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JP6667840B1 |
To electrolyze a thin electrolytic copper foil having an electric conductivity of 99% or more and 10 μm or less, in which the problem of warpage is suppressed, the front and back surfaces are smooth, the tensile strength is 500 Mpa or m...
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JP6663584B2 |
A porous metal body has a three-dimensional mesh-like structure skeleton and containing at least nickel and tin. The nickel content is 50 mass% or more, and the tin content is 5 mass% or more and 25 mass% or less. The porous metal body h...
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JP2020507682A |
The ultrathin copper foil with a carrier foil according to an embodiment of the present invention is a carrier composed of a carrier foil, a release layer, a first ultrathin copper foil, a Cu-Al adhesive strength improving layer, an Al l...
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JP6657548B2 |
A method for producing a metal porous body includes the steps of: performing electrical conduction treatment on a surface of a skeleton of a sheet-like resin porous body having the skeleton with a three-dimensional network structure, to ...
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JP6652548B2 |
An electrolytic copper foil having high corrosion resistance and good adhesion to an active material, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same are provided. The elect...
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JP6653313B2 |
A method for producing a nickel alloy porous body includes a step of applying a coating material that contains a nickel alloy powder of nickel and an added metal, the nickel alloy powder having a volume-average particle size of 10 µm or...
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JP6649001B2 |
To provide a copper foil with a carrier, with the occurrence of a copper residue larger than the circuit width of a specified circuit well inhibited, the circuit being formed on an ultrathin copper layer after detachment of a carrier lam...
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JP6652227B2 |
Deviation of positions of openings is reduced. A deposition mask includes an effective part in which a plurality of openings are provided, and an outer frame part surrounding the effective part. The effective part includes an outer perip...
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JP2020504262A |
For example, a method for manufacturing a fuel injector nozzle structure such as a nozzle plate, a valve guide, a combination of a nozzle plate and a valve guide, and other articles incorporating a microstructured feature. This method us...
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JP6640796B2 |
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as ...
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JP6639253B2 |
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JP6640567B2 |
Provided is a copper foil provided with a carrier which enables to form an extremely fine circuit and to suppress the disconnection of a circuit well. A copper foil provided with a carrier having, in order, an intermediate layer and an u...
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JP6634468B2 |
A three-dimensional porous composite structure comprises a porous structure and at least one carbon nanotube structure. The porous structure has a plurality of metal ligaments and a plurality of pores. The at least one carbon nanotube st...
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JP2020500263A |
To provide a master plate, a method for manufacturing a master plate, a method for manufacturing a mask, and a method for depositing OLED pixels. The method for manufacturing a master plate according to the present invention is a method ...
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JP6625102B2 |
The invention relates to a Fe-Ni alloy foil, and specially relates to a Fe-Ni alloy foil which is applied to an organic light emitting diode (OLED) material, and a method for manufacturing the Fe-Ni alloy foil.
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JP6624504B2 |
To improve adhesion of a thinned vapor deposition mask onto a substrate.A vapor deposition mask 20 has metal layers 21, 27, 32, 37, and a plurality of open holes 25 provided through the metal layers 21, 27, 32, 37. The metal layers 21, 2...
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JP6623320B2 |
This surface-treated copper foil has, on at least one surface of a copper foil substrate, a surface treatment coating film that comprises a roughening layer which is provided with roughening particles. If a cross-section of this surface-...
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JP6622103B2 |
Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided w...
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JP6619457B2 |
Disclosed are an electrolytic copper foil, a current collector including the same, an electrode including the same, a secondary battery including the same and a method for manufacturing the same capable of securing secondary batteries wi...
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JP6615776B2 |
There is provided a dissolver tube to generate a pressure change to a fluid to change a physical property of the fluid, the tube comprising: a hollow tubular outer body; an inlet cap coupled to the body at an inlet thereof; an outlet cap...
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JP2019203778A |
To provide a mechanical component having high spring properties while suppressing the occurrence of inconvenience such as cracks.There is provided a mechanical component 16 which includes: a main body 40 having a mounting hole 41 to whic...
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JP2019199645A |
To provide a vapor deposition mask capable of heightening weld strength, while suppressing occurrence of deformation such as warp.A vapor deposition mask 20 includes an outside part 17 of the vapor deposition mask 20, and an inside part ...
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JP2019195903A |
To provide a micro needle manufacture method.A micro needle manufacture method includes: a step at which a mold pillar 110 is produced; a step at which one or more coating layers 114 including a conductive polymer layer is formed on the ...
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JP6606317B1 |
Providing a surface-treated copper foil that has fine wiring workability that allows L & S to form fine wiring of, for example, 30/30 μm or less by a subtractive method with excellent process cost, and has excellent adhesion to a resin ...
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JP6605271B2 |
Provided is a metal foil that, when the metal foil has been provided with a release layer and then stuck onto a resin substrate, makes it possible for the resin substrate to be physically peeled away and, as a result, during a process wh...
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JP6600869B1 |
A step of subjecting the surface of the skeleton of a sheet-like resin porous body having a skeleton having a three-dimensional network structure to a conductive treatment to obtain a conductive resin porous body having a conductive laye...
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JP6600023B2 |
Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 μm to 3.5 μm, a peak density...
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JP6600689B2 |
Provided is a manufacturing method of a pattern sheet having excellent productivity at low costs. The manufacturing method of a pattern sheet includes: a process of producing, using a plate precursor 10 having a protruding pattern 12 for...
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JP6597920B1 |
It is a base material for a vapor deposition mask, which is a metal foil formed by electroplating. The metal foil is made of an iron-nickel alloy. Includes the first surface and the second surface, which is the surface opposite to the fi...
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JP6595548B2 |
The invention discloses an electrolyte solution, electrolytic copper foil and manufacturing method thereof. The electrolyte solution is used for manufacturing the electrolyte copper foil, and containscopper ions of 50 to 90 g/L, sulfuric...
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JP6593979B2 |
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JP2019178429A |
To provide an electrolytic copper foil having a uniform thickness and a method of manufacturing the electrolytic copper foil.An electrolytic copper foil includes 1 to 4 interface lines traversing a cross sectional area and weight deviati...
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JP6591766B2 |
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JP6591893B2 |
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JP6592029B2 |
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JP6592028B2 |
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JP2019173085A |
To provide a plated structural article of improved appearance quality for a watch.An electroformed structural article 8 is a plated structural article for a watch, and comprises a plurality of first electroformed parts 8a and a plurality...
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JP2019173164A |
To provide a method of manufacturing an aluminium foil capable of manufacturing high-quality aluminium foil with high efficiency while suppressing occurrence of an undulated pattern and a pinhole when manufacturing the foil.In the method...
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JP6588250B2 |
A cluster of non-collapsed nanowires, a template to produce the same, methods to obtain the template and to obtain the cluster by using the template, and devices comprising the cluster are described. The cluster and the template both hav...
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JP6587701B2 |
Disclosed is an electrolytic copper foil for a lithium secondary battery, which has yield strength of 30 kgf/mm 2 to 60 kgf/mm 2 , a surface area ratio of 1 to 3, and a weight deviation of 3% or below.
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JP2019167554A |
To provide a method of producing aluminum foil, capable of controlling scorch occurring at an early stage of foil production and generation of pinholes, and of highly efficiently producing aluminum foil of high quality, and aluminum foil...
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JP2019167617A |
To significantly reduce heat strain by suppressing loss in thermal energy.(A) Electroforming layers 1A, 1A are generated on a cathode substrate 1 by oppositely arranging the cathode substrate 1 and an anodic electrode 4 in an electrolyti...
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JP6584531B2 |
Disclosed is an electrolytic copper foil for a lithium secondary battery, which is applied as a negative electrode current collector of a lithium secondary battery, wherein after a thermal treatment at 300°C for 30 minutes, the electrol...
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JP6578539B1 |
[Task] In a conductive ball stationary mask for forming bumps on a substrate or wafer, the thickness is constant throughout the mask, and it is formed in various design patterns such as planar and linear, and has high Vickers hardness. A...
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JP6581219B2 |
Disclosed is an electrolytic copper foil for a lithium secondary battery, which is applied as a negative electrode current collector of a lithium secondary battery, wherein when a correlation between a thermal treatment temperature of th...
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JP6582156B1 |
The tensile strength measured using each cut copper foil obtained by cutting the electrolytic copper foil from one end to the other end in the width direction at intervals of 100 mm satisfies the following requirements (I) to (III). -Req...
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JP2019157264A |
To provide an iron nickel alloy shadow mask capable of solving such problems in which cost is high, energy consumption is high, accuracy of an opening is low, and a material easily deforms under a high temperature, and the manufacturing ...
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JP2019157262A |
To provide a metal shadow mask capable of solving a problem in which a shadow phenomenon easily occurs in vapor deposition on a glass substrate, and the manufacturing method thereof.A metal shadow mask is disclosed. A method for manufact...
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JP6570430B2 |
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JP2019143247A |
To provide a copper foil with a carrier in which generation of a copper residue exceeding a circuit width of a prescribed circuit is successfully suppressed when forming the prescribed circuit on an ultrathin copper layer after sticking ...
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