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WO/2023/048113A1 |
This solder processing device comprises: a storage tank 110 which is for containing a molten solder S; and an extension part 210 which is at least partially immersed in the molten solder S inside the storage tank 110 and which extends in...
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WO/2023/045083A1 |
A method for flux-free soldering of aluminum alloy, comprising the following steps: (1) galvanizing a surface to be soldered of aluminum alloy to form a galvanized layer; (2) coating the galvanized layer with a flux-free solder paste, th...
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WO/2023/043058A1 |
The present invention relates to a laser soldering system capable of preventing the surface contamination or corrosion of a substrate by effectively removing flux components generated from a solder paste during a laser soldering process.
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WO/2023/033959A1 |
A method of using a solder reflow oven can include disposing at least one substrate including solder in a chamber of the oven. The method can include decreasing a pressure of the chamber to a first pressure between about 0.1-50 Torr. Aft...
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WO/2023/028182A1 |
An example method of calibrating the operation of soldering apparatus for use in a soldering machine, in which the soldering apparatus includes at least one nozzle which is configured to apply solder to an electronics board, in use, invo...
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WO/2023/021915A1 |
Provided is an aluminum alloy extruded tube for a heat exchanger, characterized by having a tube body composed of an Mn-containing aluminum alloy and a coating film formed on the surface of the tube body, and the coating film being such ...
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WO/2023/020986A1 |
The invention relates to a method of making a tool comprising a joining a maraging steel joining partner (1) and a cemented carbide joining partner (2) by brazing. The present invention also relates to a tool made according to this metho...
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WO/2023/016920A1 |
The invention relates to a method for connecting a sensor chip (1) to a measurement object (2). According to the method, a measurement object (2), a sensor chip (1) and a connecting foil (10) are provided, wherein the connecting foil (10...
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WO/2023/018763A1 |
The present application relates to a method of controlling a preheating process for preheating a board (2) in preparation for processing of the board (2) in a soldering machine involves: providing a heating unit (11) configured to heat a...
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WO/2023/014505A1 |
A fluid system component can include a body that includes a multidimensional shape defined in orthogonal directions and layers stacked along one of the orthogonal directions, where at least one of the layers includes polymeric material a...
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WO/2023/015072A1 |
Brazing sheets, articles formed from or including all or a portion of brazing sheets, and methods of forming articles are provided. A brazing sheet comprises a core layer, a brazing layer, and an interliner layer intermediate the core la...
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WO/2023/009536A1 |
A reflow oven is disclosed in the present application, the reflow oven including: a housing, where the housing defines an oven chamber, and the oven chamber is provided with an inlet end, an outlet end, and a conveying space extending fr...
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WO/2023/003106A1 |
A cooling module, according to an embodiment of the present invention, for cooling an object to be brazed comprises: a body part having a contact part in contact with the object to be brazed, and cooling the object to be brazed; a first ...
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WO/2023/001507A1 |
The invention relates to a method (1) for producing an electric operating means (6), having the steps of: arranging (2) a hard soldering foil (13) on a contact region (14) between a first workpiece (7-9) and a second workpiece (10), alig...
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WO/2023/003105A1 |
A brazing system according to an embodiment of the present invention, which is for brazing an object to be bonded to a base material, comprises: a turntable provided with a reception part for receiving the base material and rotatable clo...
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WO/2023/286856A1 |
This copper/ceramic bonded body (10) has copper members (12, 13) made of copper or a copper alloy and a ceramic member (11), wherein the copper members (12, 13) are bonded to the ceramic member (11). An active metal compound layer (21) i...
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WO/2023/286862A1 |
This copper/ceramic bonded body (10) comprises a copper member (12, 13) composed of copper or a copper alloy, and a ceramic member (11). The copper member (12, 13) and the ceramic member (11) are bonded to each other. At a bonding interf...
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WO/2023/283138A2 |
Example methods of calibrating a parameter in a fluxing process in a soldering machine involve: determining an expected flux result when at least one calibration flux setting is used to spray flux from a nozzle; spraying flux from the no...
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WO/2023/283100A2 |
Example processes for generating a program for applying flux to, and/or for soldering components onto, an electronics board, the program including manufacturing settings, involves: a) obtaining an image of the board; b) determining board...
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WO/2023/283022A1 |
A soldering system for processing at least one printed circuit board. The system comprises a first solder pot and a second solder pot, each configured to move within a movement plane. At least one of the first solder pot and the second s...
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WO/2023/276792A1 |
This bonding sheet is provided with: a conductive particle layer which contains conductive particles, a thermoplastic resin and a thermosetting resin; and a flux layer which is arranged on at least one side of the conductive particle lay...
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WO/2022/268458A1 |
The invention relates to a method for producing a camera module (10), comprising a lens (14) and a lens holder (22) holding the lens (14). The method comprises the steps of introducing (A) at least three solder elements (46) into a regio...
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WO/2022/268660A1 |
The present invention relates to a tool comprising a superhard part comprising a polycrystalline diamond (PCD) or a cubic boron nitride (cBN) sintered compact bonded to a cemented carbide substrate and a a maraging steel part where the c...
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WO/2022/266786A1 |
A method for assembling a fiber mount to a base, comprising: placing metal spacers and solder between the fiber mount and the base, applying a squeezing force with a configured time, thus providing a precise control of the gap between th...
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WO/2022/259708A1 |
The present invention suitably removes, after bonding, a release layer formed on a copper plate when fabricating a bonded substrate using pressurizing/heating bonding. This method for manufacturing a bonded substrate comprises: a prepara...
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WO/2022/254807A1 |
[Problem] To provide a laser soldering device, a control device, and a laser soldering method that enable high quality soldering by laser irradiation. [Solution] A laser soldering device according to the present technology comprises a la...
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WO/2022/248201A1 |
A method for forming a busbar (1) having a contact element (20) comprising: - providing a first conductive section (11) made from aluminum, - providing a second conductive section (12) made from aluminum, wherein the second conductive se...
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WO/2022/246912A1 |
An automatic PCB reclaiming apparatus, relating to the technical field of automatic PCB reclaiming, and comprising a rack (1), a feeding device (2) mounted on the rack (1), a lifting/lowering and positioning device (3) mounted on the rac...
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WO/2022/246353A1 |
Brazing sheets, articles formed from or including brazing sheets, and methods of forming articles are provided. The brazing sheet comprises a substrate layer, an interliner layer disposed on the substrate layer, and a brazing layer dispo...
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WO/2022/244769A1 |
A bonded object production method according to one embodiment of the present invention involves performing, by using continuous furnace, a process on a laminate that includes a metallic member, a ceramic member, and a brazing material la...
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WO/2022/244025A1 |
The present invention concerns a device (10) for soldering the interconnections of photovoltaic panels (1).Said device (10) comprises: an inductor (11), which in turn comprises a filament (12), which substantially develops so as to form ...
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WO/2022/239713A1 |
A jet soldering device 100 comprises: a first housing 121; a first supply port 125 that is provided to the first housing 121 and supplies a molten solder S; a second housing 131; and a second supply port 135 that is provided to the secon...
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WO/2022/234207A2 |
The invention relates to a strip or sheet intended for manufacturing brazed heat exchangers, having a core layer made of aluminium alloy with the following composition (% by weight): Si: more than 0.25% and less than 0.70%; Fe: less than...
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WO/2022/227456A1 |
A full-covered bottom welding device for a multi-layer composite pot, comprising a housing (100); a cavity (211) is formed in the housing (100); through holes (101) are oppositely provided on opposite side walls of the cavity (211); a sh...
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WO/2022/230984A1 |
The present invention ensures the strength of a connection section without lengthening a brazed section in a pipe connection structure. A heat transfer pipe (100), which is a first coolant pipe, has a first part (101), a first expanding ...
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WO/2022/223419A1 |
The invention relates to a method for the open-loop or closed-loop control of the advancement speed (VD) of a wire (4) composed of fusible material during a laser soldering or laser welding method, wherein the wire (4) is melted by a las...
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WO/2022/223147A1 |
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of...
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WO/2022/224949A1 |
This copper/ceramic bonded body is obtained by bonding a copper members (12), (13) to one surface and the other surface of a ceramic member (11), respectively, wherein, at the bonding interfaces of the ceramic member (11) and the copper ...
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WO/2022/219750A1 |
The purpose of the present disclosure is to provide a refrigeration cycle device that has the advantageous feature of improving durability in an environment in which sulfidizing gas is present. This refrigeration cycle device comprises: ...
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WO/2022/214546A1 |
A method for brazing an electrically conducting connecting piece, for example a cable shoe, of an electrically conducting material to a workpiece of electrically conducting material, by means of a temperature controlled brazing process i...
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WO/2022/207711A1 |
The present invention relates to a tool comprising a cemented carbide part and a steel part joined by brazing where the steel part has an average hardness of between 390 and 510 HV30. The braze joint comprises Ti and a TiC layer with a t...
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WO/2022/210927A1 |
This soldering device includes: a chamber; a heat source disposed on a bottom surface of the chamber or in the vicinity of the bottom surface; a light-transmissive window provided to a section of a top surface of the chamber; a radiation...
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WO/2022/208272A1 |
A heat exchanger and a method to fabricate a heat exchanger are disclosed. A brazing compound is applied to a surface of a host piece, such a host cylinder. A flat, rectangular piece of metallic material is corrugated and crushed to form...
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WO/2022/199061A1 |
A self-fluxing brazing alloy applied to welding of aluminum-copper dissimilar materials, comprising the following substances in parts by mass: 70-80 parts of Al; 4-8 parts of Si; 9-12 parts of Cu; 20-30 parts of Zn; 12-18 parts of Sn; 2-...
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WO/2022/194475A1 |
The object of the invention is, among others, a tube (4) for a heat exchanger (1) comprising a tube structure (4a) made of lightweight metal alloy, wherein the tube structure (4a) comprises an inner surface (4b) and an outer surface (4b)...
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WO/2022/195989A1 |
This method for producing a cohesive solid comprises: disposing a metal powder on a solid; covering at least a portion of the periphery of the metal powder with a high-melting-point material having a melting point higher than the melting...
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WO/2022/191109A1 |
A bonding sheet according to the present invention contains a matrix resin, solder particles, and a flux agent. With respect to this bonding sheet, the solder particles are dispersed in the matrix resin, and the flux agent is unevenly di...
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WO/2022/190483A1 |
An element that penetrates through a through-hole (11) is laser-soldered to a land part (31). The land part (31) forms an elliptical shape, and in a laser soldering step, a solder material (35) is supplied on one side in the long-axis di...
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WO/2022/191110A1 |
A bonding sheet according to the present invention contains a matrix resin, solder particles and a flux agent. This bonding sheet has a surface that has a surface roughness Sa of 2.5 μm or less.
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WO/2022/184322A1 |
The present invention relates to a method (200) for producing a plate-fin heat exchanger (100), wherein components (3-8) of the plate-fin heat exchanger (100) which are to be soldered are at least partly provided with solder and are posi...
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