DEVICE FOR DOUBLE-SIDED POLISHING AND METHOD FOR DOUBLE-SIDED POLISHING OF WORKPIECE

WIPO Patent Application WO/2015/072050

A1

This device for double-sided polishing of a workpiece is provided with: a turning lathe having an upper surface plate and a lower surface plate; a sun gear provided at the center of the turning lathe; an internal gear provided on the outer periphery of the turning lathe; and a carrier plate provided between the upper surface plate and the lower surface plate and having one or more holding holes for holding the workpiece. The device for double-sided polishing is further provided with a drip supply portion for supplying abrasive slurry between the upper and lower surface plates by natural dripping and a force-feeding supply portion for supplying abrasive slurry between the upper and lower surface plates by force-feeding, and the device for double-sided polishing is capable of simultaneously supplying abrasive slurry between the upper and lower surface plates from the drip supply portion and the force-feeding supply portion.

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MIKURIYA SHUNSUKE (JP)
MIURA TOMONORI (JP)

PCT/JP2014/004004

May 21, 2015

July 30, 2014

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SUMCO CORP (JP)

B24B37/00; B24B37/12; H01L21/304

JP2004142040A	2004-05-20
JP2000042912A	2000-02-15
JP2004249444A	2004-09-09
JP2007021680A	2007-02-01
JPH0745565A	1995-02-14

SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)

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