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WO/2022/244828A1 |
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and a high shear strength in the processing of a copper-clad laminate or in the production of a printed wiring board. This roughened cop...
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WO/2022/244827A1 |
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high shear strength in processing of a copper-clad laminate or manufacturing of a printed wiring board. This roughened copper foil h...
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WO/2022/244772A1 |
According to the present invention, a base steel sheet containing 0.50-3.00 mass% of Si is subjected to Fe-based electroplating by using an Fe-based electroplating solution containing Fe ions and transition metal ions other than Fe ions ...
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WO/2022/244826A1 |
Provided is a roughened copper foil capable of realizing both excellent transmission properties and high shear strength, in the processing of a copper-clad laminate or the production of a printed wiring board. This roughened copper foil ...
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WO/2022/243568A1 |
A rack for accommodating a plastic part to be coated with metal, the rack being covered by a plastic material and the plastic material covering the rack comprising polyvinyl chloride and at least one plasticizer, the at least one plastic...
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WO/2022/238010A1 |
The present invention relates to a method, and respective use, for treating a non-metallic substrate for subsequent metallization, the method comprising step (A), optional step (B), and step (C), wherein step (C) comprises a contacting w...
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WO/2022/237648A1 |
The present application provides a housing, a terminal device, and a preparation method for the housing. The housing comprises a magnesium-based metal base. A first aluminum-based metal layer and a second aluminum-based metal layer are r...
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WO/2022/241088A1 |
Hysteretic current-voltage mediated void-free superconformal and bottom-up filling of recessed features includes providing an electrodeposition composition with a hysteretic cyclic voltammogram; providing the substrate controlling applie...
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WO/2022/235219A1 |
A round wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 ...
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WO/2022/235064A1 |
The present invention provides a metal structure manufactured using an anodic oxide film and a method for manufacturing same.
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WO/2022/229373A1 |
The present invention refers to an electroplating composition for depositing a chromium or chromium alloy layer on a substrate, said composition comprising (i) trivalent chromium ions, (ii) at least one complexing agent for the trivalent...
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WO/2022/231922A1 |
An atmospheric plasma treatment station is integrated in a semiconductor process tool. The atmospheric plasma treatment station directly interfaces with a deposition chamber of the semiconductor process tool without adding to the footpri...
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WO/2022/229175A1 |
The invention relates to a device for coating a component or semi-finished product with a chromium layer, the device comprising an undivided deposition cell, in which there is an anode and which is suitable for receiving a cathodically c...
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WO/2022/231009A1 |
[Problem] To provide a surface treated steel foil which is for a current collector and which has hydrogen barrier properties suitable for a battery using a hydrogen occluding alloy. [Solution] This surface treated steel foil is for a cur...
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WO/2022/231008A1 |
[Problem] To provide a surface-treated steel foil for current collectors, the surface-treated steel foil having suitable hydrogen barrier properties. [Solution] A surface-treated steel foil for current collectors, the surface-treated ste...
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WO/2022/231007A1 |
[Problem] To provide a surface-treated steel foil endowed with hydrogen barrier properties suitable for a bipolar battery. [Solution] A surface-treated steel foil having a first surface and a second surface positioned on the opposite sid...
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WO/2022/224817A1 |
This plating electrode comprises: a plating solution-impregnated cloth, an annular member, a first rotating member, and a second rotating member. A positive electrode of a DC power supply is electrically connected to the first rotating m...
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WO/2022/224683A1 |
The purpose of the present invention is to provide a novel system for producing a composite copper member. The present invention provides a system having a first device for partially coating the surface of a copper member with a silane c...
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WO/2022/219904A1 |
Provided are a male pin for a connector which achieves low insertion force (friction force) when inserted into a female pin and good contact resistance with the female pin, and a manufacturing method of the male pin for the connector. Th...
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WO/2022/219276A1 |
The invention relates to a process for manufacturing a silver-plated copper or copper alloy blank wire having a silver layer thickness of 1.5 μm to 15 μm, the manufacturing process comprising the step of electrolytically depositing sil...
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WO/2022/215330A1 |
[Problem] The present invention provides a surface-treated copper foil which exhibits high adhesion even to a low dielectric resin base material since the treated surface thereof has a three-dimensional shape that is formed of a pluralit...
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WO/2022/215642A1 |
The present invention provides a surface-treated steel sheet which has excellent strength even if the surface-treated steel sheet is provided with an Ni-Co-Fe alloy layer. A surface-treated steel sheet (1) according to the present disclo...
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WO/2022/215635A1 |
This steel sheet for hot stamping is characteristically provided with the following in the indicated sequence: a base steel sheet; an Al-Si alloy plating layer that has an Al content of at least 75 mass% and an Si content of at least 3 m...
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WO/2022/215634A1 |
A surface-treated steel sheet pertaining to an embodiment of the present invention comprises a base steel sheet and a plating layer which is disposed on the surface of the base steel sheet and contains Ni and W, wherein: in a region exte...
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WO/2022/215636A1 |
This steel sheet (10) for hot stamping sequentially comprises, in the following order: a base steel sheet (1); an Al-Si alloy plating layer (2) that has an Al content of 75% by mass or more and an Si content of 3 to 20% by mass, with the...
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WO/2022/208065A1 |
A method of forming a pressure vessel for holding a compressed fluid is described herein. The method comprises forming a metallic layer on a mandrel with an electrodeposition process, the mandrel having the desired vessel configuration, ...
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WO/2022/209990A1 |
Provided is a roughened copper foil that has excellent transmission characteristics and suppresses the falling off of powder. This roughened copper foil has a roughened surface on at least one side. The roughened surface has a roughness ...
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WO/2022/209989A1 |
Provided is a roughened copper foil which, when used in a copper-cladded laminate board or a printed wiring board, can achieve both of excellent transmission properties and high peel strength. The roughened copper foil has a roughened su...
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WO/2022/208861A1 |
A heat-resistant alloy member comprising: a heat-resistant alloy substrate; Re-based, W-based, or Cr-based multipurpose alloy layer provided on the surface thereof in a region that comprises at least a region where thermal insulation sho...
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WO/2022/202540A1 |
Provided is a roughened copper foil capable of achieving both high adhesiveness with respect to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side ...
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WO/2022/202184A1 |
The present invention addresses the problem of providing: a plated molded article wherein a plating layer having excellent surface smoothness is formed without sacrificing various excellent characteristics that are intrinsic to a polyphe...
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WO/2022/200548A1 |
A process for electrochemical deposition of copper, comprising - providing a rolled and annealed copper foil comprising a first surface and a second surface, - etching the first surface of the rolled and annealed copper foil, thereby cre...
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WO/2022/202539A1 |
Provided is a copper foil with a carrier, with which excellent laser processability can be achieved. This copper foil with a carrier is provided with a carrier, a release layer, and an ultrathin copper foil in said order, wherein copper ...
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WO/2022/202221A1 |
Provided are: a dissimilar metal jointed body in which galvanic corrosion at a portion at which two sides connect is prevented, and that enables satisfactory adhesion when applying an insulation coating on the dissimilar metal jointed bo...
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WO/2022/202912A1 |
This metal sheet material comprises copper or a copper alloy, and has a main sheet body and a roughening plating layer that is formed on the outermost layer of the main sheet body. Engagement protrusions are formed in the roughening plat...
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WO/2022/202494A1 |
Provided are an electrical connection member material and an electrical connection member that are capable of suppressing adhesion on an Ag layer without using a special metal layer. An electrical connection member material 1 has: a me...
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WO/2022/202541A1 |
Provided is a roughened copper foil capable of having both high adhesiveness with a thermoplastic resin and excellent high frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. The rou...
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WO/2022/196318A1 |
Provided are a production method for a textured plated steel sheet and a production device for a textured plated steel sheet that make it possible to suppress product defects resulting from the film thickness deficiency and poor appearan...
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WO/2022/195038A1 |
The present invention relates to a process for producing an electrical contact, in particular an electrical plug contact, comprising the steps of a) providing a substrate, wherein the substrate has a metallic and/or metallized surface, a...
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WO/2022/194814A1 |
ABS molding composition with an improved surface quality comprising (A) 15 to 44.975 wt.-% graft copolymer (A) - consisting of 15 to 60 wt.-% graft sheath (A2) and 40 to 85 wt.-% agglomerated butadiene rubber latex (A1) - obtained by emu...
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WO/2022/197738A1 |
An apparatus for electroplating a metal on a semiconductor substrate with high control over plated thickness on a die-level includes an ionically resistive ionically permeable element (e.g., a plate with channels), where the element allo...
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WO/2022/189446A1 |
Disclosed is a plumbing component (1) having a coating (2) with an outer layer (3), said outer layer (3) being made at least in part of copper or a copper alloy. Also disclosed is a method for coating a plumbing component.
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WO/2022/189283A1 |
The invention relates to method for copper-to-copper direct bonding comprising the steps: a) providing a first substrate comprising a first pure copper deposit having a bonding surface; b) providing a second substrate comprising a second...
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WO/2022/189017A1 |
The disclosure relates to a distribution system (1) for a process fluid (28) for a chemical and/or electrolytic surface treatment of a substrate (4), comprising: a distribution body (3), and a substrate holder (2), wherein the substrate ...
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WO/2022/184565A1 |
The invention relates to a method for producing a semi-finished product with a modified surface, comprising at least one method step of modifying, at least in regions, the surface of a coated, skin-passed, oiled, cleaned metal steel subs...
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WO/2022/184848A1 |
The invention relates to a method for coating a sanitary component (1), comprising at least the following steps: a) providing the sanitary component (1), the sanitary component (1) having at least one liquid channel (2); and b) at least ...
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WO/2022/186262A1 |
This bonding sheet (10, 20) with a preform layer (13) is for bonding a substrate (16) and an electronic component (17), and has a copper sheet (11) and a porous preform layer (13) that is provided on one or both surfaces of the copper sh...
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WO/2022/186183A1 |
An additive for acidic zinc alloy plating bath according to the present invention is used for obtaining acidic zinc alloy plating bath that can provide a zinc alloy plating film having satisfactory appearance, and contains active compone...
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WO/2022/186166A1 |
Provided is a joining structure in which joined bodies formed from metal are strongly joined to each other using metal plating. Also provided is a manufacturing method for the joining structure. The joining structure 10 comprises: a firs...
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WO/2022/184956A1 |
Disclosed is a method for electrodepositing a metal on a metallic piece (1), which comprises connecting the metallic piece (1) to be treated to a first electrolytic pole of an electric generator and to a second pole opposite the first po...
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