Title:
REINFORCED SOLDER BUMP AND METHOD OF FORMING REINFORCED SOLDER BUMP STRUCTURE
Document Type and Number:
Japanese Patent JP2005101614
Kind Code:
A
Abstract:
To provide a reinforced solder bump structure that prevents mechanical stresses caused by a difference of coefficients of thermal expansion between components during working on a final device, a crack that may occur in the solder bump material owing to thermal circulation, and crack propagation, and also to provide a method of forming the reinforced solder bump structure.
A method of manufacturing solder bumps comprises steps of: forming a first protrusion 311 extending upwardly from a contact pad 102 of a semiconductor chip 101; forming a second protrusion 312 extending upwardly from a ball pad of a mounting substrate 109; and forming the first protrusion 311 and second protrusion 312 within the solder material.
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Inventors:
JEONG SE-YOUNG
KIN NANSHAKU
OH SE YONG
KIM SOON-BUM
PARK SUN-YOUNG
RYU SHUGEN
LEE IN-YOUNG
KIN NANSHAKU
OH SE YONG
KIM SOON-BUM
PARK SUN-YOUNG
RYU SHUGEN
LEE IN-YOUNG
Application Number:
JP2004276006A
Publication Date:
April 14, 2005
Filing Date:
September 22, 2004
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01L21/60; B23K3/06; H01L23/485; H05K1/11; H05K3/34; H05K3/24; (IPC1-7): H01L21/60
Domestic Patent References:
| JPH04340240A | 1992-11-26 | |||
| JPH11297873A | 1999-10-29 | |||
| JPS5883150U | 1983-06-06 | |||
| JPH07211722A | 1995-08-11 | |||
| JP2001351946A | 2001-12-21 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe