934A1 |
An anodizing device is disclosed. The anodizing device according to an embodiment of the present invention may comprise: a base for supporting a product to be anodized, the product having a first bore for which an anodizing surface treat...
|
|
WO/2020/168881A1 |
Disclosed are a device and a method for fine electrodeposition by means of a laser assisted flexible following tool electrode, which relate to the technical field of localized fine electrodeposition. The method comprises: enhancing local...
|
|
WO/2020/158567A1 |
A workpiece-holding jig (30), which can hold a workpiece (20) having a surface to be processed and can electrically connect to a rectifier that controls voltage so as to conduct a constant current, wherein a conductive member that can el...
|
|
WO/2020/158570A1 |
A workpiece holding jig (30), which holds a workpiece (20) having a surface to be processed so as to hang down and is capable of being electrically connected to a rectifier, comprises: a conductive upper clamping part (510) that clamps t...
|
|
WO/2020/158568A1 |
A workpiece holding jig (30), which is capable of holding a workpiece having a surface to be processed and being electrically connected to a rectifier, comprises: at least one conductive support part (521, 522) that can conduct a current...
|
|
WO/2020/158569A1 |
A workpiece holding jig (30), which holds a workpiece (20) so as to hang down and can electrically connect to a rectifier, comprises support parts (531, 532) that can conduct power in conjunction with the rectifier, and conductive clamps...
|
|
WO/2020/152208A1 |
The present invention is related to a membrane anode system for electrolytic zinc-nickel alloy deposition, a method for electrolytic deposition of a zinc- nickel alloy layer on a substrate to be treated using a membrane anode system, and...
|
|
WO/2020/138051A1 |
A plating solution purification filter according to one aspect of the present invention comprises a molded body that contains an adsorbent constituted by activated carbon and that has an iodine adsorption capacity per unit of mass of 930...
|
|
WO/2020/138321A1 |
The present invention pertains to a metal sheet comprising a plurality of plated parts, a frame part, and a linking part linking the plated parts and the frame part, wherein the plurality of plated parts, the frame part, and the linking ...
|
