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Matches 1,051 - 1,100 out of 4,754

Document Document Title
JP2021120917A
To provide an aluminum porous body which is high in strength and rough on the surface of a skeleton.An aluminum porous body is a sheet-like aluminum porous body having a skeleton of a three-dimensional network structure. In the aluminum ...  
JP6919247B2
To provide a production method of electrolytic aluminum foil that can prevent the foil from having scorch and/or damage.Part of the outer periphery of a cathode drum and an anode member are immersed in an electric aluminum plating soluti...  
JPWO2020049851A1
The metal porous body according to one aspect of the present disclosure is a sheet-like metal porous body having a skeleton having a three-dimensional network structure, and the skeleton is an alloy containing at least nickel (Ni) and ch...  
JP6915681B2
An aluminum porous body has a skeleton with a three-dimensional network structure, in which the skeleton is formed of an aluminum layer containing aluminum carbide, and when the aluminum porous body is subjected to XRD measurement, diffr...  
JP6913188B2
Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. ...  
JP6913189B2
Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. ...  
JP6909887B2
Provided are an electrolytic copper foil, an electrode comprising the same, and a lithium ion cell comprising the same. The electrolytic copper foil comprises first and second chromium layers each containing 15 μg/dm2 to 50 μg/dm2 of c...  
JP6905157B2
The present invention provides a roughened copper foil which enables the achievement of a good balance between excellent etching properties and high shear strength in processing of a copper-clad laminate or in production of a printed wir...  
JP6904852B2
To provide a master block for electrocasting which is prevented from variation with time which appears as displacement of a mask body formed on the master block by electrocasting, to allow a mask to be improved in accuracy by suppressing...  
JP2021103694A
To provide an electrolytic copper foil, an electrode including the electrolytic copper foil, and a lithium-ion battery.An electrolytic copper foil includes first and second chromium layers each of which has chrome of 15 μg/dm2 to 50 μg...  
JP6894325B2
The invention discloses an electrolytic copper foil with rugby-like copper nodules and a manufacturing method of a circuit board assembly. The manufacturing method of the electrolytic copper foil comprises the following steps: forming a ...  
JP6894811B2
The invention discloses manufacturing methods of an electrolytic copper foil and circuit board assembly. The manufacturing methods of an electrolytic copper foil having needle-shaped particles includeforming a copper foil by an electroly...  
JP6896801B2
A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 µm. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 µm2to 50 µm2. The average ...  
JP2021095638A
To solve the problem that, though the conventional technique provides high purity aluminum foil enough in ductility (having flexibility), it does not provide a means of the increase of the conductivity of an aluminum plating liquid and t...  
JP6893572B2
The purpose of the present invention is to provide a surface-processed copper foil with which there is very little variation in the adherence of the surface-processed copper foil and an insulating resin substrate which constitute a print...  
JP6882544B2
A copper foil with carrier 100 includes the carrier and an ultra-thin copper layer 104 disposed on the carrier, and the ultra-thin copper layer 104 includes a release side 104A facing the carrier. When the carrier is released from the ul...  
JP6879550B2
To provide an electrocasting device capable of efficiently producing a fine tube.The electrocasting device comprises an electrocasting tank 3 for electrocasting a wire, a feed bobbin 2 or feeding means of feeding a wire 1 into the electr...  
JP6883010B2
There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper ...  
JP6882570B2
To provide an electrolytic copper foil having a high elongation rate after its heat treatment, bending resistance, an adhesive surface of low roughness and high specular glossiness, and very few abnormal protrusions present on its rough ...  
JP6875711B2
To provide a titanium foil production method, capable of producing a smooth-surfaced titanium foil electrodeposited by molten salt electrolysis, having titanium purity comparable to that of industrial pure titanium, even with a thickness...  
JP6872947B2
To provide a copper foil with carrier in which the peel strength thereof is good when peeling the carrier, and the variation of the peel-strength is favorably suppressed.A copper foil with carrier comprises a carrier, a middle layer, and...  
JP6868375B2
The present disclosure provides a high-quality electrolytic aluminum foil which includes a smooth surface and an end portion containing no dendritic deposit, and a method for producing the same which can obtain the electrolytic aluminum ...  
JP6868361B2
To provide porous metallic foil that comprises uniform micropores with thin thickness and has the properties of: permeability to lights, gasses, and fluids; electric conductivity; and electromagnetic shield; and to provide a novel method...  
JP2021066949A
To provide a vapor deposition mask capable of heightening fineness; and to provide a production method of the vapor deposition mask.Concerning a vapor deposition mask, and a production method of the vapor deposition mask, the vapor depos...  
JP6861304B1
To provide an electrolytic copper foil capable of alleviating or preventing the occurrence of wrinkles, thereby improving the production yield of subsequent applications. An electrolytic copper foil, an electrode containing the electroly...  
JP6860706B2
Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. ...  
JP6861231B2
A method for fabricating metal decorations on a domed dial made of insulating material, wherein the method includes the steps of forming a photosensitive resin mould by a UV LIGA type process, and electrodepositing a layer of at least on...  
JP6860339B2
The method for producing an electrolytic aluminum foil of the present disclosure is a method for producing an electrolytic aluminum foil, the method including supplying an electrolytic solution in an electrolytic cell provided with a dia...  
JP2021055131A
To provide a production method of an electric casting mold that can accurately apply structure of a mold to a resin member even when the structure has a fine and delicate structure or a complex shape.A through hole 4 is formed so as to p...  
JP6855164B2
In order to provide a copper foil having an attached carrier foil, whereby the carrier foil can be easily peeled off a copper foil layer even when used during copper-clad laminate production using temperatures of at least 250°C, a coppe...  
JP6853370B2
Disclosed herein relates to a copper foil having a low roughness property by roughening a matte side, wherein a thickness of the copper foil is from 5 μm to 70 μm, and profilometer-measured mean roughness of the roughened surface of th...  
JP6851820B2
To provide a mask for vapor deposition in which deformation of a frame body and a mask body is prevented by means of a frame, to prevent the mask body from shifting away from the correct position, so that the accuracy of vapor deposition...  
JP6844291B2
To provide a plating plate and the production method thereof and the production method of a perforated member all of which can suppress dispersions of the shapes and positions of through-holes caused in a perforated member.A plating plat...  
JP6845382B1
Provided is a surface-treated copper foil having fine wiring workability and excellent adhesion to a resin substrate. A surface-treated copper foil having a roughened surface on its surface, the minimum autocorrelation length Sal of the ...  
JP6844010B2
Provided are an electroforming master that does not cause distortion in an electroforming mold, and a method for manufacturing an electroforming mold. In the present invention, an electroforming master having a relief pattern on a surfac...  
JP6842232B2
To provide a copper foil with a carrier high in adhesion force between the carrier and a metal layer before a laminating process to an insulation substrate and capable of easily peeling the carrier from the metal layer without extreme in...  
JP6837409B2
The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial li...  
JP2021028420A
To provide an electrolytic copper foil.The electrolytic copper foil has a drum surface and a deposition surface, and ΔRz is less than 0.8 μm. The electrolytic copper foil has a transverse direction. When the electrolytic copper foil is...  
JP6833945B2
To provide an electrolytic copper foil.The electrolytic copper foil has a drum surface and a deposition surface, and ΔRz is less than 0.8 μm. The electrolytic copper foil has a transverse direction. When the electrolytic copper foil is...  
JP2021024261A
To solve such problems that although a transparent conductive structure having a small thickness and a high conductivity to replace ITO is required, a method of digging a groove in a transparent substrate and pouring conductive ink into ...  
JP2021021136A
To provide a method for manufacturing a resin multilayer forming mold for manufacturing a timepiece component having a complicated shape and a method for manufacturing the timepiece component.A method for manufacturing, by photolithograp...  
JP6829859B2
[Problem] The present invention provides: a method for forming a mask with which it is possible to easily and reliably form a resin layer on the surface of a base layer in a closely bonded state; and a method for manufacturing a printed ...  
JP2021014623A
To provide a thin metal foil with a metal substrate whose appearance quality can be improved.A thin metal foil 100 with a metal substrate comprises: a metal substrate 1 including a first principal surface 11 and a second principal surfac...  
JP6823891B2
An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IA...  
JP6819905B2
To provide a cathode for production of an aluminum foil and a production method of aluminum foil which is expected to improve productivity and to allow continuous production by an electrodeposition method.There is provided a cathode for ...  
JP6823219B2
Electrodeposited copper foils having properties suitable for use as current collectors in lithium-ion secondary batteries are disclosed. The electrodeposited copper foils include a drum side and a deposited side. At least one of the depo...  
JP6821370B2
To provide a metal foil with a carrier which does not cause an extreme increase or decrease in the adhesion between the carrier and a metal layer in an insulating substrate laminating process and in which the adhesion force between the c...  
JP6822629B2
Disclosed are a copper foil capable of securing a secondary battery with high capacity maintenance rate, a method for manufacturing the same, an electrode comprising the same, and a secondary battery comprising the same. The copper foil ...  
JP6818141B2
The present invention relates to an electrolytic copper foil for a secondary battery and a method of producing the same, and more particularly, to an electrolytic copper foil for a secondary battery, in which a burr and curl of a negativ...  
JP2021001399A
To expect an electrolytic aluminum foil having possibility of being capable of adding various properties such as strength from such a background where tensile strength is effectively enhanced in order to make the most of an advantage in ...  

Matches 1,051 - 1,100 out of 4,754