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JP5178447B2 |
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JP5179158B2 |
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JP2013059854A |
To perform dressing while preventing the wear of a polishing pad and the contamination of a dresser.Dressing liquid to be used in a dressing process for the polishing pad 1 is pure water mixed with fine bubbles. A dresser 10 is formed an...
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JP5169073B2 |
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JP5170716B2 |
Disclosed is a semiconductor wafer polishing method for polishing the surfaces to be polished of semiconductor wafers by use of polishing pads (16, 17) provided on fixing plates by relative movement of the polishing pads and the semicond...
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JP5164758B2 |
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JP5162966B2 |
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JP5163977B2 |
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JP2013043238A |
To provide a method for polishing a glass substrate for an EUVL optical substrate capable of polishing the main surface of the glass substrate to a flatness of 30 nm or lower.In a method for polishing a glass substrate for an EUVL optica...
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JP2013041965A |
To prevent degradation of a dicing blade and prevent an occurrence of chipping to enable manufacturing of a high quality semiconductor device.A semiconductor device manufacturing method comprises: a filler-containing resin layer formatio...
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JP5154880B2 |
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JP5148925B2 |
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JP5148400B2 |
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JP5148924B2 |
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JP5147417B2 |
A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the pol...
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JP5145857B2 |
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JP2013018094A |
To perform dicing of a semiconductor wafer efficiently and surely.The semiconductor wafer 2 is attached to a dicing sheet 27 in a state where a die attach material 25 is stuck to the back surface thereof. A dicing blade 4 has a first abr...
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JP5131577B2 |
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JP5127768B2 |
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JP5127270B2 |
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JP2013010148A |
To provide a rotary dresser of a long life, which has high accuracy, and in which the falling-off of superabrasive does not occur.A diamond rotary dresser 1 includes: a sprayed layer 23, which is formed with a thermal spraying, and which...
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JP5121756B2 |
Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip p...
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JP5122856B2 |
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JP5121315B2 |
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JP5114701B2 |
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JP5113747B2 |
A method of controlling a processing apparatus capable of processing workpieces, such as grind stones, into a variety of shapes. The processing apparatus has an X-axis movement mechanism (9) capable of moving a tool (8) relative to a wor...
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JP2012254492A |
To provide a truing method capable of providing the desired surface roughness of a grinding wheel 7 even though a cut-in amount in the normal direction of a truing roll 8 to the grinding wheel 7 changes in the truing method for moving th...
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JP5106121B2 |
The object is to aim at the reduction in the influence of noises in an output of an AE sensor in a working machine. In a working system comprising a working device for working a work W by causing a tool 14 to come into contact work W, an...
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JP5107733B2 |
A grinding device including a multi-wheel grindstone and an electrode arranged opposite to a grinding action surface of the multi-wheel grindstone with an interval, in which a work is ground and machined while the grinding action surface...
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JP2012532767A |
An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate thr...
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JP5095159B2 |
A process for grinding workpieces is obtained which includes attaching honing stones to a tool, each of the honing stones including grinding particles and an electroconductive connection for fixing the grinding particles to each other; g...
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JP5093652B2 |
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JP2012238692A |
To provide a method of polishing a semiconductor substrate capable of obtaining a steady, high polishing rate while maintaining polishing characteristics, by making a surface state of a CMP polishing pad appropriate using an existing CMP...
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JP5092670B2 |
To provide a grinding method capable of reducing clogging and a manufacturing method of a semiconductor device. The grinding method includes a process of forming a resin layer 9 comprising a resin material 7 including a plurality of inor...
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JP5089073B2 |
A polishing layer (140) has an annular polishing track (125) concentric with rotational center (102). The radial micro-channels are formed in the polishing layer within width (133) of the annular polishing track and a majority of the mic...
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JP5087213B2 |
A rotating dressing tool ( 2 ) coated with abrasive grains for profiling a multi-start grinding worm ( 4 ) for the continuous generation grinding of preferably small moduled gear teeth is provided with a stripping zone ( 6 ), a pre-profi...
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JP2012232378A |
To provide a polishing tool providing a more precise polishing that can not be provided by a conventional polishing tool.Provided is a method for manufacturing a tip for a polishing tool, and the method includes steps of: cutting out a t...
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JP5072020B2 |
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JP2012218081A |
To provide a brush polishing device and a brush polishing method capable of accurately grasping a wear condition of a polishing brush to set dressing timing and preventing degradation of machining accuracy due to wear of the polishing br...
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JP2012213833A |
To provide a sintered body for pad conditioning which can obtain a polishing tool for conditioning a CMP polishing pad which polishes the surface of a semiconductor material for LSI etc. of an ultra high-density wiring rule of 0.35 μm r...
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JP2012213834A |
To provide a polishing patch constituted of a super-abrasive sintered body such as a sintered body for pad conditioning and capable of being cut from a circular sintered body material without waste.The polishing patch is one in which two...
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JP5061186B2 |
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JP5055053B2 |
The invention relates to a method for determining the number of active diamonds on a conditioning disk. In particular, the method comprises (a) contacting a diamond conditioner disk with a hard surface, wherein the diamond-containing sid...
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JP5056904B2 |
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JP2012192467A |
To provide a dresser that can reliably provide truing with respect to a grinding part of a drill without causing the drill to be damaged such as bending even when the drill for drilling a glass plate has a small diameter.The dresser 1 fo...
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JP2012192510A |
To provide a method for manufacturing a total type grinding wheel capable of obtaining the total type grinding wheel of a desired shape by grinding only one time.The method for manufacturing the total type grinding wheel has a grinding s...
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JP2012187692A |
To provide a dressing material with which the side face of a cutting blade is dressed without causing a defect to the cutting blade.The dressing material is used for dressing the cutting blade cutting a workpiece, and includes a base bed...
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JP2012187693A |
To provide a dressing material capable of dressing a side surface of a cutting blade without defect in the cutting blade.This dressing material for dressing a cutting blade cutting a workpiece includes: a base table on which a plurality ...
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JP5041803B2 |
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JP5042208B2 |
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