CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Title:

CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2013/015304

Kind Code:

A1

Abstract:

Provided are: conductive particles capable of suppressing the clumping of a plurality of conductive particles, and reducing the connection resistance between electrodes when used in the connection between electrodes; and a conductive material using the conductive particles. These conductive particles (1) have substrate particles (2), and a conductive layer (3) disposed on the surface of the substrate particles (2) and including at least one type of metal component selected from the following: nickel, boron, tungsten and molybdenum. This conductive material includes the conductive particles (1) and a binder resin.

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Inventors:

NISHIOKA KEIZO (JP)
OOTSUKA MASAHIRO (JP)

Application Number:

PCT/JP2012/068800

Publication Date:

January 31, 2013

Filing Date:

July 25, 2012

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)
NISHIOKA KEIZO (JP)
OOTSUKA MASAHIRO (JP)

International Classes:

H01B5/00; H01B1/20; H01B5/16; H01L21/60; H01R11/01

Foreign References:

JP2002075057A	2002-03-15
JP2008041671A	2008-02-21

Attorney, Agent or Firm:

MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)

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