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Title:
SUBSTRATE SUPPORT MEMBER, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSPORT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/124119
Kind Code:
A1
Abstract:
This substrate support member which supports a substrate comprises a conduction part that has electrical conductivity and an inductor part that is provided on the outer side of the conduction part. The conduction part is provided with a contact support part which comes into contact with the substrate and supports the substrate; and a part of the conduction part, said part being opposite to the contact support part with the inductor part being sandwiched therebetween, is grounded directly or indirectly.

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Inventors:
HASHIMA HITOSHI (JP)
Application Number:
PCT/JP2018/045120
Publication Date:
June 27, 2019
Filing Date:
December 07, 2018
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/683; B65G49/07; H01L21/027; H01L21/677
Foreign References:
JPH06326180A1994-11-25
JPH01142181U1989-09-28
JPH01115186U1989-08-02
JP2000269038A2000-09-29
JP2016157822A2016-09-01
JP2001160463A2001-06-12
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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