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WO/2023/035658A1 |
Disclosed are a semiconductor structure and a manufacturing method therefor, and a memory. The semiconductor structure may at least comprise: a first grating, a second grating, and a third grating stacked from bottom to top and disposed ...
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WO/2023/036530A1 |
A sensor system for measuring a shape of a substrate, comprising: a substrate support to support a surface of the substrate, at least one sensor device, each sensor device comprising an optical emitter to emit radiation beams onto the su...
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WO/2023/030832A1 |
Systems, apparatuses, and methods are provided for correcting an alignment measurement or overlay error. An example method can include measuring an observable in response to an illumination of a region of a surface by a radiation beam, s...
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WO/2023/032962A1 |
The purpose of the present invention is to provide a direct-drawing device and a method for controlling the direct-drawing device, each of which makes it possible to improve the accuracy of interlayer superposition. Provided is a direc...
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WO/2023/020791A1 |
A system includes a radiation source, an optical system, an optical element, a detection system, and a processor. The radiation source is configured to generate a radiation beam. The optical system is configured to direct the radiation b...
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WO/2023/020856A1 |
Disclosed is a method for measuring a target located on a substrate beneath at least one layer. The method comprises exciting said at least one layer with pump radiation comprising at least one pump wavelength, so as to generate an acous...
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WO/2023/016752A1 |
Described are embodiments for generating a design (e.g., a metrology mark or a device pattern to be printed on a substrate) that is optimized for aberration sensitivity related to an optical system of a lithography system. A metrology ma...
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WO/2023/016705A1 |
Disclosed is a method for modeling alignment data over a substrate area relating to a substrate being exposed in a lithographic process. The method comprises obtaining alignment data relating to said substrate and separating the alignmen...
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WO/2023/016732A1 |
The invention provides a method for positioning a sensor over a target on a moveable object, comprising the following steps: a. moving the object to move the target to a desired position, b. moving the sensor in a direction towards a mea...
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WO/2023/016773A1 |
Systems, apparatuses, and methods are provided for measuring intensity using off-axis illumination. An example method can include illuminating a region of a surface of a substrate with a first radiation beam at a first incident angle and...
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WO/2023/284037A1 |
A measurement mark (2), a measurement layout (3), and a measurement method for a semiconductor structure. The measurement mark (2) comprises a first pattern (100), a second pattern (200), and a third pattern (300); the first pattern (100...
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WO/2023/285322A1 |
Disclosed is a method for measuring alignment on an alignment mark, and associated apparatuses. The method comprises illuminating the alignment mark with illumination comprising at least one wavelength; capturing the scattered radiation ...
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WO/2023/286732A1 |
In order to improve the throughput in wiring pattern formation for FO-WLP, this exposure device is equipped with: a substrate stage on which a plurality of substrates are placed; and a plurality of first projection modules that each have...
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WO/2023/285066A1 |
Described is a method and associated computer program and apparatuses for determining a correction for at least one control parameter, said at least one control parameter for controlling a semiconductor manufacturing process so as to man...
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WO/2022/265621A1 |
A digital lithography system includes scan regions including a first scan region and a second scan region adjacent to the first scan region. The digital lithography system further includes exposure units located above the scan regions, a...
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WO/2022/258371A1 |
Systems, apparatuses, and methods are provided for correcting the detected positions of alignment marks disposed on a substrate and aligning the substrate using the corrected data to accurately expose patterns on the substrate. An exampl...
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WO/2022/258275A1 |
An on-chip alignment sensor includes an illumination system configured to emit a beam of radiation to irradiate a target on a substrate. The on-chip alignment sensor further includes a first capturing grating configured to receive a firs...
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WO/2022/258274A1 |
A system includes a radiation source, an optical element, a detector, and a processor. The radiation source generates a beam of radiation. The optical element produces a non-uniform change in a phase of the beam of radiation and outputs ...
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WO/2022/193915A9 |
Provided is a method for measuring a before-and-after-epitaxy photolithography overlay error, comprising: performing etching on a first substrate surface to form a main scale original mark (11); performing epitaxy on first substrate surf...
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WO/2022/233523A1 |
Disclosed is a parallel metrology sensor system comprising a reference frame and a plurality of integrated optics sensor heads, each integrated optics sensor head configured to perform an independent measurement. Each of the integrated o...
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WO/2022/230788A1 |
The present invention provides an analysis system which makes it possible to identify, from among a plurality of substrate processing devices, a device which has caused a deformation amount of a substrate. Given a first processing devi...
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WO/2022/228892A1 |
A substrate (200) is provided having a multi-layer structure (202) disposed thereon. The multi-layer structure includes a plurality of meta-layers, each meta-layer including a hard mask layer (206a-d) including a hard mask material, and ...
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WO/2022/214267A1 |
A method for determining a substrate model for describing a first measurement dataset and a second measurement dataset relating to a performance parameter. The method comprises obtaining candidate basis functions for a plurality of subst...
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WO/2022/205726A1 |
An alignment error test method, a test system, an adjustment method, and a computer-readable storage medium. The test method comprises: providing a substrate (10), a first conductive layer (14) and a second conductive layer (13) arranged...
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WO/2022/205740A1 |
A compensation method and compensation system for exposure alignment. The compensation method comprises: acquiring original data of an alignment pattern; performing first-order processing on the original data to obtain first-order deriva...
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WO/2022/207259A1 |
A patterning device for a lithographic apparatus arranged to project a pattern from the patterning device onto a substrate, the patterning device comprising: an imaging area having opposing first sides extending parallel to a scanning di...
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WO/2022/207395A1 |
Systems, apparatuses, and methods are provided for correcting the detected positions of alignment marks disposed on a substrate and aligning the substrate using the corrected data to ensure accurate exposure of one or more patterns on th...
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WO/2022/212738A1 |
A photolithography system includes an optical assembly for delivering a collimated light beam with spatially uniform light across the collimated light beam to a substrate on a substrate mount. A multi-axis support assembly provides for a...
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WO/2022/205697A1 |
Disclosed is a method for acquiring an alignment mark count. The method comprises: S201, acquiring a first time when an exposure machine exposes a first wafer, and acquiring a second time when the exposure machine performs alignment on a...
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WO/2022/205747A1 |
The present invention relates to an alignment and measurement mark structure and an alignment and measurement method. The alignment and measurement mark structure comprises: a first overlay mark; and a second overlay mark comprising a gr...
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WO/2022/198912A1 |
A method and apparatus for improving an alignment performance of a photolithography device, which method and apparatus can provide, according to the characteristics of a product, an optimal alignment light source type for alignment proce...
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WO/2022/199958A1 |
Disclosed is a method of identifying one or more dominant asymmetry modes relating to asymmetry in an alignment mark, the method comprises obtaining alignment data relating to measurement of alignment marks on at least one substrate usin...
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WO/2022/193489A1 |
A photomask assembly, a patterned mask and a formation method therefor, and a formation method for an active area. The photomask assembly comprises: a first photomask (10) for forming a first patterned structure (510) on a substrate (100...
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WO/2022/193151A1 |
A mask plate, an alignment mark and a photolithography system. The alignment mark comprises a plurality of alignment patterns arranged at intervals, wherein each alignment pattern comprises a first pattern extending in a first direction ...
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WO/2022/197418A1 |
An interferometric overlay tool may include an interferometer and a controller. The interferometer may include one or more beam splitters to split illumination including one or more wavelengths into a probe beam along a probe path and a ...
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WO/2022/189082A1 |
Methods and apparatus for characterizing a semiconductor manufacturing process performed on a substrate. First data is obtained associated with fingerprint data of the substrate measured after a first process step. Second data is obtaine...
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WO/2022/190706A1 |
The purpose of the present invention is to provide a technique with which it is possible to radiate light from an exposure head to an appropriate position on a substrate mounted on a stage while a driven object such as the stage or an ex...
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WO/2022/184405A1 |
Disclosed is a method for determining a set of correction weights to correct metrology data. The method comprises obtaining first metrology data relating to a plurality of illumination settings of measurement radiation used to perform a ...
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WO/2022/184479A1 |
A method of processing a data set comprising equispaced and/or non-equispaced data samples is disclosed. The method comprises filtering of the data, wherein a kernel defined by a probability density function is convoluted over samples in...
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WO/2022/177854A1 |
A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to...
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WO/2022/164113A1 |
The present invention relates to an apparatus and method for aligning a plurality of photomasks for manufacturing a fine metal mask for a large display. More specifically, provided is an apparatus for aligning a plurality of photomasks f...
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WO/2022/161728A1 |
Disclosed is a method for determining a focus actuation profile for one or more actuators of a lithographic exposure apparatus in control of a lithographic exposure process for exposure of an exposure area comprising at least two topogra...
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WO/2022/164123A1 |
The present invention relates to a device and a method for aligning multiple photomasks for manufacturing a fine metal mask for a large-area display and, more specifically, to a device for aligning multiple photomasks for manufacturing a...
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WO/2022/158980A1 |
A grid plate encoder based positioning system (1) for positioning of an element is provided, the positioning system (1) comprises a grid plate (2) with a grid plate surface (21); an encoder unit (3) with one or more optical sensors (31) ...
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WO/2022/156249A1 |
A method for reducing impact of phase grating asymmetry on position measurement precision, comprising the following steps: determining an asymmetry change range according to a design value and processing precision of a phase grating, and...
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WO/2022/158687A1 |
The present invention relates to a fine metal mask for a large-area display and a method for manufacturing same and, more particularly, to a method for manufacturing a fine metal mask which comprises: an effective portion in which a thro...
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WO/2022/144185A1 |
The present disclosure relates to a metrology apparatus for measuring a parameter of interest of a targets on a substrate comprising: m x n detectors, wherein m≥1 and n≥1; a first frame; and (n-1) second frames; and (m-1) x n interme...
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WO/2022/145621A1 |
The present invention addresses the technical problem of providing a method for quickly and accurately processing the volume and position of an ink drop. In order to solve the above problem, a pad for measuring the volumes and positions ...
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WO/2022/135870A1 |
A method includes irradiating a target structure with sequential illumination shots, directing scattered beams from the target structure towards an imaging detector, generating a detection signal using the imaging detector, and determini...
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WO/2022/133638A1 |
Provided are an array substrate, a display panel and an electronic apparatus. The array substrate comprises: a base substrate; a first electrode, which is arranged on the base substrate; a gate line, which is arranged on the base substra...
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