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JP4903850B2 |
A method for manufacturing electret diaphragms is provided. First, a dielectric film is attached to a frame by an adhesive material and a fastening element grips the peripheral area of the dielectric film on the frame. Afterward, the die...
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JP4900066B2 |
A method of manufacturing an ultrasonic sensor including a case, a piezoelectric element having first and second electrodes, and a conductive member having first and second conductive parts is disclosed. The method includes the steps of ...
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JP2012054843A |
To provide an air ultrasonic sensor provided with a matching layer having an optimal shape and dimension for acquiring a high transmitted wave signal strength and an SN ratio, and a shape determining method thereof.As for a determining m...
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JP2012045659A |
To prevent warp and damage of a substrate due to internal stress of an insulation layer caused by annealing without increasing an additional step in a manufacturing process of a MEMS transducer.In order to form a contact hole reaching a ...
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JP2012040619A |
To provide a capacity type MEMS sensor that does not require an additional process for forming a projection, and to provide a method of manufacturing the same.A sacrifice layer 14 and a fixed electrode 15 are laminated on a diaphragm fil...
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JP2012044288A |
To provide an easy manufacturing method of an electrodynamic speaker using a speaker diaphragm in which a dust cap for closing one end of a voice coil bobbin is integrally formed, and capable of reducing the number of required manufactur...
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JP2012044575A |
To provide a thin electrodynamic speaker which is excellent in sound reproduction capability and is suitable for being attached to an apparatus such as a display, a manufacturing jig therefor, and a manufacturing method therefor.An elect...
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JP2012039197A |
To provide an electromechanical conversion device which enables an electromechanical transducer to be mounted on a circuit board with a warp of the transducer corrected, and a manufacturing method of the same.In the electromechanical con...
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JP2012039406A |
To provide a method for manufacturing a microphone which can manufacture a high quality microphone of a parallel plate type having a movable electrode and a fixed electrode.The microphone is of a parallel plate type which has a first ele...
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JP4880878B2 |
The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating dev...
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JP2012034338A |
To provide a speaker excellent in assembly workability and capable of making thinner without impairing input resistance and low-pitched sound reproduction capability.In a speaker 1, a frame is divided into a first frame 3 and a second fr...
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JP4875733B2 |
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JP4869257B2 |
In k31 mode, a vibration is along an axis or orthogonal to the poling or electric field orientation. The direction of vibration is toward a face of an ultrasound transducer array. For each element of the array, electrodes are formed perp...
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JP4869358B2 |
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JP4866239B2 |
An improved driver assembly for a panel loudspeaker includes a retaining element for locating the voice coil with respect to the magnet assembly and forming a surface for removable attachment of the driving assembly to a radiating member...
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JPWO2010018694A1 |
The present invention provides an organic piezoelectric material film having few foreign substances and excellent piezoelectric properties. The organic piezoelectric material film of the present invention is a method for producing an org...
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JP4859253B2 |
A circuit board with hollow space portion and method for manufacturing the same, uses two substrates to constitute a hollow space portion therein. The invention includes: a first circuit pattern 17 formed by the conductive foil 20a on th...
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JP4861790B2 |
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JP4856918B2 |
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JP2012004326A |
To provide a converter module which has a converter and a rectangle semiconductor substrate on a rectangle substrate, and can achieve miniaturization and cost reduction.The converter module comprises a substrate 2 having a rectangular sh...
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JP4846773B2 |
The method of manufacturing a thin-film magnetic head in accordance with the present invention comprises the steps of forming a first magnetic pole layer; removing both sides in a track width direction of the first magnetic pole layer so...
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JP4844411B2 |
An electrostatic ultrasonic transducer includes a first electrode that has through-holes, a second electrode that has through-holes, and a vibrating membrane that is disposed such that the through-holes of the first electrode and the thr...
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JP4846710B2 |
A piezoelectric speaker comprises a plurality of diaphragms, connecting components, and piezoelectric elements. The plurality of diaphragms are each formed by a laminated material in which a core layer made of an insulating material is l...
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JP2011259371A |
To provide a manufacturing method of a capacitive electromechanical transducer capable of removing a sacrificial layer for cavity formation at a relatively high speed while reducing residues.Provided is a manufacturing method of a capaci...
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JP2011259186A |
To provide a capacitance type electromechanical converter that can improve the reliability of bonding of a partition wall defining the outer periphery of an air gap and a diaphragm, and to provide a method of manufacturing the same.The c...
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JP4843607B2 |
The present invention concerns a capacitor microphone comprising a microphone housing having a sound inlet opening, a diaphragm and a counterpart electrode which is associated with the diaphragm and which is arranged at a small spacing r...
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JP2011254361A |
To provide an acoustic diaphragm which can be manufactured at low cost and which is capable of increasing internal loss in spite of light weight.An acoustic diaphragm has elastic-modulus anisotropy. The acoustic diaphragm is constituted ...
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JP2011254281A |
To provide a manufacturing method of a capacity type electromechanical conversion apparatus, and a capacity type electromechanical conversion apparatus capable of etching a sacrifice layer comparatively at high speed not depending on spr...
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JP4837708B2 |
To provide an electronic component that does not require to be covered with a metal cap, and has an MEMS structure which is not destroyed and which is exposed. An MEMS chip 42 and an electronic circuit chip 43 which are die bonded on a s...
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JP4838781B2 |
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JP2011244304A |
To provide a manufacturing method for a piezoelectric type speaker which can manufacture a piezoelectric type speaker easily.A manufacturing method for a piezoelectric type speaker comprises: a piezoelectric element layer formation proce...
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JP2011244226A |
To detect a defective element from a plurality of elements arranged in an array shape in a package in a manufacturing process of a transducer.In a manufacturing method of the transducer where a plurality of conversion elements of capacit...
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JP2011244425A |
To provide an electromechanical transducer and its manufacturing method whose reliability is improved by encapsulating a sealed cavity with a highly-airtight encapsulation structure.The electromechanical transducer comprises a first elec...
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JP2011228783A |
To provide an acoustic member equipped with an edge to which it is not necessary to perform a cutting operation after molding of the edge and in which satisfactory product characteristics are maintained.There is provided a method for man...
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JP4812378B2 |
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JP4812139B2 |
A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is...
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JP4804961B2 |
A micromachined ultrasound transducer including a plurality of ultrasound transducer cells each of which includes a substrate on which a bottom electrode is formed, and a membrane provided apart from the substrate and having an upper ele...
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JP2011217281A |
To manufacture a center holding member which is easy to be manufactured, excellent in low-temperature reproduction capability and durability, coldness resistance and heat resistance.At least one surface of a reinforcing material 1 compri...
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JP2011217160A |
To increase a harmonic component, and at the same time, attenuates a fundamental wave component when transceiving the harmonic wave using a multilayer piezoelectric body.When transmitting/receiving a third harmonic wave using a three-lay...
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JP4801098B2 |
A micromechanical component having a conductive substrate, an elastically deflectable diaphragm including at least one conductive layer, which is provided over a front side of the substrate, the conductive layer being electrically insula...
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JP4800170B2 |
A technology capable of improving receiver sensitivity and improving insulation withstand voltage in an ultrasonic transducer is provided. An ultrasonic transducer comprises: a lower electrode 301; an insulator 302, 304, 305, 307, 309 co...
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JP2011211640A |
To suppress a molten gasket from flowing out of an edge, even if the gasket is melted, when the edge is fabricated.During injection molding of an edge 13, a molten resin is flown along a plurality of continuous surfaces 12a and 12b among...
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JP2011210865A |
To provide a method of manufacturing a porous resin sheet for a piezoelectric element and a pyroelectric detector having superior piezoelectric capacity, and to provide the porous resin sheet for the piezoelectric element and the pyroele...
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JP2011211577A |
To reduce occurrence of a poor gap in a miniaturized and highly input resisted speaker.The manufacturing method of the speaker has a process of assembling of a magnetic circuit and the frame under the following condition. While the upper...
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JP2011211639A |
To provide a method of manufacturing an acoustic diaphragm, capable of preventing peeling of a joining interface between a diaphragm and an edge in order to improve durability.The method is provided for manufacturing the acoustic diaphra...
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JP4796543B2 |
A capacitive ultrasonic transducer (36) includes a flexible layer (39), a first conductive layer (31) on the flexible layer, a support frame (35) on the first conductive layer, the support frame including a flexible material, a membrane ...
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JP4795712B2 |
A Vibration system part (7,8,9,10) for a speaker device (100) includes a woven fabric or a non-woven fabric made of basalt fiber produced by twist yarn or roving yarn being a continuous long-fiber. The vibration system part for the speak...
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JP4797829B2 |
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JP4791534B2 |
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JP4789856B2 |
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