Title:
THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2017071794
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition particularly excellent in adhesion strength to a copper foil, high chemical resistance, high heat resistance and low thermal expansion property, and a prepreg, a laminate and a printed wiring board using the resin composition.SOLUTION: A thermosetting resin composition is provided, which comprises (a) a maleimide compound having at least two N-substituted maleimide groups in the structure of one molecule, and (b) a silicone compound having at least one amino group in the structure of one molecule and having an amine equivalent of 500 or more and 2300 or less. A prepreg, a laminate and a printed wiring board using the above thermosetting resin composition are also disclosed.SELECTED DRAWING: None
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Inventors:
NAGAI SHUNSUKE
MIYATAKE MASATO
KOTAKE TOMOHIKO
HASHIMOTO SHINTARO
INOUE YASUO
TAKANEZAWA SHIN
MURAI HIKARI
MIYATAKE MASATO
KOTAKE TOMOHIKO
HASHIMOTO SHINTARO
INOUE YASUO
TAKANEZAWA SHIN
MURAI HIKARI
Application Number:
JP2016241129A
Publication Date:
April 13, 2017
Filing Date:
December 13, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L83/08; B32B5/28; B32B15/08; C08J5/24; C08K3/00; C08K5/13; C08K5/18; C08K5/3415; C08K5/3445; C08L101/02; H05K1/03
Domestic Patent References:
| JPH06145536A | 1994-05-24 | |||
| JP2010248473A | 2010-11-04 | |||
| JP5831463B2 | 2015-12-09 | |||
| JPH04211449A | 1992-08-03 | |||
| JPH06122765A | 1994-05-06 | |||
| JPS63230728A | 1988-09-27 | |||
| JPH11193328A | 1999-07-21 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama
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