Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0613740
Kind Code:
A
Abstract:
PURPOSE: To prevent a flux and a solder, which creep from a slit part or a square hole part on a printed wiring board to the side of the surface of a component, from flowing in a circuit part when soldering by an automatic soldering device.
CONSTITUTION: A conductor 6, a solder resist 7 and a symbol print 8, which constitute a printed wiring board, and stacked on the periphery of a slit part or a square hole part 2, whereby a dam 5 surrounding the hole part 2 is formed.
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Inventors:
HASETSU SEIJI
YONEYAMA SHOICHI
YONEYAMA SHOICHI
Application Number:
JP19289392A
Publication Date:
January 21, 1994
Filing Date:
June 25, 1992
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/34; H05K1/02; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Hiroshi Murakami (1 outside)
Next Patent: CIRCUIT BOARD FOR SURFACE MOUNT COMPONENT