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Title:
DICING DIE-BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2010129700
Kind Code:
A
Abstract:

To provide a dicing die-bonding film excellent in balance in characteristics of retainability in dicing, peelability of a semiconductor chip and low staining property to a semiconductor wafer.

The dicing die-bonding film includes: a dicing film having an adhesive layer provided on a base material; and a die-bonding film provided on the adhesive layer, in which the adhesive layer of the dicing film includes a laminated structure of a heat-expandable adhesive layer containing a foaming agent and an active energy ray-curable antifouling adhesive layer on the heat-expandable adhesive layer, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. As the foaming agent, heat-expandable micro-balls are preferable.

COPYRIGHT: (C)2010,JPO&INPIT


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Inventors:
KAMIYA KATSUHIKO
OTAKE HIRONAO
MATSUMURA TAKESHI
MURATA SHUHEI
Application Number:
JP2008301558A
Publication Date:
June 10, 2010
Filing Date:
November 26, 2008
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H01L21/301; C09J5/08; C09J7/22; C09J7/38; C09J11/06; C09J133/06; C09J153/00; C09J163/00; C09J175/16; H01L21/52
Domestic Patent References:
JP2003089777A2003-03-28
JP2007077388A2007-03-29



 
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