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JP2013193154A |
To provide a grinding machine capable of accurately measuring an abrasion loss of a truing tool.A grinding machine includes a grinding wheel 7, a truing tool 8, a deflection measuring means of measuring a relative deflection amount T of ...
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JP5301840B2 |
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (12) having a polishing surface, a top ring (20) configured to hold and pre...
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JP5297281B2 |
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JP5295868B2 |
To provide a dresser for a polishing cloth in which a stable dressing performance is maintained, a uniformly polished surface is provided on the surface of the polishing cloth, and in particular, a scratch on a wafer caused by the dissoc...
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JP5285609B2 |
Provided is an abrasive article comprising (a) a metallic foil having a first and second surfaces and voids therebetween, (b) a plurality of abrasive particles substantially in the voids, and (c) an alloy at least partially between the a...
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JP5285526B2 |
A method for dressing a tool used for a method for machining an internally toothed gear, the method for machining an internally toothed gear being capable of, even if the grindstone of the tool has a regenerated grinding surface, machini...
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JP5285672B2 |
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JP5285416B2 |
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JP5289829B2 |
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JP2013173198A |
To provide a grindstone molding method which can measure an abrasive grain protrusion amount during grindstone molding, and a grinder.After the truing of a grinding wheel 7 of a metal bond, there are measured first capacitance Ct1 being ...
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JP5275016B2 |
To provide a grinder reducing frequency of dressing of a grinding wheel, causing no scratch on a wafer. The grinder includes a chuck table retaining a workpiece and a grinding means rotatably supporting the grinding wheel that grinds the...
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JP5276472B2 |
To provide a double-head grinder capable of preventing a dresser from interfering with guide rails, and achieved in the easy and short dressing operation of grinding surfaces of rotary grinding wheels. A workpiece W is ground by the grin...
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JP5274360B2 |
To provide a dresser having excellent cutting ability, a long service life, and satisfactory finishing accuracy. The dresser 10 has an abrasive layer 12 that includes: square-pole-shaped diamond abrasive 15 with single-crystal structure;...
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JP5265281B2 |
To provide a double-sided polishing device adapted to improve polishing efficiency and perform high precision polishing by preventing the tilt of an upper surface plate. A lower surface plate 12 includes two lower surface plates 12 and 1...
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JP5263536B2 |
To provide a workpiece cutting method capable of easily suppressing irregular thickness of a wafer at low cost, and suppressing degradation of the productivity by the dressing. In the workpiece cutting method, a fixed abrasive wire wound...
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JP5263099B2 |
To provide a method and device of forming a polishing brush capable of performing the running-in processing of the polishing brush in a short time without using a workpiece. The method of forming the polishing brush for grinding a metal ...
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JP5262437B2 |
To provide a method of truing a grindstone without causing grinding burn at a corner formed between an outer peripheral surface and an end surface of a workpiece, and a grinding method using the grindstone in grinding the outer periphera...
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JP5255860B2 |
The invention provides a dresser for an abrasive cloth, which has a smaller abrasive grain diameter than the conventional dresser and has an abrasive grain spacing regulated in a predetermined range depending upon the abrasive grain diam...
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JP5254679B2 |
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JP5255680B2 |
In a first step for the purpose of precentering, the dressing too; (27), without axial movement, is brought into contact with the circumference of the rotating grinding worm (11), and those rotary-angle positions of the grinding worm (11...
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JP5257752B2 |
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JP5253419B2 |
Disclosed are a machine with a grinding wheel and a dressing surface and related method. The dressing surface is movable in at least two axes of translation relative to the grinding wheel. The rotational speed of the grinding wheel and d...
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JP5251877B2 |
In the production of a glass substrate for magnetic disk, the present invention provides a method for producing a glass substrate for magnetic disk including a step of polishing a main surface of a circular glass substrate using a polish...
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JP5253254B2 |
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JP2013144359A |
To provide a method of dressing a polishing pad, the method capable of securing dressing in-surface uniformity in a polishing pad.In a polishing device PM, an optimum rotating speed ratio ρT of a polishing pad 220 to a dressing tool 230...
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JP5244577B2 |
An object is to provide an internal gear grinding machine which makes it possible to achieve space savings and reduce the size of a machine, as well as to prevent the tools from being damaged even when an abnormal situation such as a bla...
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JP5236515B2 |
An apparatus dresses a polishing pad. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spher...
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JP5233621B2 |
A method for producing a glass substrate for a magnetic disk involving the use of a polishing pad having: a first resin foam layer which forms the polishing surface, includes a resin foam having pores with a pore diameter of more than 20...
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JP5219600B2 |
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JP5221092B2 |
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JP5222586B2 |
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JP5221911B2 |
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JP5220979B2 |
A cutting tool has a flute and land, which follow a helix angle, wherein the flute and land are connected to one another with a convex heel to provide a smooth contour to the tool surface and to provide improved performance. A grinding w...
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JP5218886B2 |
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JP2013123792A |
To perform efficient grinding by removing the clogging of a grinding wheel.The surface layer part of an object containing a resin is ground by using a grinding wheel which contains a plurality of abrasive grains and in which voids are fo...
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JP2013525126A |
In the embodiments described herein, regulated sweep closed-loop control (CLC) can be used to provide uniform groove depth removal throughout the pad life. A sensor built into the adjustment arm allows in situ and real-time monitoring of...
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JP2013526057A |
A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk ag...
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JP2013522057A |
An abrasive tool includes a bonded abrasive body having abrasive grains contained within a bonding material, wherein the bonded abrasive body comprises a complex shape having a form depth (FD) of at least about 0.3. The form depth is des...
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JP5210033B2 |
The method involves having a tooth-shaped profile (2) in an axial section, in which the tooth shaped profile has two oppositely arranged flanks (3, 4). Along a part of the height (X) of the tooth-shaped profile a disc-shaped dressing too...
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JP5206194B2 |
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JP2013111698A |
To provide a dressing gear for allowing easy confirmation of a replacing time for the dressing gear due to damage to the tooth tip part and the reuse with the re-electrodeposition of abrasive grains even when continuous dressing without ...
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JP2013111712A |
To provide a polishing method and a polishing device that can efficiently polish a hard material.When a member 23 to be polished is polished using a polishing device 10 including a grindstone 14 containing many abrasive grains 16 and a d...
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JP2013113811A |
To provide a device and a method for measuring the distribution of abrasive cutting edges, the device and method allowing for quantitative evaluation of the distribution of cutting edges on a grinding stone surface.A device 1 for measuri...
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JP2013107151A |
To bring respective correction states of both upper and lower surface plates into line with each other as much as possible to form matched surface plate surfaces to polish both surfaces of a workpiece highly accurately.A device for both-...
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JP5204537B2 |
The machine has a worm grinding wheel with a tooth shaped section (2), which partially consists of a trueable abrasive material and is rotatably arranged on a grinding spindle. A trueing device includes a trueing spindle, which supports ...
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JP2013094937A |
To provide a polishing and correcting plate which can be safely taken out from a polishing device without slipping, and to provide the polishing device.In the polishing and correcting plate 1 to be used for smoothly polish polishing surf...
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JP2013094924A |
To improve a grinding speed of a ceramic substrate with a through electrode.At the same time as grinding work of the ceramic substrate (workpiece) w with the through electrode by a cup wheel grinding wheel 3a is performed, in-process dre...
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JP5194516B2 |
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JP2013071205A |
To provide a grinding wheel forming method including abrasive grain protrusion amount measuring method usable even during a grinding wheel forming process, and to provide a grinding machine.After truing of a metal bond grinding wheel, a ...
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JP5183840B2 |
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