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WO/2020/129145A1 |
[Problem] To provide a plating apparatus and plating method whereby plating treatment can be satisfactorily performed even when a long sheet as the material to be plated has a large electrical resistance, and also whereby adhesion of a m...
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WO/2020/120537A1 |
A method for depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps (a) providing an aqueous deposition bath with a pH in the range from 4.1 to 6.9, the bath comprising - trivalent chromi...
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WO/2020/114000A1 |
A water retaining device and a vertical electroplating device, comprising a fixing frame (2), a water blocking component (5), a gear set, a transmission shaft (4), a rotating component (3) and transmission guide rods (6); the fixing fram...
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WO/2020/099947A1 |
An electroplating device (1) and an electroplating method. The electroplating device (1) comprises a tank body (10), a carrying unit (11), and an anode unit (12). The tank body (10) stores an electroplating liquid (2). The carrying unit ...
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WO/2020/083414A1 |
The invention relates to a method for coating substrate surfaces with a metal or oxidic layer, wherein the coating bath has at least one component, the concentration of which changes in the course of the coating process and which is ther...
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WO/2020/078598A1 |
The subject matter of this invention is a method for the continuous electrolytic chromium plating of a metal strip (12) in an aqueous electrolyte (19) with trivalent chromium, wherein the trivalent chromium is fed to the electrolyte (19)...
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WO/2020/074541A1 |
Method for etching or plating a component, comprising the steps of: - etching or plating a component preliminary placed into an etching or plating tank, with a solution containing at least one transition metal, such as manganese, - prior...
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WO/2020/075173A1 |
The invention relates to a process and a system for 3-dimentional (3D) fabrication of sub-micron structures and is established by local electrochemical deposition methods.
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WO/2020/072783A1 |
A metallic electrode comprises an electroactive material comprising zinc, aluminum, lithium, magnesium, silver, brass, copper, stainless steel, nickel, selenium, or any combination thereof, and an additive comprising a metal selected fro...
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WO/2020/069631A1 |
A device for distributing electrolyte from the base of the cell comprising an inlet for the electrolyte via an elbow (1), a flexible tube (2), an inlet tube (4), a triple distributor (5), two lateral linear tubes (7) and a central linear...
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WO/2020/067622A1 |
Disclosed is a method comprising the steps of: preparing an electrolyte containing a metal oxide active material precursor; and forming a metal oxide coating layer by loading a titanium (Ti) substrate into the electrolyte, wherein the me...
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WO/2020/050024A1 |
In the present invention, an imaging unit (103) images the surface of a member being processed by a surface processing unit (102). A comparison unit (104) determines the correlation coefficient between a reference image stored by a stora...
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WO/2020/050009A1 |
The present invention relates to a substrate processing device for processing a substrate using a processing fluid. The substrate processing device according to an embodiment is provided with: a support unit which has a mounting surface ...
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WO/2020/042870A1 |
A production method for the electroplating solution or the electroplating supplement solution in an insoluble anode acid copper electroplating process, comprising the following steps: 1) providing an electrolytic cell and using an electr...
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WO/2020/039856A1 |
The present invention pertains to a copper oxide solid used for plating a substrate using an insoluble anode. The present invention further pertains to a method for producing the copper oxide solid. The present invention further pertains...
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WO/2020/032476A1 |
An electroplating system according to one embodiment of the present invention, which has a constant current control function and includes a reservoir having a plating solution received therein, may comprise: a power source; a positive el...
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WO/2020/026745A1 |
The stannous oxide is stannous oxide having an α-ray emission level of 0.002 cph/cm2 or less after being heated for six hours at 100°C in air. Tin containing lead as an impurity is dissolved in a sulfuric acid aqueous solution to prepa...
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WO/2020/025090A1 |
The invention relates to a flow generator (2a, 2b), which has an electrolyte feed device (12) for feeding an electrolyte (7), and an electrolyte distribution device (13). The invention also relates to a deposition device (1, 33, 35) havi...
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WO/2020/021782A1 |
A tin(II) oxide powder comprising tin(II) oxide and unavoidable impurities, wherein the content of tin(II) oxide is 99.9% by mass or more in terms of dried mass, the specific surface area is 0.1 to 1.0 m2/g, the TAP density is 2 to 4 g/c...
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WO/2020/015672A1 |
The present application provides an electroplating device and an electroplating apparatus. The electroplating device comprises a driving mechanism, a mounting part drivingly connected to the driving mechanism and made of a conductive mat...
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WO/2020/015674A1 |
A transmission structure and an electroplating device. The transmission structure comprises a linear track (11), a mounting member (15) for mounting a circuit board, and at least one roller (16) that is connected to the mounting member (...
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WO/2020/014423A1 |
Electroplating results can be improved by dynamically controlling the pressure in different parts of an electroplating apparatus. For example, a number of plating problems can be avoided by ensuring that the pressure in an anode chamber ...
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WO/2020/009161A1 |
Provided is a double-pipe-structure pressure contact roll having an outer tube member made from at least a carbon-fiber-reinforced resin, wherein the pressure contact roll is configured so that a metal plating layer is uniformly and firm...
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WO/2019/242034A1 |
Provided are a device and system for automatically controlling the thickness of an electroformed coating. The device comprises an electroforming cylinder (1), a rack-plating bracket (2), a controller (3) and a current detection unit (4)....
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WO/2019/214879A1 |
The invention relates to an electrode (10) for eloxing a component (50), in particular a component (50) of a vehicle brake system, comprising an electrolyte inlet (14) for feeding an electrolyte into the electrode (10), an inlet channel ...
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WO/2019/217673A1 |
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...
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WO/2019/216012A1 |
A printed wiring board according to an embodiment of the present disclosure comprises an insulating base film and a conductive pattern that is laminated upon at least one surface of the base film and that includes a plurality of parallel...
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WO/2019/212930A1 |
An electroplating apparatus includes an electrode at the bottom of a chamber, an ionically resistive element with through holes arranged horizontally at the top of the chamber, with a membrane in the middle. One or more panels extend ver...
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WO/2019/204513A1 |
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...
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WO/2019/191636A1 |
Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing ...
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WO/2019/178707A1 |
The invention relates to an electrochemical reactor for continuous copper electrodeposition at high current densities with copper sulfate electrolytes, which comprises devices and systems of functional means that are linked and operated ...
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WO/2019/181179A1 |
This plating treatment device forms a plating layer on the surface of an article to be plated by immersing the article to be plated in a plating liquid, the plating treatment device comprising: a plating tank for storing the plating liqu...
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WO/2019/176586A1 |
Provided is a current collecting member for a cylinder body plating apparatus, which is used at the base end of the spindle of a chuck cone, thereby making it possible to plate a sliding surface without oiling and to prevent efficiently ...
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WO/2019/175990A1 |
Provided is a plating device capable of appropriately measuring microthrowing power. A first plating device (1A) is provided with: a first positive electrode (12A) provided inside a first plating tank (11A); an insulating substrate (4), ...
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WO/2019/164920A1 |
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. An inert anode (or an auxiliary electrode that can act as inert anode when needed)...
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WO/2019/162026A1 |
A station (1) for the localised surface treatment of an industrial component (2) to be treated, comprising a system (6) for applying a vacuum in the treatment chamber (5) and the feed and drain circuit (22, 23) making it possible to feed...
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WO/2019/156514A1 |
A sulfur powder, a sulfur electrode, a battery comprising same, and a manufacturing method therefor are disclosed. The manufacturing method of a sulfur powder comprises the steps of: positioning an electrode plate connected to an anode o...
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WO/2019/152555A1 |
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...
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WO/2019/148107A1 |
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...
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WO/2019/138818A1 |
The electroplating device according to one embodiment of the present invention has: a mounting part 21 which, when mounted to a box-like object 13, forms a sealed space 22 together with the box-like object 13; a plating solution containe...
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WO/2019/132205A1 |
The purpose of the present invention is to provide an electroforming apparatus capable of manufacturing products which have uniform alloy components. One embodiment provides an electroforming apparatus comprising: a rotary cathode, forme...
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WO/2019/130859A1 |
Provided is a method for producing a photoelectric conversion element, which improves the production efficiency. The present invention is a method for producing a photoelectric conversion element that comprises a photoelectric conversion...
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WO/2019/133305A1 |
In one example, an electroplating system comprising a bath reservoir having a first inlet for feeding fresh electrolyte solution into the bath reservoir and a first outlet for bleeding used electrolyte solution out of the bath reservoir,...
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WO/2019/119820A1 |
Disclosed is an electroplating transmission system. The electroplating transmission system comprising: a fixed bracket; two steel wheels rotatably mounted on the fixed bracket; a conveyor belt made of an electrically conductive material,...
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WO/2019/119807A1 |
Disclosed is a coil-type vertical continuous electroplating production line, comprising a machine frame; an uncoiling mechanism, a process tank and a coiling mechanism successively provided on the machine frame; and a fixed portion and a...
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WO/2019/116633A1 |
This method for producing a porous metallic body comprises: a step for obtaining an electroconductive porous resin body having an electroconductive layer by making conductive the surface of a skeleton of a sheet-shaped porous resin body,...
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WO/2019/116632A1 |
This method for producing a porous metallic body comprises: a step for obtaining an electroconductive porous resin body having an electroconductive layer by making conductive the surface of a skeleton of a sheet-shaped porous resin body,...
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WO/2019/102867A1 |
An apparatus for producing a semiconductor device, which comprises: a substrate holding unit which holds a substrate; a treatment liquid supply unit which supplies a treatment liquid to the substrate that is held by the substrate holding...
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WO/2019/102866A1 |
An apparatus for producing a semiconductor device, which comprises: a substrate holding unit which holds a substrate; an electrolytic treatment unit which performs an electrolytic treatment on the substrate that is held by the substrate ...
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WO/2019/089282A1 |
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating s...
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