Title:
METALIZED MATERIALS
Document Type and Number:
WIPO Patent Application WO/2023/039834
Kind Code:
A1
Abstract:
Metalized materials are provided, in which the metalized materials include (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL); wherein the MCL is located directly or indirectly between the substrate and the TCL. Peelable metalized materials are also provided, in which the peelable metalized materials include a metalized material and a removable carrier layer located directly adjacent to the TCL. Methods for making peelable metalized materials and metalized materials are also provided.
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Inventors:
WU DONG (CN)
JIN YONGJI (CN)
FANG MINGLAN (CN)
JIN YONGJI (CN)
FANG MINGLAN (CN)
Application Number:
PCT/CN2021/119075
Publication Date:
March 23, 2023
Filing Date:
September 17, 2021
Export Citation:
Assignee:
NANHAI NANXIN NON WOVEN CO LTD (CN)
International Classes:
B32B27/00; B32B7/06; B32B7/12; B32B15/18; B32B37/12
Domestic Patent References:
| WO2007098016A1 | 2007-08-30 |
Foreign References:
| EP0038878A1 | 1981-11-04 | |||
| GB1504814A | 1978-03-22 | |||
| JP2009255294A | 2009-11-05 | |||
| CN202439296U | 2012-09-19 |
Attorney, Agent or Firm:
BEIJING WANHUIDA LAW FIRM (CN)
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