Title:
積層体
Document Type and Number:
Japanese Patent JP5152429
Kind Code:
B2
Abstract:
A laminated body for use in device production is provided with which positioning can be performed precisely, peeling after production is smooth, and no peeling occurs during the production process. The laminated body is formed of an inorganic layer such as glass plate and silicon wafer, and a polyimide film obtained by reaction between an aromatic tetracarboxylic acid and an aromatic diamine and having a coefficient of linear expansion in a predetermined range, the inorganic layer and the polyimide film form a laminate without an adhesive layer therebetween, and the 180-degree peel strength between the polyimide film and the inorganic layer of the laminated body is within a predetermined range.
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Inventors:
Tetsuo Okuyama
Wakui Yoko
Takeshi Yoshida
Masayuki Tsutsumi
Atsushi Okamoto
Toshiyuki Tsuchiya
Goji Maeda
Wakui Yoko
Takeshi Yoshida
Masayuki Tsutsumi
Atsushi Okamoto
Toshiyuki Tsuchiya
Goji Maeda
Application Number:
JP2012168417A
Publication Date:
February 27, 2013
Filing Date:
July 30, 2012
Export Citation:
Assignee:
Toyobo Co., Ltd.
International Classes:
B32B15/088; B32B7/06; B32B17/10; B32B18/00
Domestic Patent References:
| JP2005131918A | ||||
| JP2007076231A | ||||
| JP2007242851A | ||||
| JP2008044230A | ||||
| JP2008135759A | ||||
| JP2008177503A | ||||
| JP2003101193A | ||||
| JP2002170431A | ||||
| JP2008227209A |
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