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WO/2023/195267A1 |
The present invention provides: a lead frame material which has improved resin adhesion in a high-temperature high-humidity environment, while being capable of preventing fall-off of particles during processing; and the like. A lead fr...
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WO/2023/189566A1 |
Provided is a metal foil with a carrier that makes it possible to suppress the occurrence of breakage or cracking of the metal foil during handling. This metal foil with a carrier comprises a carrier, a release layer, and a metal foil in...
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WO/2023/188637A1 |
The present invention provides: a silver-plated material wherein a silver plating film is not easily separated from a base plating film and exhibits excellent adhesion in a high-temperature high-humidity environment in cases where the si...
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WO/2023/189537A1 |
The present invention provides a method for producing a trivalent chromium plated component (100) that is obtained by forming a trivalent chromium plating film (3) on a sliding component of a device in which a fluid is sealed, the method...
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WO/2023/185350A1 |
The present application relates to the field of solar cells, and provides a method for forming a gate line electrode of a photovoltaic device and the photovoltaic device. The method for forming the gate line electrode of the photovoltaic...
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WO/2023/190860A1 |
This surface-treated copper foil has one surface (A) and the other surface (B), wherein the surface (A) satisfies the following requirements (I) and (II). • Requirement (I): on the surface of the surface-treated copper foil, the mirr...
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WO/2023/188446A1 |
[Problem] To provide a silver-plated material that not only has excellent wear resistance but can also keep the peeling resistance of a silver coating layer high, even when exposed to high-temperature/high-humidity environments. [Solutio...
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WO/2023/190833A1 |
Provided is a surface-treated copper foil in which circuit workability is excellent and transmission loss and generation of foreign matter are less likely to occur. When the optical roughness of the surface (20a) of a surface treatment l...
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WO/2023/189565A1 |
Provided is a carrier-attached metal foil in which the occurrence of fractures or cracks in the metal foil during handling thereof can be suppressed. The carrier-attached metal foil comprises a carrier, a release layer, and a metal foil ...
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WO/2023/185546A1 |
Disclosed in the present invention is an electroplating apparatus, comprising: a film frame, the center of which is provided with a through hole; a conveying branch pipe extending from a side wall of the film frame through hole to the ed...
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WO/2023/189419A1 |
This electrical contact material comprises: a conductive substrate; and a silver-containing layer which contains silver and is provided on at least a part of the surface of the conductive substrate, wherein the average CI value of the si...
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WO/2023/189418A1 |
This electric contact material comprises an electroconductive substrate and a silver-containing layer that contains silver and is disposed at least on a portion of the surface of the electroconductive layer. In a cross section of the ele...
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WO/2023/190805A1 |
The purpose of the present invention is to provide: a novel copper plating solution for PR pulse electrolysis; and a novel copper plating method by means of PR pulse electrolysis. The present invention provides a copper plating solution ...
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WO/2023/189417A1 |
An electric contact material comprising: a conductive base material; and a silver-containing layer that contains silver and that is provided to at least a portion of the surface of the conductive base material, wherein, in a cross sectio...
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WO/2023/190845A1 |
Provided are a copper foil having high adhesion to a coating film, and a light-shielding material having, in addition to excellent light shielding properties, high adhesion to a black coating film and a substrate. A copper foil (1) has, ...
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WO/2023/179704A1 |
Provided are a copper plating additive composition, a copper plating solution, and a copper brush plating method using the same. The copper plating additive composition includes 1, 4-cyclohexanedione monoethylene acetal, potassium phthal...
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WO/2023/183158A1 |
Methods and apparatus for electroplating a substrate incorporate aspects of digital lithography and feedback from electroplating processes to improve characteristics of plating material based on die patterns. In some embodiments, a metho...
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WO/2023/181627A1 |
This structural body comprises a base material and a plating layer disposed on the base material, the plating layer having a porous structure on a surface thereof on the opposite side to the base material, the structural body satisfying ...
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WO/2023/182177A1 |
The present invention provides a roughened copper foil which can have both high adhesion to a thermoplastic resin and excellent high-frequency characteristics at the same time. This roughened copper foil has a roughened surface on at lea...
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WO/2023/182178A1 |
Provided is a roughened copper foil capable of achieving both high adhesiveness to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. The ...
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WO/2023/178825A1 |
The present invention relates to a copper brush plating process for a plastic film. The process comprises: performing first copper plating treatment on a plastic film by using a physical vapor deposition method, so as to prepare a first ...
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WO/2023/182176A1 |
Provided is a roughened copper foil capable of achieving both high adhesion to a thermoplastic resin and excellent high-frequency characteristics. The roughened copper foil has at least one roughened surface. The roughened surface has a ...
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WO/2023/182179A1 |
Provided is a roughened copper foil capable of exhibiting both good adhesion to a thermoplastic resin and superior high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. The roughe...
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WO/2023/182174A1 |
Provided is a roughened copper foil capable of achieving both high adhesion to a thermoplastic resin and excellent high-frequency characteristics. The roughened copper foil has at least one roughened surface. Provided is a roughened copp...
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WO/2023/182259A1 |
Provided are: a terminal material configured to effectively reduce the surface friction from the perspective of a Cu-Sn alloy and Sn distributions within a coating layer containing the Cu-Sn alloy and Sn; and an electrical connection ter...
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WO/2023/182175A1 |
Provided is a roughened copper foil capable of achieving both high adhesiveness to thermoplastic resins and excellent high-frequency characteristics. This roughened copper foil has a roughened surface on at least one side thereof. The ro...
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WO/2023/179748A1 |
Disclosed are a cell electroplating method and apparatus, wherein: a flexible conductive piece is attached to a mask opening on a cell surface to be electroplated, so that the conductive piece forms a direct or indirect electrical connec...
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WO/2023/175191A1 |
The invention relates to a method for producing a housing (1) for a sanitary fitting, having at least the following steps: a) producing the fitting housing (1) in an injection molding tool, a brush structure (3) being formed at least par...
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WO/2023/174781A1 |
The invention relates to a multi-layer body, comprising (I) a carrier layer made of a special thermoplastic polycarbonate molding compound and (II) a metal layer which has one or more recesses. The invention also relates to a lighting or...
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WO/2023/171143A1 |
The purpose of the present invention is to effectively inhibit the occurrence of delayed fracture at a shear end surface of a member in which there is a concern regarding occurrence of delayed fracture in a press-molded article obtained ...
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WO/2023/171668A1 |
Provided is a composite material formed by forming, on a raw material, a composite coating consisting of a silver layer containing carbon particles, wherein the silver crystallite size of the composite coating is equal to or less than 30...
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WO/2023/164994A1 |
A bactericidal environmentally friendly composite coating, a preparation method therefor, and a bactericidal environmentally friendly product. The bactericidal environmentally friendly composite coating comprises: a semi-bright nickel la...
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WO/2023/166697A1 |
Provided is a technique capable of improving the throughput of pre-wet processing. This substrate pre-wet processing method comprises: a step for placing a substrate Wf, in which a recess Wfb for wiring formation is formed on a surface...
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WO/2023/164992A1 |
An antiviral eco-friendly composite coating, a preparation method therefor, and an antiviral eco-friendly product. The antiviral eco-friendly composite coating comprises: a semi-gloss nickel layer, a microporous nickel layer and an eco-f...
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WO/2023/166271A1 |
The invention relates to a method for producing a selectively metallised three-dimensional item, the method comprising at least: - a step of depositing a composition in the liquid or paste state on a surface of a thermoformable substrate...
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WO/2023/166023A1 |
With the objective of improving the corrosion resistance, in particular the salt spray resistance, of objects with a nickel and trivalent chromium coating, the invention proposes a method for coating a substrate with a corrosion protecti...
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WO/2023/159785A1 |
The present invention relates to a conductive apparatus for a coating and a coating machine. The conductive apparatus for a coating comprises a rack and two conductive mechanisms. The rack is provided with a plating tank which contains a...
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WO/2023/162371A1 |
Provided is a galvanized steel sheet which has excellent press moldability and a good external surface appearance after coating, and in which die galling leading to breakage of a molded article during press molding is suitably inhibited ...
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WO/2023/160642A1 |
The present application relates to a conductive device (100) for film plating and a film plating machine (300). The conductive device (100) for film plating comprises a frame (110) and two conductive mechanisms (120). The frame (110) is ...
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WO/2023/159531A1 |
A bead wire (10) and a manufacturing method. The carbon content of a base surface layer (12) of the bead wire (10) is 1.01-1.50 times the carbon content of a base. The manufacturing method comprises: S1, processing a wire to obtain a pre...
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WO/2023/157329A1 |
Provided are a mask member for partial plating and a technique related thereto. The mask member comprises: a drum-type jig 11 including a jig opening disposition region 17 which includes a jig opening 13 for communicating a side surface ...
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WO/2023/153099A1 |
The present invention provides a steel sheet for hot pressing, the steel sheet being prevented from the generation of scales due to a coating layer and being reduced in adhesion of a metal to heating facilities, thereby preventing liquid...
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WO/2023/152994A1 |
[Problem] To provide a silver-plated material which has excellent abrasion resistance and has the ability to maintain high resistance to peeling of a silver coating layer even when exposed to high-temperature and high-humidity environmen...
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WO/2023/146591A1 |
Exemplary methods of semiconductor processing may include performing an electroplating operation on a semiconductor substrate in an electroplating bath within a vessel of an electroplating system. The methods may include removing the sem...
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WO/2023/140063A1 |
The purpose of the present invention is to provide a novel composite copper member and a power module which includes the composite copper member. The composite copper member includes a copper member and a nickel layer which is formed on ...
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WO/2023/140062A1 |
The purpose of the present invention is to provide a novel metal member. According to the present invention, provided is a metal member containing a first metal wherein N and Si are detected by elemental analysis of the surface of the me...
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WO/2023/139923A1 |
Provided are a projection-welded joint and a projection welding method. The present invention is a welded joint formed by subjecting a high-strength plated steel sheet and a nut to projection welding, wherein the amount of solid solution...
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WO/2023/141459A1 |
A three-dimensional printer, system, and method for electrodeposition. The three-dimensional printer and system include a deposition anode, a build plate, wherein at least one of the deposition anode and build plate are moveable relative...
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WO/2023/123912A1 |
Disclosed by the present application is an electroplating apparatus; a spray pipe in said electroplating apparatus is configured to spray a plating bath into a first hole to be plated so that positive pressure is generated in the area be...
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WO/2023/126257A1 |
Therefore the present invention provides a composition for depositing copper on a semiconductor substrate, the composition comprising (a) copper ions; (b) a grain refiner of formula (G1a) or (G1b) or salts thereof (c) a complexing agent;...
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