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JP4557412B2 |
A diaphragm is gained by the co-moulded of a dome part, a voice coil junction part, a cone part and a peripheral part through the injection mould of thermoplastic resin. The thickness of the central part of the dome is made great so that...
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JP2010219874A |
To provide an acoustic electronic component comprising a wire pad having high bonding reliability, and to provide a method of manufacturing the same.An acoustic electronic component comprises: a mount substrate 101; a wafer chip 102 disp...
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JP4553278B2 |
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JP4553377B2 |
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JP4541761B2 |
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JP4539450B2 |
A vibration electrode plate 112 is formed on the upper face of a silicon substrate 32 with an insulating coat film 35 interposed in between. An opposing electrode plate 113 is placed on the vibration electrode plate 112 with an insulatin...
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JP4541228B2 |
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JP4539421B2 |
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JP4541227B2 |
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JP4534094B2 |
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JP4534173B2 |
A speaker includes a magnetic circuit forming a slit-like magnetic gap, a frame that houses and holds the magnetic circuit, a diaphragm attached to the frame so as to be capable of vibrating, a voice coil unit that is placed so as to pas...
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JP4535046B2 |
A method for manufacturing a capacitance sensor comprises the steps of (a) depositing a film to be a diaphragm forming a moving electrode, (b) heating the film to be the diaphragm to a first temperature, and (c) depositing a film to be a...
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JP2010528831A |
The present invention relates to a transducer device (10), comprising: an acoustic membrane (14); a piezoelectric element (12) mounted to the acoustic membrane; two oppositely arranged elastic damping elements (16a, 16b) between which a ...
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JP2010187163A |
To provide a diaphragm for an electric acoustic converter, which has acoustic characteristics required for a loudspeaker diaphragm of a compact electronic device, heat resistance, durability and light resistance; and to provide a laminat...
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JP2010187384A |
To provide a capacitor with improved reliability of humidity resistance or the like.A capacitor includes a first film 102 formed to cover a through-hole 123 of a semiconductor substrate 100, and a second film 115 formed to face the first...
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JP4531980B2 |
An ultrasonic transducer and method of making the same is disclosed comprising applying a sacrificial material to a substrate (20), applying a polymer coating (24) over at least part of the sacrificial layer and the substrate (20), and r...
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JP4528606B2 |
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JP2010171775A |
To solve the problem that precision of a gap is poor and acoustic characteristics vary in an ECM which regulates the gap between a rear electrode substrate and a vibrating membrane using a conventional spacer block of three-layered struc...
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JP2010171901A |
To provide a capacitor microphone which is stable in quality without any variation in performance by eliminating air bubbles in an adhesion layer for bonding a diaphragm and a diaphragm holder to each other to prevent an interval between...
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JPWO2008143191A1 |
The MEMS (Micro Electro Mechanical Systems) sensor of the present invention includes a base layer and a deformed portion provided on the base layer at intervals from the base layer and deformed by an external force. The deformed portion ...
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JP4518243B2 |
A vibrating plate for a speaker, includes: a magnesium vibrating plate whose major component is magnesium; and an edge comprising a resin in which an inner peripheral edge of the edge is bonded to an outer peripheral edge of the magnesiu...
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JP4519259B2 |
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JP4516451B2 |
Ultrasonic transducers disposed at a head of an ultrasonic probe are joined to a flexible sheet having a curved surface shape. Through holes are formed in the flexible sheet. The through hole is filled with conductive paste for electrica...
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JP4519328B2 |
The present invention provides an transducer and a method of making the same. The transducer is comprised of a plurality of transducer cells, and conductive interconnects between the cells. Each transducer cell contains a bottom electrod...
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JP4514947B2 |
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JP4513490B2 |
To prevent an occurrence of failure by inhibiting short-circuiting an electrode face and a terminal board by both ends of thread-like welding dust generated at the time that a case and the terminal board are joined by electric welding, w...
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JP4514040B2 |
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JP2010158522A |
To provide a probe for ultrasonic diagnostic apparatus and a method for manufacturing the same. The probe for ultrasonic diagnostic apparatus includes: a sound absorbing layer which is provided with a first electrode part; a piezoelectri...
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JP4508725B2 |
To provide a piezoelectric single crystal device actively utilizing an electromechanical coupling factor k31in a direction (transverse vibration mode) orthogonal to a polarization direction. A normal line 1 of a piezoelectric device end ...
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JP4505672B2 |
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JP2010155306A |
To prevent the occurrence of cracks in a stationary film in a MEMS device. The MEMS device includes: a substrate 10 having a through-hole 15; a first film 11, whose bottom surface is exposed into the through-hole 15, disposed on the uppe...
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JP4502325B2 |
To provide an ultrasonic horn in which an ultrasonic output side end is formed while having a titanium oxide layer doped with carbon in the state of Ti-C bond and functioning as a visible light response photocatalyst excellent in durabil...
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JP4504255B2 |
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JP4504540B2 |
To provide an ultrasonic oscillator in which sound pressure distribution can be made uniform. The ultrasonic oscillator comprises a piezoelectric element 2 produced by molding a piezoelectric material into a specified planar shape, and a...
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JP4503347B2 |
A manufacturing method for an ultrasonic probe including the steps of forming a plurality of unit fixing plates. Laminating each unit fixing plates to one another to form a fixing base and inserting lead wires into grooves formed in the ...
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JP4503423B2 |
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JP2010154477A |
To obtain a method for fabricating a condenser microphone unit that keeps a place necessary for preventing frequency-response deterioration to be airtight, a condenser microphone unit fabricated by the fabricating method, and a condenser...
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JP4496977B2 |
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JP2010147526A |
To provide a method of manufacturing electroacoustic conversion diaphragms, wherein the modulus of elasticity and loss factors are adjusted and acoustic characteristics are excellent. A functional group subjected to hydrogen bonds with p...
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JP4491644B2 |
There is provided a speaker that uses a waterproof vibration plate that is obtained by forming a water repellent layer containing wax on a surface of paper pulp by the use of a wax-based emulsion in a suspension of the paper pulp, then f...
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JP2010136807A |
To provide an ultrasonic probe without cost increase, keeping the size and acoustic crosstalk between piezoelectric elements of a piezoelectric element array.A first piezoelectric element having electrodes at both surfaces are arranged d...
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JP2010141870A |
To downsize a silicon microphone module arranged with a rhombus electronic component 4 and a rectangular electronic component 5 on a rectangular board 2. The silicon microphone module arranged with a rhombus electronic component 4 and a ...
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JP4486127B2 |
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JP4482372B2 |
A method for manufacturing an electroacoustic transducer diaphragm of a multilayered structure which includes a first diaphragm layer made from a synthetic resin material and molded into a predetermined shape through injection molding, a...
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JP4476058B2 |
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JP4475993B2 |
[Problems] To accurately tune the vibration frequency of a suspension during assembly. [Means for solving problems] Secured positions 3e where a magnetic circuit part 2 is secured to a suspension 3 are provided near to each other. From a...
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JP2010119846A |
To provide a probe for an ultrasound system, and a method of manufacturing the same.The probe includes a sound blocking layer, a piezoelectric member joined to the sound blocking layer, and a unidirectional conduction part joined to at l...
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JP4472613B2 |
To enable directive sound collection and stereo sound collection which are highly accurate and stable with a sole small microphone device. MEMS sound connection elements 11a, 11b to be manufactured using an MEMS technique and excellent i...
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JP4471026B2 |
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JP4471856B2 |
A technology capable of preventing the degradation of operation reliability of CMUT when a lower electrode for CMUTs arranged in an array is divided in order to control the CMUTs independently is provided. Also, a technology capable of p...
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