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JP5917139B2 |
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JP5912723B2 |
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JP5899034B2 |
To provide a new rotary brush technique capable of eliminating concentric rotation contact unevenness without requiring a complicated rotation drive mechanism or the like, preventing clogging and deviated abrasion in a brush, equalizing ...
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JP5865536B1 |
To provide a bristle material for a brush and a brush roll which have an appropriate polishing force and can suppress wear of a rolling roll as much as possible. This is a bristle material 1 for a brush used for a brush roll B for polish...
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JP3202507U |
To provide an apparatus for processing a flat glass surface to a different degree of opacity or correcting a sandblasted glass surface. A device for modifying a flat glass surface 5, a means for supplying water for cooling and washing th...
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JP5843155B2 |
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JP2015196202A |
To reduce contact resistance between a cathode beam and a bus-bar provided above a tank wall of an electrolysis tank.In the polishing device, a polishing part 40 polishes only a part of the cathode beam 136 coming into contact with the b...
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JP2015196228A |
To provide a tip tool and so on which can suitably cut a film body towards a cooling hole.A tip tool 11 cuts a film body 6 covered by a cooling hole 7 for a high-temperature component 1 equipped with a wing body 5 on a surface of which t...
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JP5801270B2 |
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JP5780770B2 |
To provide a nonwoven fabric polishing roll that can reduce the occurrence of polishing defects and carry out uniform polishing. A nonwoven fabric polishing roll having a through hole in to which a rotation shaft of a polishing machine i...
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JP5767280B2 |
A pad and process for polishing metal damascene structures on a semiconductor wafer, the pad having low elastic recovery and high energy dissipation coupled with a high pad stiffness, and the pad having macro-texture that includes groove...
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JP5763979B2 |
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JP2015131362A |
To provide a processing method and a processing tool of a work piece reducing a period of time of a production cycle and improving productivity.A processing tool 1 comprises: a plurality of brushes 3 and 3 rotationally driven so as to de...
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JP2015131386A |
To provide a novel and economic method of manufacturing a brush sealing part having a brush fiber made of a non-metal material, the brush sealing part having a straight or curved extended part, and to provide a brush sealing part manufac...
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JP2015102272A |
To provide a freezing removal tool in a sheath pipe capable of surely and quickly removing freezing in a sheath pipe regardless of the material of the sheath pipe and also in a screw groove with simple operation.A torque hanging shaft 4 ...
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JP2015092610A |
To provide a pad for polishing a metal damascene structure of a semiconductor wafer and a method therefor.A pad is high in pad rigidity, low in elastic recovery, and high in energy dissipation. The pad has a macro texture including groov...
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JP5705363B1 |
To provide a polishing disc which prevents the occurrence of deep linear scratches on a work without deteriorating the cooling effect. In a polishing disk 1 in which a large number of polishing sheet pieces 41 are laminated and adhered t...
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JP2015066643A |
To provide a mirror polishing method and a mirror polishing device in which generation of buff burning can be avoided and in which time needed for mirror polishing becomes too long can be avoided.At a polishing stand table 6, provided ar...
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JP5689399B2 |
The present document discloses a tool for treating a hard surface. The tool comprises a flexible pad having an active treatment surface presenting abrasive particles bonded to the pad. The pad comprises an open, lofty, three dimensional ...
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JP5678898B2 |
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JP3196214U |
To provide a polishing feather cloth which has "synergy" in the feather cloth and is excellent in "glue" of an abrasive. A plurality of circular single sheet cloths 1 and 2 having a plurality of notches 1a to 1d and 2a to 2d formed on an...
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JP2015505737A |
In the present specification, a polishing filament having improved rigidity and an industrial brush containing the polishing filament are disclosed, wherein the polishing filament is used when the total weight% of all the components of t...
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JP2015003367A |
To provide a polishing member which can omit a separate deburring process.A grinding wheel 10 includes a polishing surface 10a on an outer circumference surface. A brush 11 is arranged on at least an outer circumferential edge part of an...
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JP5649499B2 |
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JP2014237214A |
To provide a shaft-provided polishing flap wheel which has a simple structure allowing firm fixing with a thermosetting resin alone and is excellent in workability with less occurrence of shift or vibration.The shaft-provided polishing f...
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JP2014227622A |
To provide a fabric wiper suitable for manufacturing a perpendicular magnetic recording system magnetic disk without generating a scratch and a trouble due to contamination or the like.The method for manufacturing a polyester yarn contai...
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JP3194051U |
To provide a disk-shaped rotating brush in which a wire rod radially attached to a holding portion does not spread in the thickness direction of the disk and does not bend as it is used. In a disk-shaped rotating brush in which a wire ro...
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JP5594295B2 |
Provided are a polishing device and a polishing method for the polishing device, whereby workpieces comprising a hard and brittle material are machined into a cylindrical shape with a prescribed diameter, microcracks present on the surfa...
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JP5584666B2 |
A pad and process for polishing metal damascene structures on a semiconductor wafer, the pad having low elastic recovery and high energy dissipation coupled with a high pad stiffness, and the pad having macro-texture that includes groove...
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JP5578694B2 |
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JP5565417B2 |
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JP5562370B2 |
Chemical Mechanical Polishing/Planarization (CMP) apparatus, method, and substrate produced thereby. Polishing surface with non-uniform recesses therein. CMP head and method having integral slurry dispensing mechanism. CMP apparatus and ...
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JPWO2012124808A1 |
An object of the present invention is to provide a method for manufacturing a plastic lens capable of efficiently removing burrs generated by gate cutting. By using the end mill 31 exclusively for cutting and using the brush 41 to remove...
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JP5556800B2 |
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JP5553378B2 |
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JP5544381B2 |
A pad and process for polishing metal damascene structures on a semiconductor wafer, the pad having low elastic recovery and high energy dissipation coupled with a high pad stiffness, and the pad having macro-texture that includes groove...
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JP2014123777A |
To provide a pad for polishing a substrate.There is disclosed an improved polishing pad for polishing semiconductors and other planar substrates in presence of slurry which optionally may contain abrasive particles. The polishing pad com...
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JP2014121753A |
To provide a polishing drum capable of pressing a cylindrical polishing part flexibly onto a workpiece, and having high heat radiation effect in a polishing work.A polishing drum has a constitution in which a rotary shaft part 2 of a rot...
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JP5537922B2 |
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JP2014113676A |
To provide a brush which has a long life time and can carry out deburring and polishing of a small diameter hole with good efficiency.There is provided a roll brush which uses a channel brush 3 having the width of a channel bottom 5 is 0...
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JP2014113404A |
To provide a brush material and a brush which enable deburring and polishing/grinding to be quickly performed and are hard to be broken to fly around.In a brush material, at least part of the surface of a metal wire material on which dia...
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JP5506765B2 |
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JP5477935B2 |
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JP2014058023A |
To suppress exfoliation of a part of a pad for glass substrate surface treatment, when the pad for glass substrate surface treatment for performing surface treatment such as cleaning to a glass substrate is moved in relatively parallel t...
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JP5456718B2 |
The invention describes an abrasive system comprising a fiber-backed abrasive disc and a backup pad in which the backup pad has spaced portions removed from the circumference such that the disc overlaps in the area of the removed portion...
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JP5461603B2 |
A pad is provided for use on a machine for the polishing of silicon wafers which allows the use of optical detection of the wafer surface condition as the wafer is being polished. This is accomplished by constructing the entire pad or a ...
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JP5457329B2 |
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JP5450870B1 |
To provide a polished body for a gear which can be easily manufactured and can polish a tooth surface of a gear with high accuracy without requiring a special shaping work such as dressing. Rotation axis S1It has a screw-like polishing p...
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JP2014050957A |
To provide substrate polishing means capable of polishing a substrate satisfactorily, even if bending is caused in the substrate.In substrate polishing means (16) for polishing a substrate (5) of the present invention, a polishing member...
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JP5448289B2 |
To provide an abrasive disc which has a small size in the thickness direction and, therefore, can grind objects easily even if they are narrow portions or side walls of grooves and which has a strength enough for resisting the force appl...
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