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JP6385922B2 |
A photo-resist (21) is applied in a pattern of vertical columns having the dimensions of holes or pores of the aperture plate to be produced. This mask pattern provides the apertures which define the aerosol particle size, having up to 2...
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JP2018135584A |
To provide a method for manufacturing an aluminum foil capable of improving productivity of an aluminum foil by an electroplating process by increasing a contact area of a cathode to enhance film deposition efficiency while avoiding upsi...
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JPWO2017051897A1 |
In the step of removing the metal foil from the resin base material by providing a mold release layer on the metal foil to enable physical peeling of the resin base material when the metal foil is attached to the resin base material. A m...
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JP6379038B2 |
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JP6379207B2 |
Disclosed is an electrodeposited copper foil, in which a center line roughness average Ra (µm), a maximum height Rmax (µm), and a ten-point height average Rz (µm) of a matte side satisfy an Equation below, 1.5 ‰¤ (Rmax - Rz)/Ra ‰...
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JP2018127684A |
To provide an electroforming filter and a production method of the electroforming filter that can easily identify whether a surface is to be placed on the upstream side or the downstream side of a fluid flow path.An electroforming filter...
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JP6373764B2 |
A purpose of the present invention is to provide an electrolytic copper foil which is superior in physical properties after high-temperature heating to conventional electrolytic copper foils and which is suitable also as the negative-ele...
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JP6368247B2 |
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JP2018111850A |
To provide a copper foil with a carrier that has both a good laser drilling property and a good circuit formation property.A copper foil with a carrier has a carrier, an intermediate layer, and an ultra-thin copper layer in this order. T...
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JP6360659B2 |
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JP6358944B2 |
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JP6357336B2 |
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JP6355814B2 |
Disclosed is an electrolytic copper foil obtained by heat treating a copper foil manufactured through electrolysis, the electrolytic coper foil having specific resistivity of 1.68 to 1,72µ© · cm and a grain mean diameter of a crystall...
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JP6355006B1 |
A metal in which the metal film electrodeposited on the electrodeposited surface of the cathode by the electrolytic method can be easily peeled off, but the difference in surface roughness between the peeled surface and the free surface ...
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JP2018102684A |
To provide a manufacturing method for an outer blade body of an electric razor the outer blade body of which is formed in a cylindrical form and equipped with a countersink in the cutting blade to be manufactured at low cost.An outer bla...
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JP6352449B2 |
Provided is an ultrathin copper foil with carrier capable of obtaining both microcircuit formability and laser processability, from the machining of a copper-clad laminate to the manufacture of a printed wiring board. This ultrathin copp...
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JP6353193B2 |
To provide a carrier-provided copper foil suitable for formation of fine pitches.A carrier-provided copper foil comprises a copper foil carrier, a release layer laminated on the copper foil carrier and an extremely thin copper layer lami...
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JP6349024B2 |
Disclosed is an electrolytic copper foil having specific resistivity of 1.68 to 1.72 µ© ¢ cm and a grain mean diameter of a crystallite less than 0.41 to 0.80 µ m.
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JP6346556B2 |
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad lam-inate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in th...
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JP6346244B2 |
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JP6342733B2 |
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JP6342078B2 |
Provided is a roughened copper foil that has good adhesiveness to resin as well as good abrasion resistance in spite of fine projections and recesses thereof having a low roughness suitable for fine-pitch circuit formation and high-frequ...
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JP6343205B2 |
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JP6339636B2 |
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as ...
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JP6336142B2 |
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JP6335449B2 |
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JP6331808B2 |
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JP6328821B2 |
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JP2018512227A |
In the present specification, a method of electroforming a needle cannula (100) for an injection device, which comprises an electrode (10), an anode (60), and an electrolytic solution (50) containing dissolved metal ions. Disclosed is a ...
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JP2018076601A |
To provide an electrolytic copper foil having excellent circuit formability.The electrolytic copper foil does not contain a roughening treatment layer at the side of a glossy surface, and the root mean square height of the glossy surface...
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JP6319771B2 |
Provided is a porous nickel thin film having a flexibility value of no more than 15.0 N/mm.
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JP6318689B2 |
An object of the present invention is to provide an electrolytic aluminum foil having no significant difference in properties between one surface and the other surface thereof, and also a method for producing the same. Another object is ...
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JP2018057476A |
To provide a decoration component having a through-hole in a metal including a titanium colored by anode oxidization, where the opened through-hole is filled with a metal different therefrom, and a method for manufacturing the decoration...
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JP6310192B2 |
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JP6310191B2 |
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JP6310193B2 |
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JP6304829B2 |
The purpose of the present invention is to provide: a copper foil for laser processing which has excellent laser processability and from which a wiring pattern can be satisfactorily formed; a carrier-foil-supported copper foil for laser ...
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JP2018508648A |
The present invention relates to a Fe-P-Cr alloy sheet and a method for producing the same. One embodiment of the present invention provides a Fe-P-Cr alloy sheet containing P: 6.0-13.0%, Cr: 0.002-0.1%, balance Fe and other unavoidable ...
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JP6300062B2 |
A drum electrode, which is used for a device configured to plate a surface of a long base material having electrical conductivity with a metal, includes a power feeding layer, an insulating layer which covers a surface of the power feedi...
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JP6300698B2 |
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JP6297124B2 |
The purpose of the present invention is to provide a copper foil that has better adhesiveness with an insulating resin substrate than an unroughened copper foil and has etchability as good as that of an unroughened copper foil. In order ...
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JP6298182B2 |
A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 μs/dm2. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated co...
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JP6296491B2 |
A metal structure includes, by mass %, Fe: 10% to 30%; S: 0.005% to 0.2%; and the balance consisting of Ni and unavoidable impurities, in which a maximum grain size of the metal structure is 500 nm or less. The metal structure preferably...
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JP2018040052A |
To provide an article that has a nanolaminated brass coating having useful characteristics.This invention relates to an article, comprising a nanolaminated brass coating comprising periodic layers of electrodeposited species and/or micro...
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JP2018031025A |
To provide a crystalline Al-Mn alloy foil excellent in tensile strength than Al alloy foils manufactured by conventional electrolysis and a manufacturing method therefor.There are provided a crystalline electrolytic Al-Mn alloy foil havi...
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JP6284144B2 |
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JP2018028136A |
To provide an anode case that achieves reduced plating resistance.The present invention provides an anode case 11 used for a plating device 10 that can plate the surface of a conductive base material with aluminum in a molten salt bath 1...
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JP2018028135A |
To provide a drum electrode that allows metal to be electrodeposited on the surface of a long base material in a plating tank and facilitates maintenance of it.The present invention provides a metal drum electrode 1 for a plating device ...
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JP6283664B2 |
The purpose of the present invention is to provide a copper foil that has better adhesiveness with an insulating resin substrate than an unroughened copper foil and has etchability as good as that of an unroughened copper foil. In order ...
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JP6274736B2 |
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