ANTIMICROBIAL SUBSTANCE AND ANTIMICROBIAL MATERIAL

Title:

ANTIMICROBIAL SUBSTANCE AND ANTIMICROBIAL MATERIAL

Document Type and Number:

WIPO Patent Application WO/2023/063394

Kind Code:

A1

Abstract:

This antimicrobial substance comprises a base material and a copper-tin alloy layer that is disposed on the base material and that contains 60−90 at% of copper and 10−40 at% of tin with respect to a total of 100 at% of copper and tin, the thickness of the copper-tin alloy layer being 1−5 nm.

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Inventors:

ODAGAWA KENJI
FUKUMOTO HARUHIKO

Application Number:

PCT/JP2022/038231

Publication Date:

April 20, 2023

Filing Date:

October 13, 2022

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)

International Classes:

A01N59/20; A01P1/00; A01P3/00; A61L2/232; B32B15/08; C22C9/02; C22C13/00; C23C14/12

Foreign References:

JP2016013995A	2016-01-28
JP2021091631A	2021-06-17
JP2021014671A	2021-02-12
JP3163574U	2010-10-21
JPH09221347A	1997-08-26

Other References:

KANG YUJIN, PARK JUYUN, KIM DONG-WOO, KIM HAKJUN, KANG YONG-CHEOL: "Controlling the antibacterial activity of CuSn thin films by varying the contents of Sn", APPLIED SURFACE SCIENCE, vol. 389, 15 December 2016 (2016-12-15), Amsterdam , NL , pages 1012 - 1016, XP093056885, ISSN: 0169-4332, DOI: 10.1016/j.apsusc.2016.08.041

Attorney, Agent or Firm:

WASHIDA & ASSOCIATES (JP)

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