Title:
MULTILAYER SUBSTRATE AND JIG
Document Type and Number:
WIPO Patent Application WO/2023/127769
Kind Code:
A1
Abstract:
A pitch conversion module 2 is provided with: a plurality of double-sided substrates DS each having a first metal pattern MP1 formed on an upper surface, a second metal pattern MP2 formed on a lower surface, and a metal via MV connecting the first metal pattern MP1 and the second metal pattern MP2; and a first electrically conductive paste via CV1 formed of an electrically conductive paste connecting the first metal pattern MP1 and the second metal pattern MP2 between adjacent double-sided substrates DS in a double-sided substrate block DSB in which a plurality of double-sided substrates DS are stacked.
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Inventors:
SAKAI SHIGEKI (JP)
KIMURA KAZUO (JP)
YAGI MASANOBU (JP)
KIMURA KAZUO (JP)
YAGI MASANOBU (JP)
Application Number:
PCT/JP2022/047811
Publication Date:
July 06, 2023
Filing Date:
December 26, 2022
Export Citation:
Assignee:
NIDEC ADVANCE TECH CORPORATION (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2013186966A1 | 2013-12-19 |
Foreign References:
| JP2007173429A | 2007-07-05 |
Attorney, Agent or Firm:
KAJIHARA Kei (JP)
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