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JP4468280B2 |
To enable directive sound collection and stereo sound collection which are highly accurate and stable with a sole small microphone device. MEMS sound collection elements 11a, 11b excellent in high accuracy and stability which are manufac...
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JP2010114625A |
To prevent a rigid substrate from being cracked when electrically connecting many two-dimensionally arranged piezoelectric elements to the dominant rigid substrate made of silicon or the like at narrow pitch.Inter-element filler layers 7...
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JP4463455B2 |
Currently, in a process of manufacturing a top spin valve structure, the shield-to-shield separation of a spin valve head cannot be below about 800 Å, mainly due to sensor-to-lead shorting problems. This problem has now been overcome by...
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JP2010109416A |
To prevent foreign matters from entering a gap layer between diaphragms and a plate while suppressing parasitic capacitance.A cover 161 and the plate 162 are insulated from each other through a slit S formed between the cover and plate, ...
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JP2010103734A |
To effectively suppress an adverse effect on a microphone function which may be caused by leakage of an adhesive from an adhesive area, while securing adhesive strength between substrates in a method for manufacturing microphones each of...
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JP2010103735A |
To effectively suppress an adverse effect on a microphone function due to pressing during adhesive fixing while sufficiently securing adhesive strength between substrates in a method for manufacturing microphones each of which has a mult...
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JP2010514172A |
A microphone assembly includes a carrier, a silicon-based transducer, a conducting element, and an underfill agent. The carrier has a first surface holding an electrical contact element. The silicon-based transducer includes a displaceab...
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JP2010098518A |
To provide a method of manufacturing an MEMS sensor that prevents a protective film made of a nonmetallic material from being undesirably etched, and to provide the MEMS sensor.On one surface of a silicon wafer W, a first sacrificial lay...
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JP2010098558A |
To provide a method of manufacturing an ultrasonic transducer, and an acoustic lens material, achieving high production efficiency and easy production management while preventing deformation of an acoustic lens using an adhesive with a u...
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JP4457487B2 |
The method manufacturing a loudspeaker comprising: continuously forming diaphragm portions and alignment portions on a band resin film; positoning one of a frame and a protector to an upper die or lower die; aligning other alignment port...
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JP4458259B2 |
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JP2010087965A |
To eliminate sound axis deviation when creating an organic/inorganic multi-layered ultrasonic vibrator.In an ultrasonic vibrator 31 configured by layering an organic piezoelectric element 34 on an inorganic piezoelectric element 33, when...
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JP2010087925A |
To provide a speaker member having high persistence in resultant modification effects by modifying the speaker member so as to have excellent wettability and rigidity.The speaker member is provided by irradiating a thermoplastic resin wi...
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JP2010087623A |
To provide a drive unit manufacturing method capable of enhancing product quality more than usual while reducing burden on manufacturers, and to provide a drive unit.The drive unit manufacturing method includes: a conducting wire arrangi...
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JP4449291B2 |
To realize smoothness, to uniformize adhesive strength, and to improve ultrasonic sensor sensitivity, by applying a polymer material on a recessed part on the whole surface of a matching layer comprising a mixture of a hollow sphere and ...
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JP4450088B2 |
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JP4448702B2 |
A production method of a suspension board with circuit that can reduce variations in diameter of the location holes or like holes formed in the suspension board and can produce a trim contour of the suspension board. In the process of fo...
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JP4451104B2 |
To provide a manufacturing method of a PZT piezoelectric crystal film having broad-band frequency characteristics and to provide an ultrasonic transducer. In the manufacturing method, a PZT piezoelectric crystal film 2 is formed by depos...
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JP4448070B2 |
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JP2010074523A |
To provide a method of etching a sacrificial layer that suppresses damage to a coating film due to etching when the sacrificial layer coated with the coating film is etched, to provide a method of manufacturing a MEMS device using the et...
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JP4443785B2 |
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JP4436580B2 |
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JP4439710B2 |
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JP4439283B2 |
An oval speaker apparatus includes a diaphragm whose outer peripheral shape in a plan view is oval or elliptical; an oval or elliptical voice coil for driving the diaphragm; an edge which is joined to an outer periphery of the diaphragm;...
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JP4433378B2 |
An acoustic backing preform having an array of holes is formed. An electrically conductive film is deposited onto the one side of acoustic backing preform and onto the surfaces of the holes, to form a acoustic backing layer (14). The bac...
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JP2010507932A |
A phased ultrasound array for an ultrasound generating device. In one embodiment, the array includes a plurality of ultrasound elements arranged symmetrically about a point or dividing line in the array with respect to element size, shap...
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JP4429090B2 |
A speaker diaphragm and a method of fabricating the same with the reduced number of fabrication steps and high production efficiency, from which a stable rust-proof effect can be expected without generating any variation in rust resistan...
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JP4426513B2 |
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JP2010506532A |
A sensor for acoustic applications such as a silicone microphone is provided containing a backplate provided with apertures and a flexible diaphragm formed from a silicon on insulator (SOI) wafer which includes a layer of heavily doped s...
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JP4420104B2 |
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JP4420054B2 |
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JP2010040656A |
To provide a semiconductor package that effectively and electromagnetically shields a semiconductor chip stored inside as a premolded type package, and that is effective in cost reduction, wherein package body and cover body are both sup...
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JP2010041548A |
To provide a fixture for manufacturing a speaker, for ensuring compatibility between a narrow gap in performance and a decreasing defective rate in quality, and reducing a manufacturing cost.The fixture 10 is used to assemble a speaker 1...
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JP2010041638A |
To improve quality by enabling presence/absence of wire non-delivery between a MEMS chip GND and a substrate GND to be detected in 100% in a MEMS microphone and performing screening.In order to detect presence/absence of non-delivery of ...
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JP4416003B2 |
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JP4416002B2 |
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JP4415850B2 |
To improve the reliability of an ultrasonic wave transmitter receiver such that a case having a piezoelectric body fixed to a top wall internal surface and a terminal plate are joined together by electric welding by preventing the piezoe...
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JP4415882B2 |
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JP4411982B2 |
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JP4414809B2 |
A method for manufacturing a diaphragm for use in an electroacoustic transducer in a multi-layer structure which includes a first diaphragm layer of synthetic resin molded in a predetermined shape by injection molding and a second diaphr...
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JP4407767B2 |
An ultrasonic sensor in which vibration of a piezoelectric element is not easily damped, which has high positional accuracy at end portions of terminals, and which is resistant to external stress is provided. A ultrasonic sensor 10 inclu...
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JP2010021812A |
To provide a piezoelectric vibrator having little variations in eigenfrequency.A piezoelectric vibrator is manufactured by first fabricating piezoelectric ceramics by forming electrodes on a ceramics board and applying polarization proce...
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JP2010021823A |
To provide a method of assembling a speaker having excellent durability and a high durable speaker.In the method of assembling the speaker, a diaphragm or frame composed of a damp curing bonding agent composition containing (1) a polymer...
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JP2010016679A |
To provide a condenser microphone unit constituted so as to prevent generation of noise by electrically connecting a gate terminal of an FET on the fixed pole side without interposing an agglomeration flux; and to provide a method of man...
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JP4401958B2 |
There is described a micromachined ultrasonic transducers (MUTS) and a method of fabrication. The membranes of the transducers are fusion bonded to cavities to form cells. The membranes are formed on a wafer of sacrificial material. This...
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JP2010010834A |
To solve a problem wherein, in a conversion element for which an opening of a shape including a straight line is formed on a substrate and a vibration film is jointed to form a cavity, there is a risk of lowering of a yield due to cleava...
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JP2010010791A |
To provide a magnetic circuit for speaker of an almost even magnetic flux density in an amplification area of a voice coil with a simple structure, to provide a speaker of high sound quality of acoustic characteristic, and to easily manu...
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JP4396975B2 |
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JP2010004199A |
To provide a technique which achieves a high transmission sound pressure and a high receiving sensitivity in a capacitive maicromachined ultrasonic transducer (CMUT).An opening portion 7a having a diameter of, for example, about 10 m is ...
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JP4392466B1 |
A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap being interposed therebetween. The semico...
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