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Patent Searching and Data


Matches 1 - 50 out of 11,988

Document Document Title
WO/2024/120435A1
an alignment method based on holographic lithography, a system, and equipment, which relate to the technical field of holographic lithography. The alignment method comprises: controlling irradiated light to pass through an alignment imag...  
WO/2024/120738A1
A sensor apparatus includes a sensor array and a metrology stage coupled to the sensor array. The sensor array includes a plurality of sensors. Each sensor of the sensor array is configured to illuminate radiation to a diffraction target...  
WO/2024/119422A1
Disclosed in the present invention is a deep-neural-network-based class-incremental learning method for a mobile phone radiation source spectrogram. The method comprises: acquiring a data set of a mobile phone radiation source spectrogra...  
WO/2024/115041A1
Disclosed is an apparatus for and method of simultaneous capture and presentation of multiple types of alignment information in which a pupil is divided and the radiation from the pupil is spatially separated. In some versions the alignm...  
WO/2024/104730A1
An optical system comprising a double quad mirror is described. The optical system is configured to reflect two quadrants of an incident radiation beam approaching from either side of the mirror, while allowing the opposite two quadrants...  
WO/2024/104293A1
The present disclosure provides a multi-point flatness detection and leveling method and apparatus. The method comprises: using a wafer bearing table to support and drive a silicon wafer to move to a target area of the wafer bearing tabl...  
WO/2024/099740A1
Systems and methods of measuring a focus position in a metrology system include introducing an optical element into a measurement arm of the metrology system, the optical element being configured and arranged to modify a point spread fun...  
WO/2024/099744A1
Disclosed is a method for determining at least one set of correction weights to correct metrology data is disclosed. The method comprises obtaining first and second metrology data relating respectively to a first layer and a second layer...  
WO/2024/088708A1
Disclosed is an illumination configuration module comprising: a polarizing and wavelength separation arrangement operable to separate input broadband illumination into at least first dispersed illumination comprising a first polarization...  
WO/2024/083559A1
A source selection module comprising an adjustable diffraction element comprising multiple pixels. The source selection module further comprises a light dispersive element configured for receiving a first and a second light. The light di...  
WO/2024/085055A1
The purpose of the present invention is to, when a substrate (or substrates) is (are) disposed on a substrate holder for holding the substrate(s), detect the position(s) of the substrate(s) disposed in various forms, in which, for exampl...  
WO/2024/083435A1
Described is a method for predicting a parameter of interest of a manufacturing process for manufacturing integrated circuits. The method comprises: obtaining metrology data relating to the parameter of interest; applying a first predict...  
WO/2024/078813A1
An optical arrangement for aberration correction, comprising: a beam dispersing element for spatially dispersing a broadband radiation beam in a first transverse direction; a focusing lens for focusing the broadband radiation beam subseq...  
WO/2024/078818A1
An inspection system includes an integrated optical system with a substrate, waveguide system, and first and second grating couplers disposed on the substrate, first and second detectors, and a micro-structured illumination adjuster. The...  
WO/2024/074286A1
Systems and methods for providing variable spot size and variable focus at a substrate are described. Sets of variable focal length lenses can be added to an alignment system to allow for adjustment of the spot size and focus. A variable...  
WO/2024/068297A1
Systems and methods for providing variable spot size and variable focus at a substrate are described. Sets of variable focal length lenses can be added to an alignment system to allow for adjustment of the spot size and focus. A variable...  
WO/2024/061572A1
An optical alignment system comprising an illumination system configured to condition a radiation beam to form a first off-axis monopole, a marker configured to diffract the first off-axis monopole to form zeroth and first diffraction or...  
WO/2024/063968A1
Systems and methods disclosed herein relate to a digital lithography system and method for alignment resolution with the digital lithography system. The digital lithography system includes a metrology system configured to improve overlay...  
WO/2024/055712A1
The present invention provides a double-sided superlens processing method. The method comprises: providing a first structural layer on a first surface of a substrate, and performing a first photolithography operation on the first structu...  
WO/2024/052061A1
A method can include directing radiation toward at least two targets using an optical scanning system so as to generate first and second portions of scattered radiation. A first target can include a plurality of first grating line struct...  
WO/2024/045204A1
A method and apparatus for locating a production monitoring point of a photomask, and an electronic device. The method for locating a production monitoring point of a photomask comprises: determining coordinates of one or more target det...  
WO/2024/028327A1
A method of determining contamination of an optical sensor in a lithographic apparatus, the method comprising illuminating a pattern on a patterning device using EUV radiation, projecting patterned reflected EUV radiation towards the opt...  
WO/2024/022773A1
A method of determining contamination of an optical sensor of a sensing system in a lithographic apparatus, the method comprising directing EUV radiation through an opening in a reticle masking blade (26) and onto a patterning device, pr...  
WO/2024/017765A1
This discloses apparatus and methods for obtaining topographical information about a sample surface. In one arrangement, a sensing system comprises a group of proximal sensors for measuring positions of respective portions of a sample su...  
WO/2024/017649A1
Disclosed is a metrology apparatus in which some of the measurement radiation that has interacted with a mark is split into channels or arms and then each channel or arm is spatially separated. In some versions the alignment information ...  
WO/2024/017807A1
Systems, methods, and computer software are disclosed for optimizing a metrology mark. One method includes simulating an etch process based on one or more of a pattern density, a microloading effect induced intra-mark variation, or a sen...  
WO/2024/005011A1
The present disclosure provides a reflection structure comprising a frequency-selective reflection plate that reflects a specific frequency band of electromagnetic waves in a different direction than a regular reflection direction. The r...  
WO/2024/000632A1
The present disclosure relates to a method and apparatus for monitoring the measurement accuracy of a semiconductor, a device, and a medium. The method comprises: obtaining real-time measurement data and scanned image measurement data of...  
WO/2024/002546A1
Disclosed is a wedge arrangement comprising a plurality of wedge elements, arranged around an optical axis, the plurality of wedge elements comprising at least a first wedge element, a second wedge element and a third wedge element; wher...  
WO/2023/247125A1
A method of determining a physical quantity is disclosed. The method uses a sensor system configured to sample a plurality of positions in parallel, wherein sampling each position uses radiation incident on an object plane patterning dev...  
WO/2023/247178A1
A novel approach for an alignment system by using glass plates to create off-axis illumination beams is described. A pair of glass plates is inserted into an alignment system to create a pair of off-axis illumination beams. The off-axis ...  
WO/2023/241867A1
A method for calibrating a height measuring optical sensor for a substrate in a lithographic apparatus. The method comprises determining, using the height measuring optical sensor, a first height of a surface of the substrate within a re...  
WO/2023/242012A1
An inspection system includes a radiation source, an integrated optical system, and first and second detectors. The radiation source generates radiation to irradiate a target. The integrated optical system includes: a substrate; first, s...  
WO/2023/241850A1
Method of spatially aligning a patterning device and a substrate, wherein the patterning device and the substrate are separated by an optical path comprising one or more moveable optical components, the method comprising: - projecting a ...  
WO/2023/236069A1
An alignment calibration system and a method therefor. After an image sensing device (3) and an image capturing apparatus (4) respectively acquire alignment information, positioning information is obtained through computation so as to ac...  
WO/2023/208487A1
Disclosed is a source selection module for selecting spectral characteristics of a broadband illumination beam to obtain a modulated illumination beam. The source selection module comprises a first beam dispersing element for dispersing ...  
WO/2023/198382A1
A method of spatially aligning a patterning device and a substrate, wherein the patterning device and the substrate are separated by an optical path comprising one or more moveable optical components is described, the method comprising: ...  
WO/2023/198466A1
An apparatus includes an illumination system, a projection system, and an inspection system. The illumination system illuminates a pattern of a patterning device. The projection system projects an image of the pattern onto a substrate. T...  
WO/2023/198444A1
Disclosed herein are embodiments that relate to a metrology apparatus and associated methods for imaging a plurality of targets (e.g., alignment marks) disposed on of a substrate (550, 650) in parallel using a fixed sensor (510, 530, 610...  
WO/2023/196783A1
Disclosed herein are examples of a photolithography machine with fast alignment. The machine may include a stage to hold and move a substrate and a projection system to project images on a plurality of exposure regions of the substrate. ...  
WO/2023/189283A1
This semiconductor substrate comprises a main surface, a reference mark, and an epitaxial growth-inhibiting film. The reference mark is composed of a recess formed on the main surface, and serves as a reference for in-plane coordinates. ...  
WO/2023/186440A1
Disclosed is a method for determining a spatial distribution of a parameter of interest over at least one substrate or portion thereof, the at least one substrate having been subject to a semiconductor manufacturing process, the method c...  
WO/2023/189435A1
This analysis system comprises: a first measurement unit for measuring first information items that are pattern information items of a first pattern on a first substrate; a storage unit for storing the first information items measured by...  
WO/2023/190110A1
Provided is a transport device (20) comprising an alignment mechanism (22) which positions each of a plurality of substrates (P) arranged on a holding unit (21) with respect to the holding unit (21), a suction mechanism (23) which causes...  
WO/2023/190400A1
The present invention forms a reference mark 22 formed in a first process of a photolithography process of semiconductor device manufacturing and a reference mark 24 formed in a second process following the first process as concentric do...  
WO/2023/183245A1
A device for determining coplanarity of two surfaces includes an illumination system for providing first light to a first surface and providing second light to a second surface. The first surface redirects at least a portion of the first...  
WO/2023/174648A1
Disclosed is an illumination arrangement for providing at least one radiation beam for use as an illumination beam and/or reference beam in a metrology device. The illumination arrangement comprises at least one radiation beam modifier m...  
WO/2023/170692A1
A control system and method are presented for use in optical measurements on patterned samples. The control system comprises a computer system configured for data communication with a measured data provider and comprising a data processo...  
WO/2023/165823A1
An inspection apparatus includes a radiation source, an optical system, and a detector. The radiation source is configured to generate a beam of radiation. The optical system is configured to receive and direct the beam along an optical ...  
WO/2023/160972A1
A height measurement sensor comprising projection and detection units. The projection unit comprises a radiation source and a projection grating comprising a projection grating spot having a plurality of grating lines, the projection gra...  

Matches 1 - 50 out of 11,988