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JP5957483B2 |
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JP5957317B2 |
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JP2016129927A |
To provide a method for compensating temperature-induced deviations in a grinding machine with a dressable grinding tool, and a machine corresponding to the method.A grinding machine (100) comprises: a tool spindle (11) with a grinding t...
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JP5953328B2 |
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JP5954293B2 |
A dressing apparatus for dressing a urethane foam pad, for use in polishing, by bringing diamond abrasive grains into sliding contact with the urethane foam pad, includes a support for holding the grains. The grains have multiple grit si...
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JP2016519852A |
The pad conditioner may include, for example, a plurality of independently installed adjusting elements configured to adjust the polishing pad used in a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditione...
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JP2016119368A |
To provide a compact conditioning device capable of performing the conditioning of more than one type.A conditioning device for conditioning a buff pad for use in buff processing includes a base plate configured rotatably, a first condit...
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JP2016104508A |
To provide a compact design centerless grinder usable for plunge grinding and/or through-feed grinding.A grindstone spindle 28 and an adjusting axle 30 are connected to a machine bed 12 so as to be mutually movable. The grindstone spindl...
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JP5927083B2 |
A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the...
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JP2016087735A |
To provide an abrasive cloth dresser with an excellent pad grinding rate and pad flatness.An abrasive cloth dresser with a plurality of abrasive grains anchored on a resin layer to project individual grains from the resin layer is charac...
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JP2016083707A |
To provide a novel NC grinder processing device capable of completing the regeneration work of a dressing grindstone, which is impossible in the conventional NC grinder processing device because of lack of recognition that a three-dimens...
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JP5919002B2 |
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JP5919157B2 |
A dresser includes an attachment secured to a dresser shaft for rotating the dresser, a disk holder removably attached to the attachment by a magnetic force, and a dresser disk removably attached to the disk holder. The dresser disk has ...
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JP2016078215A |
To provide a sub chuck table which allows displacement of a plate-like object to be appropriately detected.A sub chuck table (16) is arranged in the vicinity of a chuck table (14) and has on an upper face thereof a rectangular holding fa...
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JP2016078156A |
To inhibit deterioration of the uniformity of the processing speed in a plane of a processing object, which results from pressure concentration of a buff pad contacting with the processing object, and uniformly condition a contact surfac...
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JP5916121B2 |
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JP5916102B2 |
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JP5916101B2 |
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JP5916103B2 |
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JP5914712B2 |
The present invention relates to a chemical mechanical polishing conditioner with high performance, comprising a substrate; a binding layer disposed on the substrate; and a plurality of abrasive particles fixed directly on the substrate ...
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JP2016072327A |
To provide a polishing device capable of suppressing intrusion of polishing debris into the opening of a polishing pad.In a polishing device including a chuck table for holding a wafer, polishing means for polishing the wafer held on the...
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JP2016064473A |
To provide a grindstone dress method in a gear grinder which can shorten a total processing time including a setup time for extremely shortening the setup time when changing a dress unit which applies molding to a rotating grindstone, an...
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JP5911520B2 |
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JP5912696B2 |
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JP2016058724A |
To improve polishing precision on a polishing processing surface of a processing object.In an upper-side processing module 300A, the polishing processing is performed by moving a wafer W and a pad 502 relatively to each other while keepi...
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JP5898420B2 |
A method of and an apparatus for conditioning a surface of a polishing pad 2 is used for conditioning a polishing pad on a polishing table 1 for polishing a thin film formed on a surface of a substrate W . The conditioning method include...
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JP5896625B2 |
A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating ...
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JP5892831B2 |
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JP5886001B2 |
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JP5883581B2 |
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JP5857660B2 |
A truing device (3) of a grinding machine (1) includes: a truer (43) that corrects a shape of a grinding wheel (11); a swivel table (30) that supports the truer (43) such that the truer (43) is swivelable about a swivel axis (Ac); detect...
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JP5854032B2 |
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JP5853946B2 |
An outer blade cutting wheel (1) comprising a base and a blade section (11) of metal or alloy-bonded abrasive grains is dressed by clamping the cutting wheel between a pair of circular jigs (2) such that the blade section (11) projects b...
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JP5854792B2 |
The purpose of the present invention is to provide a disk dresser and a dressing method for a drum-shaped gear-like grindstone that enables high-precision dressing of a drum-shaped gear-like grindstone and enables the shape of the cuttin...
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JP2016013615A |
To reduce the time required for lapping and the amount of used slurry by reducing a machining allowance of lapping in a post-process, and prolong the lifetime of a grinding stone.A finish grinding device (2) for finish-grinding a surface...
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JP5846096B2 |
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JP5845555B2 |
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JP5842672B2 |
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JP5843362B2 |
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JP5842312B2 |
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JP5843120B2 |
The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the...
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JP5836900B2 |
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JP5836897B2 |
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JP2015213969A |
To provide a dress sheet that efficiently dresses a cutting blade while cutting an object to be processed, without causing a problem such as pop of a chip and movement of a wafer, and to provide a processing method using the dress sheet....
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JP5826306B2 |
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JP5815151B2 |
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JP5814719B2 |
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JP5815150B2 |
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JP2015202545A |
To provide a grinding device which allows continuous grinding and prevents generation of a large amount of consumable supplies due to grinding.A grinding device (1) comprises an ultrasonic cleaning nozzle (5) consisting of an injection n...
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JP5809880B2 |
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