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JP5647475B2 |
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JP2014233831A |
To provide an abrasive pad dresser, an abrasive pad dresser device, and a polishing system capable of preventing peeling of polishing particles during formation of an abrasive pad.Provided are the abrasive pad dresser, the abrasive pad d...
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JP2014233830A |
To provide an abrasive pad dresser which gives preferable polishing effect and fracture toughness resistance to polishing particles.The abrasive pad dresser comprises: polishing particles 110 which are polyhedra and have a regulated shap...
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JP5636213B2 |
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JP5631142B2 |
The method involves accommodating a grinding tool (4) on a tool spindle (3) of a gear or profile grinding machine (1). Two workpiece spindles of the machine are temporarily driven to the tool spindle for cooperation of a workpiece with t...
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JP2014217935A |
To provide a dressing tool that can properly determine a usage limit.The dressing tool 2 for dressing a grinding abrasive stone of a grinding wheel includes: a dressing board 4 for dressing the grinding abrasive stone; and a supporting p...
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JP2014217905A |
To restrain reduction in sharpness, and to improve grinding processing accuracy and processing efficiency in a machinable gear thereby, by reducing abrasion of a tooth surface of a grinding wheel gear, in grinding of the machinable gear ...
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JP2014217900A |
To provide a metal processing device at low cost capable of achieving both of work efficiency and process tolerance by performing dressing of a metal processing tool and metal processing with the metal processing tool at the same time.A ...
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JP5626429B1 |
To provide a rotary processing machine capable of quickly and easily forming a grindstone tooth surface of a rotary grindstone and improving the productivity of a helical gear. A rotary processing machine 1 grinds a rotary device 2 that ...
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JP5620639B2 |
Provided is a method of polishing comprising providing a workpiece, providing a fixed abrasive article, providing conditioning particles, and relatively moving the workpiece and the fixed abrasive article in the presence of the condition...
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JP5610615B2 |
The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dres...
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JP5608623B2 |
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JP5603303B2 |
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JP5598371B2 |
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JP5589427B2 |
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JP5586409B2 |
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JP5581663B2 |
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JP5581074B2 |
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JP2014147993A |
To provide a dressing plate which is light in weight, can suppress a change in a surface shape of upper and lower polishing cloths, and the cost of which can be reduced, and to provide a method for manufacturing the dressing plate.The dr...
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JP5576868B2 |
The machine has a linear movement unit (15) movable along a linear movement axis (Z1) with respect to a machine bed (1). A rotatable movement unit (17) is arranged at the linear unit in a rotatable manner around a rotatable movement axis...
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JP5573061B2 |
The present invention provides an apparatus capable of uniformly grinding an polishing pad. Further, the present invention provides a method of grinding an polishing pad by using the grinding apparatus. Specifically, the present inventio...
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JP5573459B2 |
A core grinding wheel that has a grinding layer (72) on an outer periphery of a core (71) is used. An ultrasonic wave is output from an ultrasonic sensor (14) to the grinding layer (72) via grinding fluid (20). An ultrasonic measuring de...
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JP5571331B2 |
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JP5568745B2 |
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JP2014135424A |
To provide a wafer cutting method capable of cutting a wafer into individual devices without attaching a cutting chip to the wafer.The wafer cutting method comprises : a protective tape sticking step of sticking a protective tape 6 to a ...
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JP5554332B2 |
A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polish...
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JP5554224B2 |
Full profile dressing roll (1) for dressing multi-start grinding worms for the generation grinding of small-module gears, comprising a groove-shaped axial section profile of the outer envelope surface (2), covered with hard material grai...
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JP5549391B2 |
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JP5551951B2 |
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JP5552124B2 |
A method and apparatus for replacing a polishing pad conditioning disk is a chemical mechanical polishing system is provided. The apparatus comprises a disk load/unload station for unloading used conditioning disks from a pad conditionin...
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JP5546603B2 |
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JP5546703B1 |
Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip p...
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JP5541657B2 |
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JP2014121762A |
To provide a cutting device capable of performing dressing by smoothly corresponding to working tools in various forms, and improving the versatility of dressing means.The cutting device including: a table 1; a working head 2 movable thr...
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JP5536250B1 |
To provide a gear processing device and a gear processing method capable of improving surface roughness in a tooth profile evaluation range of a tooth surface of a gear. A gear processing device 1 of the present invention is a gear proce...
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JP5534488B2 |
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JP5537891B2 |
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JP2014514971A |
This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which th...
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JP5530002B2 |
The present invention provides a dressing apparatus for dressing a polishing pad on a polishing table. The apparatus includes: a dresser configured to dress the polishing pad by pressing an upper surface of the polishing pad, the dresser...
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JP5528826B2 |
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JP5530815B2 |
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JP5527622B2 |
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JP5524397B2 |
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JP5521581B2 |
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JP5516037B2 |
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JP5518310B2 |
The tool (5) has multiple profiles arranged parallel to each other, where the tool is adjustable and reprofilable. The profiles are designed as a wide grinding disk (6) and two narrow grinding disks (7) that are positioned at correspondi...
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JP2014104543A |
To provide a grinder capable of maintaining a projection quantity of proper diamond up to the service life of a dress roll, without requiring the setting of the dress roll in a special process.A wheel spindle 11 is attached with a grindi...
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JP2014100786A |
To provide a grinding method and a grinding device of a glass pane, without wholly imparting a loss time to grinding work, even if dressing work is frequently executed.This grinding device 1 comprises a dressing device 40 for holding a d...
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JP5514642B2 |
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JP5509922B2 |
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