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JP5809047B2 |
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JP2015530265A |
Abrasive elements include a first main surface and a second main surface. At least the first main surface contains a plurality of precision molded formations. This polishing element contains at least about 99% by weight of carbide cerami...
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JP2015174164A |
To provide a truing grinding wheel capable of carrying out fine truing, without damaging a wire tool.A truing grinding wheel 10 is a grinding wheel for truing a wire tool, and provided with a convex surface portion 12 forming an arc-shap...
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JP5777587B2 |
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JP5774740B2 |
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JP5775739B2 |
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JP5772404B2 |
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JP5768425B2 |
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JP5768659B2 |
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JP5761943B2 |
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JP5764031B2 |
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JP2015520680A |
The tool includes a holder configured to be connected to a double-sided chemical mechanical flattening (CMP) pad conditioner. The holder has a magnetic material, a first magnetic field strength (H1) on the first surface, and a second mag...
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JP5745108B2 |
An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random di...
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JP5741299B2 |
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JP5741501B2 |
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JP5734730B2 |
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JP5733359B2 |
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JP2015100862A |
To provide a cutting method capable of preventing the deterioration in a processing quality by performance reduction in a cutting blade formed of polycrystalline diamond.The cutting method is provided for cutting a workpiece (11) by a cu...
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JP2015096294A |
To provide an abrasive tool with flat and consistent surface topography for conditioning a CMP pad, and a method for manufacturing the same.An abrasive tool includes abrasive grains coupled to a substrate of a low coefficient thermal exp...
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JP2015096289A |
To provide a lasting tool capable of removing cut dusts adhered to a side surface of a tooth point of a cutting blade without generation of radius wear of the cutting blade, easily and at short time.Provided is a lasting tool 1 for perfo...
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JP5717930B2 |
A method of dressing a wheel using a polycrystalline CVD synthetic diamond dresser, the method comprising: rotating the wheel; and contacting a working surface of the wheel with a working surface of the polycrystalline CVD synthetic diam...
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JP5717571B2 |
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JP2015077668A |
To provide a control device and method that can adjust polishing conditions whenever necessary depending on accumulated operating times of plurality of components of a chemical mechanical polishing device.A control device comprises: a re...
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JP5703761B2 |
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JP2015071224A |
To provide an abrasive tool, and more specifically, an abrasive tool for use as a chemical mechanical planarization pad conditioner.An abrasive tool includes a CMP pad conditioner including: a substrate having a first major surface 202, ...
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JP5699597B2 |
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JP5701656B2 |
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JP5700682B2 |
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JP5702562B2 |
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JP2015065439A |
To provide a CMP control system that optimizes the service life of a polishing pad.The service life of a polishing pad 105 is optimized by controlling the rate of material removal from the polishing pad by a conditioning disk 117. The co...
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JP2015062985A |
To surely apply truing dressing to a super abrasive grain wire saw.A method for applying truing dressing to a super abrasive grain wire saw 2 having a super abrasive grain 4 covered with a conductive film 5 comprises the steps of: removi...
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JP5693062B2 |
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JP5691843B2 |
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JP5693144B2 |
A rotary dresser (10) is provided with a roll (11) having an outer circumferential surface which includes an arc portion (11c, 211c) or inclined portion (111a, 111b) differing in diameter in dependence on the axial position thereof, and ...
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JP2015058478A |
To ensure that a state of contact with an outer circumferential surface of a grinding wheel has no change even if one end surface of a rotary electrode wears, and to prevent the outer circumferential surface of the grinding wheel from be...
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JP2015051487A |
To provide a grinding tool dressing device capable of precisely and safely dressing a grinding tool for grinding a portable grinder.A grinder A equipped with a disc-shaped grinding tool B for grinding is fixed on a supporting base 1 in a...
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JP2015044251A |
To provide a polishing method which can maintain cleanliness of a polishing pad surface by cleaning the polishing pad surface in view of an entire polishing step.A polishing method of polishing a wafer held on a top ring includes: (A) a ...
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JP5678524B2 |
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JP5675626B2 |
A method and apparatus for providing a substantially uniform pressure to a polishing surface from a conditioning element is provided. The method includes urging a conditioning disk against a polishing surface of a rotating polishing pad,...
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JP5674201B2 |
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JP2015030058A |
To provide a dressing method and a dressing apparatus capable of suppressing generation of particles and extending a life of an abrasive pad by suppressing abrasion of the abrasive pad while appropriately roughening an abrasive surface o...
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JP5668486B2 |
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JP5667268B2 |
An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second maj...
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JP2015020222A |
To provide a grinder which can increase a freedom of adjustment by adjusting an abrasive grain intrusion angle by adding a new adjustment item other than radii of a truing roll and a grinding wheel, and rotation speeds of the truing roll...
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JP5658861B2 |
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JP2015009346A |
To keep machinability of a fixed abrasive grain wire good.In an electrolytic dressing method, when processing a workpiece by running a fixed abrasive grain wire in which abrasive grains are fixed by an electric conductive fixing agent, a...
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JP2015009293A |
To provide a dress-processing method of a fixed abrasive grain pad capable of dress- processing a surface shape of the fixed abrasive grain pad used for grinding processing of a glass substrate surface in a desired shape.The method is pr...
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JP2015000444A |
To provide a thread groove processing method capable of securing processing accuracy over a wider range with respect to a nut having a thread groove with a large lead, and to provide a tool used therefor.In interference grinding of threa...
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JP2015500151A |
The wafer polishing apparatus of the present invention includes a surface plate, a polishing pad arranged on the surface plate and containing a plurality of fixed polishing particles, a head portion arranged on the polishing pad, and an ...
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JP2015000469A |
To provide a grinder and a truing method capable of truing of using an accurate truing roll diameter, by accurately arithmetically operating an abrasion quantity of a truing roll in the truing.When rotating both by imparting a set cuttin...
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