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JP5026596B2 |
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JP5022198B2 |
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JP2012169887A |
To provide a method for manufacturing a diaphragm edge, which prevents the diaphragm edge from being broken due to its thinness and greatly improves acoustic properties, when the thin-walled diaphragm edge is manufactured.Injection gates...
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JP5016884B2 |
A method for improving productivity when manufacturing a semiconductor device. A lower electrode, insulating films, an upper electrode and insulating films are formed on a semiconductor substrate in a sensor region. A cavity is formed be...
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JP5015027B2 |
A ribbon for a ribbon microphone having a magnet forming a magnetic gap, the ribbon which is arranged in the magnetic gap and is vibrated by a sound wave, an electrode for outputting an electric signal which is generated when the ribbon ...
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JP5013902B2 |
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JP5006989B2 |
In an arrangement of at least one piezoacoustic resonator on a substrate surface, the resonator has an piezoelectric layer, an electrode and a further electrode arranged such that activation of the electrodes leads to a resonance oscilla...
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JP5006221B2 |
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JP4999899B2 |
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JP5002033B2 |
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JP2012151583A |
To provide a piezoelectric type actuator capable of providing a large output with a small mounting area.The piezoelectric type actuator includes a plurality of first flexible parts arrayed in a first direction parallel to each other, a s...
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JP4995926B2 |
A method of fabricating an optical structure on an optical fiber is provided. In a first step, the end of the end of the optical fiber is prepared. In a second step, a dielectric layer is formed onto the fiber end. In a third step, the d...
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JP4997173B2 |
According to the invention, in an electroacoustic transducing device comprising: a magnetic circuit 13 having a yoke 4, a magnet 11, and a pole piece 12; a vibration system 16 having a diaphragm 14 and a voice coil 15; and a frame 1 whic...
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JP2012517183A |
The present invention relates to a fabrication method of a silicon condenser microphone having an additional back chamber. The method of the present invention comprises: applying an adhesive to a substrate and then mounting a chamber cas...
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JP4981847B2 |
It becomes possible to obtain high sound pressure in a high frequency domain by a capacitive ultrasonic transducer which comprises a membrane 9 on which one electrode 7 is formed, a cavity 13 constructed in its backface, and a substrate ...
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JP4981913B2 |
The component with a micro electromechanical system (MEMS) microphone has a housing for a chip with a hollow space with a sound entry opening closed from within by the chip. Surface mounted technology (SMT) contacts are at the under side...
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JP4977379B2 |
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JP4979283B2 |
The performance of a sensor in a semiconductor device can be improved. A plurality of oscillators forming an ultrasonic sensor are arranged on a main surface of a semiconductor chip. A negative-type photosensitive insulating film which p...
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JP4981186B1 |
To make it possible to reduce the size, weight and thickness without significantly reducing the driving ability, and to reduce the overall driving current. A diaphragm 13 attached to a frame member 11 having a predetermined shape via a d...
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JP4975265B2 |
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JP4971431B2 |
A method is provided for producing a micromechanical component and a micromechanical component is provided, particularly a microphone, a micro-loudspeaker or a pressure sensor (an absolute pressure sensor or a relative pressure sensor) h...
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JP4974731B2 |
To provide a ribbon microphone unit constituted so that rise of electric resistance by installation and fixing of the edge of a ribbon-shaped diaphragm may be avoided and that electric connection and mechanical junction in the installati...
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JP2012129595A |
To provide an ultrasonic probe, along with a method of manufacturing the ultrasonic probe, capable of providing an ultrasonic image of high definition by reducing the effect of unwanted reflection from a reflecting layer while widening a...
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JP4966370B2 |
The invention relates to an acoustic micro-electrical-mechanical-system (MEMS) transducer formed on a single die based on a semiconductor material and having front and back surface parts opposed to each other. The invention further relat...
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JP4965346B2 |
To provide an electret capacitor microphone unit which is increased in sensitivity by press-fitting a fixed electrode in an insulating member, and to provide a manufacturing method thereof. The electret capacitor microphone unit includes...
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JP4961362B2 |
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JP2012514417A |
A method of making an ultrasound transducer includes providing a piezoelectric crystal of PIN-PMN-PT (lead indium niobate-lead magnesium niobate-lead titanate) and etching kerfs into the piezoelectric crystal using a laser. In at least s...
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JP2012114672A |
To provide a MEMS microphone module which can sufficiently absorb a stress and have excellent sensitivity even when a nozzle having a small internal diameter is used or adhesive bond having low viscosity is used to prevent the nozzle fro...
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JPWO2010073836A1 |
To provide a speaker unit capable of preventing a wiring portion from being disconnected or colliding with another member, a method for manufacturing the speaker unit, and a portable information terminal. A frame 31 has terminals 61 and ...
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JP2012114539A |
To solve problems with using lead wires and solve the problem of vibration leakage to terminals.An ultrasonic sensor 101 includes a piezoelectric element 30 capable of ultrasonic vibration by application of a driving voltage, and a resin...
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JP2012114778A |
To provide a speaker unit that includes: a frame; and a pair of spring terminals that includes a bent part in which an intermediate part can be folded, and in which a fixing part is formed on one side through the bent part and a terminal...
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JP4952209B2 |
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JP4950006B2 |
In the present invention, a plurality of condenser microphones is formed on a substrate. Then, charges are fixed to a dielectric film provided in each of the condenser microphones. After an amount of deposited charges of the dielectric f...
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JP4952487B2 |
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JP4946796B2 |
A vibration transducer (or a pressure transducer) is constituted of a cover, a plate, a diaphragm, and a substrate having a back cavity. The diaphragm is positioned above the substrate so as to cover the opening of the back cavity. The p...
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JP2012105170A |
To provide a piezoelectric type transducer having excellent sound pressure characteristics in which an elastic film is not easily peeled from a piezoelectric element.A piezoelectric type transducer (1) includes an elastic film (13) forme...
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JP4939999B2 |
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JP4941998B2 |
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JP4939256B2 |
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JP4933392B2 |
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JP4929753B2 |
A method for forming a thin film structure, which has small tensile stress due to controlled mechanical stress, and is made to be conductive, is provided. A lower film including polysilicon thin film is formed on a substrate such as Si s...
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JP4926724B2 |
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JP2012085515A |
To provide a charging device and a charging method for partially charging an electret by corona discharge treatment and capable of sufficiently increasing a potential difference between a charging region and non-charging region of the el...
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JP4913814B2 |
An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elem...
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JP4903850B2 |
A method for manufacturing electret diaphragms is provided. First, a dielectric film is attached to a frame by an adhesive material and a fastening element grips the peripheral area of the dielectric film on the frame. Afterward, the die...
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JP4900066B2 |
A method of manufacturing an ultrasonic sensor including a case, a piezoelectric element having first and second electrodes, and a conductive member having first and second conductive parts is disclosed. The method includes the steps of ...
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JP2012054843A |
To provide an air ultrasonic sensor provided with a matching layer having an optimal shape and dimension for acquiring a high transmitted wave signal strength and an SN ratio, and a shape determining method thereof.As for a determining m...
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JP2012045659A |
To prevent warp and damage of a substrate due to internal stress of an insulation layer caused by annealing without increasing an additional step in a manufacturing process of a MEMS transducer.In order to form a contact hole reaching a ...
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JP2012040619A |
To provide a capacity type MEMS sensor that does not require an additional process for forming a projection, and to provide a method of manufacturing the same.A sacrifice layer 14 and a fixed electrode 15 are laminated on a diaphragm fil...
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JP2012044288A |
To provide an easy manufacturing method of an electrodynamic speaker using a speaker diaphragm in which a dust cap for closing one end of a voice coil bobbin is integrally formed, and capable of reducing the number of required manufactur...
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