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JP2011199529A |
To provide a manufacturing method for an ultrasonic sensor, the ultrasonic sensor, and a banknote handling apparatus comprising the ultrasonic sensor, capable of easily changing the resolution of the sensor.First conductive layers (632, ...
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JP2011193895A |
To provide an acoustic lens with little attenuation of ultrasonic waves, a manufacturing method for manufacturing the acoustic lens, an ultrasonic probe provided with the acoustic lens, and an ultrasonic diagnostic apparatus provided wit...
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JP4787630B2 |
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JP4787648B2 |
A first semiconductor chip includes a fixed electrode formed on a first semiconductor substrate and a plurality of first metal spacers formed on a first interlayer dielectric. A second semiconductor chip includes a vibrating electrode fo...
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JP4782143B2 |
A loudspeaker cone body made of plastic includes a base carrier material and a filler material. The base carrier material is selected to optimize overall flow, weight and stiffness. The filler material may be a nanomaterial that provides...
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JP2011187793A |
To provide a method for manufacturing a giant magnetostrictive element, which is used for an apparatus such as a head for an inkjet printer, a hearing aid using the giant magnetostrictive element as a vibration device, a bone conduction ...
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JP4777528B2 |
This invention is directed to a transducer comprising a lead-based single crystal wherein the crystal is diagonally oriented and has an effective coupling constant of at least 0.70. In one embodiment, the lead-based crystal has the formu...
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JP4778003B2 |
A multilayer ultrasonic transducer includes a multilayer piezoelectric substrate assembly (100) laminated with a first and a second piezoelectric substrate on top of each other, and having a first electrode node (42) and a second electro...
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JP4779023B2 |
A SMD microphone holder has an SMD microphone mounted within, and includes a cap body and cylindrical portion. The cap body is withstands a reflow temperature, and defines a cavity for mounting the SMD microphone therein. The cylindrical...
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JP4776956B2 |
The method of manufacturing a thin-film magnetic head in accordance with the present invention comprises the steps of forming a first magnetic pole layer; removing both sides in a track width direction of the first magnetic pole layer so...
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JP2011182299A |
To reduce manufacturing cost by enhancing the flexibility of design of a Q-value and sound pressure in an ultrasonic conversion device configured as an MEMS.An ultrasonic conversion device configured of an MEMS is provided with an ultras...
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JP4774394B2 |
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JP4771290B2 |
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JP2011176420A |
To provide a backing material for ultrasonic probe, which has a high attenuation factor of unneeded ultrasonic waves emitted backward from an ultrasonic vibrator configuring the ultrasonic probe, has proper acoustic impedance and is hard...
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JP4764836B2 |
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JP4769127B2 |
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JP4766112B2 |
An ultrasonic sensor with stabilized transmitting/receiving characteristics capable of achieving a desired directivity easily and at low cost and a method for manufacturing the same are provided. An ultrasonic sensor 10 includes a base 1...
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JP2011172038A |
To prevent a sensitivity from becoming instable in a capacitor microphone configured by cutting out a vibrating film sub-assembly, a spacer and an annular member from a layered aggregate sheet as a layering unit.Projections 30b, 24b are ...
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JP4764057B2 |
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JP4758634B2 |
Methods for preparing a multi-layer acoustic transducer with reduced total electrical impedance. The methods are based on the stacking of individual piezoelectric layers with metallized surfaces to form a plate in which the metal layers ...
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JP2011166365A |
To provide a piezoelectric sounding device which is excellent in sound pressure characteristic, with a vibration film and a piezoelectric element hard to peel from each other.The piezoelectric sounding device includes a vibration film of...
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JP4751057B2 |
A condenser microphone includes a housing and a microphone unit arranged within the housing. The microphone unit includes an annular retainer oriented in confronting relation to the front end wall of the housing, a movable diaphragm conn...
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JP4742941B2 |
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JP4743130B2 |
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JP4746302B2 |
Disclosed is an ultrasonic transducer which is composed of a plurality of piezoelectric elements having an electrode on each of two opposite surfaces, an acoustic matching layer arranged on the first surface that is one of the two opposi...
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JP4742972B2 |
A microphone manufacturing method that includes forming an etching protective film on a surface of a semiconductor substrate, opening an etching window through the etching protective film, and forming a sacrifice layer in the etching win...
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JP4746291B2 |
A capacitive micromachined ultrasonic transducer (cMUT) at least including a silicon substrate, a bottom electrode mounted onto the silicon substrate, a upper electrode mounted facing the bottom electrode and apart therefrom by a predete...
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JP4743108B2 |
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JP4742940B2 |
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JP4737546B2 |
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JP4737720B2 |
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JP4737719B2 |
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JP4741432B2 |
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JP4737721B2 |
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JP4737535B2 |
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JP4740728B2 |
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JP4740734B2 |
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JP2011522456A |
A composite microphone comprises a flexible and stretchable substrate (22, 122, 250, 350, 450) with a grid of flexible and stretchable first and second conductors (31a,...,31e, 131a, 131g; 33a,...,33h, 133a, 133g). The first conductors (...
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JP4731444B2 |
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JP4727631B2 |
A microphone assembly is provided. An apparatus for fabricating the microphone assembly includes a lower mold attached to a bottom surface of a printed circuit board (PCB) on which a microphone chip is mounted, an upper mold installed on...
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JP4726500B2 |
An acoustic passive radiator that controls "rocking mode" vibration. An acoustic passive radiator includes a diaphragm for radiating acoustic energy. The diaphragm has a perimeter portion and a central portion. The perimeter portion is t...
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JP4727953B2 |
To provide an inexpensive ultrasonic transducer with high reliability relative to electric connection realizing miniaturization and suppressing thermal damage received by an electrical mechanical conversion element when the electric mech...
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JP4730162B2 |
In an ultrasonic transducer including a gap between an upper electrode 18 and a lower electrode 14 on a silicon substrate 11, it is made possible to reduce or adjust warpage of an above-gap membrane vibrated by electrostatic actuation du...
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JP4729290B2 |
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JP2011139267A |
To provide a piezoelectric sounding device in which a short-circuit failure is hard to occur.The piezoelectric sounding device has: a base which has a vibrating membrane and an external part of the vibrating membrane which is thicker tha...
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JP4724501B2 |
An ultrasonic transducer includes a first electrode, a second electrode, an insulating film disposed between the first and second electrodes, and a cavity disposed between the first and second electrodes. The insulating film includes a p...
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JP4720583B2 |
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JP4724505B2 |
A technique capable of obtaining an ultrasonic transducer at high sensitivity in which a plurality of ultrasonic oscillators M1 each comprising a lower electrode fixed above a substrate, a diaphragm opposed to the substrate with a cavity...
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JP4715260B2 |
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JP4717634B2 |
A ceramic porous body which is produced through the step of gelating a bubble-containing ceramic slurry containing at least one kind of hardly-sinterable powder within a mold to obtain a gel porous molded body, drying and degreasing the ...
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