| Document |
Document Title |
|
JP6488356B2 |
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as ...
|
|
JP6487704B2 |
|
|
JP6487813B2 |
|
|
JP6488354B2 |
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as ...
|
|
JP6486392B2 |
Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with s...
|
|
JP6488355B2 |
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as ...
|
|
JP6484586B2 |
|
|
JP6479254B2 |
The purpose of the present invention is to provide a copper foil with which excellent adhesion, transmission characteristics, and heat resistance can be achieved and to provide a copper-clad laminate using the same. This copper foil is c...
|
|
JP6475088B2 |
|
|
JP6476243B2 |
The present disclosure relates to a copper foil which exhibits surprising anti-deformation properties (e.g., it is resistant to swelling, sagging, and wrinkling). Typically, the copper foil has (a) a shiny side with a surface roughness (...
|
|
JP2019025828A |
To provide an electroformed mesh sheet capable of enhancing strength of the mesh sheet by elongating in a vertical direction, cross-sectional shapes of a vertical bar (muntin) and a horizontal bar (cross rail) composing the mesh sheet to...
|
|
JP6472817B2 |
The present invention provides a method of making a mask for patterning a three-dimensional substrate. A mandrel includes a form machined in a surface corresponding to a shape of the substrate. A layer of material is deposited in a first...
|
|
JP6471140B2 |
To provide a composite metal foil that makes it possible to produce, by a simplified method, a copper-clad laminated plate with the lamination of an extremely thin copper layer which is extremely thin and is dense and hardly suffers the ...
|
|
JP2019019351A |
To provide thin copper foil provided with a peeling metal substrate, capable of forming superfine wiring by a photoetching method.Thin copper foil 10 provided with a peeling metal substrate, comprises a metal substrate 11, a conductive p...
|
|
JP2019019409A |
To overcome the disadvantages of the horological components and fabrication methods of the prior art, and in particular to enable the production of monolithic non-magnetic horological components with a wide freedom in design of the forms...
|
|
JP6462961B2 |
A surface treated copper foil having laminated, in order, upon at least one surface of the copper foil, a roughening layer, an antitrust treatment layer, and a silane coupling layer. The surface treated copper foil has a developed area r...
|
|
JP6462940B1 |
To provide a copper foil with a carrier capable of remarkably suppressing the generation of blisters associated with hot press laminating on a resin base material. The copper foil with a carrier is provided with a carrier, a release laye...
|
|
JP6462375B2 |
|
|
JP6455778B2 |
|
|
JP6456229B2 |
To provide a suction mask for a solder ball comprising suction holes at narrower intervals correspondingly to narrow pitching of electrodes on a work while having a required and sufficient structural strength.In a suction mask 6, a numbe...
|
|
JP2019501285A |
Provided are a process for controlling the morphology of a high-purity lithium metal thin film and a high-purity lithium metal thin film. In a general embodiment, the present disclosure provides a high purity lithium metal thin film with...
|
|
JP2019005789A |
To provide a solder joint material with which a solder bump can be formed with a narrow pitch without generating a missing bump and with which the bump height can be easily adjusted, and provide a manufacturing method of the same, a manu...
|
|
JP6447928B2 |
Provided are a manufacturing method and a manufacturing apparatus for an aluminum film in which moisture and oxygen do not intrude into a plating chamber. A manufacturing method for an aluminum film, in which aluminum is electrodeposited...
|
|
JP2018204092A |
To provide a three-dimensional modeling apparatus for metallic material with high machining accuracy.Electrolytic solution that is retained in a capillary 103 is connected to a sacrificial electrode 101 and a model 106 at the same time. ...
|
|
JP2018202748A |
To provide: metal masks free from breakage by solving a problem of extension due to printing even for thin metal masks of 30 μm or less; and a method of manufacturing them.Metal masks have hardness of 650 Hv or more and are composed of ...
|
|
JP6440656B2 |
Provided is an electrolytic copper foil which has high tensile strength while maintaining high tensile strength even after heating, and also secures favorable foldability and folding resistance. To this end, the electrolytic copper foil ...
|
|
JP6438370B2 |
|
|
JP2018192775A |
To provide a carrier-attached copper foil having desirable circuit formability.A carrier-attached copper foil has a carrier, an intermediate layer, and an ultrathin copper layer in the stated order. On the ultrathin copper layer-side sur...
|
|
JP6434280B2 |
To provide an electrode for water electrolysis that is inexpensive and has a high power efficiency, namely, a low hydrogen generation voltage.An electrode for water electrolysis comprises a second metal body obtained as follows: with a f...
|
|
JP6434833B2 |
|
|
JP2018188734A |
To provide a component with differing material properties.A component (284) can be formed having an integral monolithic body (68). The integral monolithic body (68) can be formed by utilizing electroforming processes such as electrodepos...
|
|
JP6430092B1 |
Although it is a low-roughness roughened copper foil suitable for forming fine wire circuits, it has excellent circuit adhesion as well as etching properties and dry film resolution for electroless copper plating when used in the SAP met...
|
|
JP6427893B2 |
An object of the present invention is to provide a thin electrolytic aluminum foil having a thickness of 20 µm or less, which has excellent flexibility so that winding-up is not hindered by bending or twisting of the foil. Another objec...
|
|
JP6425135B2 |
To provide a method for manufacturing a vapor deposition mask having a through hole formed to have a complex shape, by making use of a plating treatment.A vapor deposition mask manufacturing method comprises: a preparing step of preparin...
|
|
JP6425399B2 |
|
|
JP6426147B2 |
An object of the present invention is to provide, at a low cost, a porous metal body that can be used in an electrode of a fuel cell and that has better corrosion resistance. The porous metal body has a three-dimensional mesh-like struct...
|
|
JP2018174955A |
To provide an electroformed body that can readily separate an electroformed layer formed on a mother die, and to provide a method for manufacturing the same and an outer blade body for an electric razor using the electroformed body.An el...
|
|
JP2018171902A |
To provide a copper foil with a release layer capable of preparing a fine circuit in a circuit buried substrate or the like by a simple step.There is provided a copper foil with a release layer which comprises a release layer, a barrier ...
|
|
JP6421222B2 |
Disclosed are novel copper foils used as components of wireless charging systems. The copper foils can be laminated to produce flexible copper clad laminates, which can then be etched to form printed circuits (coils). The coils can be us...
|
|
JP6405180B2 |
|
|
JP6408309B2 |
|
|
JP2018158150A |
To provide an improved method for producing an aperture plate for a nebulizer.In a method of manufacturing an aperture plate wafer, a photo-resist (21) is applied in a pattern of vertical columns having the dimensions of holes or pores o...
|
|
JP6403969B2 |
|
|
JP6400468B2 |
|
|
JP6400446B2 |
The purpose of the present invention is to provide a method for simply and effectively producing an electronic component having through-hole electrode (bump electrode) and plate-like member at the same time, and plate-like member with bu...
|
|
JP6396641B2 |
To provide a carrier-provided copper foil with improved thickness accuracy of an extremely thin copper layer on a copper foil carrier.A carrier-provided copper foil comprises a copper foil carrier, a release layer laminated on the copper...
|
|
JP2018145519A |
To provide a surface-treated copper foil which suppresses transmission loss well even when used in high-frequency circuit substrates and is excellent in peel strength when bonded to an insulating substrate composed of e.g. resin.There is...
|
|
JP6389916B2 |
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad lam-inate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in th...
|
|
JP6389915B2 |
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad lam-inate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in th...
|
|
JP6385922B2 |
A photo-resist (21) is applied in a pattern of vertical columns having the dimensions of holes or pores of the aperture plate to be produced. This mask pattern provides the apertures which define the aerosol particle size, having up to 2...
|
