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JP6800401B2 |
To provide a technique for solving problems of graphene film formation with traditional thermal CVD or resin carbonization, without using carbon content gas such as methane gas, forming graphene at low temperature in a short time, and co...
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JP6797535B2 |
To provide a manufacturing method of a pillar array structure capable of manufacturing the pillar array structure containing a metal column with higher aspect ratio and a manufacturing method of an anisotropic electroconductive film usin...
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JP6797055B2 |
Provided is an electroforming master in which a transfer failure is not liable to occur during an additional electroforming process after separation of an electroformed article. Also provided is a method for manufacturing a mold using th...
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JP2020193364A |
To provide a metal filter and a production method thereof in which the occurrence of burrs on the inner wall of an open hole is suppressed.A metal filter 1 comprises a metallic sheet 3 that is a plating layer in which a plurality of open...
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JP6786567B2 |
An electrodeposited copper foil of high toughness having a lightness L* value of the deposit side in the range of 36 to 74, the copper foil having a tensile strength in the range of 40 to 70 kg/mm 2 , and a weight deviation of less than ...
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JP6785888B2 |
The present invention relates to a method for manufacturing a porous filter for fine spraying and a porous filter manufactured by the method. A nickel-palladium alloy material porous filter manufactured according to the present invention...
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JP2020532836A |
The present invention relates to a copper foil current collector having high adhesion to the cathode active material of a Li secondary battery. The present invention is an electrolytic copper foil having a first surface and the second su...
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JP6782561B2 |
Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes ...
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JP6784806B2 |
In order to provide a copper foil having an attached carrier foil, whereby the carrier foil can be easily peeled off a copper foil layer even when used during copper-clad laminate production using temperatures of at least 250°C, a coppe...
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JP6775350B2 |
To provide a method for producing an electrolytic aluminum foil which has appropriate surface roughness and has a crystal grain size having a predetermined size, and thereby prevents foil cutting even when produced by an electrolytic met...
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JP6774668B2 |
To provide a bubble removal method for use in a precision electroforming process, capable of more surely removing a bubble, dramatically improving the accuracy of the shape of a transfer face of an electrodeposited metal layer subsequent...
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JP6773935B2 |
The present invention provides a zinc foil that can be used as a negative electrode active material, and in a battery including the zinc foil as a negative electrode active material, the amount of gas generated during long term storage o...
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JP6767468B2 |
Provided are an electrolytic copper foil, an electrode comprising the same, and a lithium ion battery comprising the same. The electrolytic copper foil has a drum side and a deposited side opposing to the drum side, wherein a nanoindenta...
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JP6767441B2 |
To provide a copper foil having minimized sags, wrinkles and tears, an electrode comprising the same, a secondary battery comprising the same, and a manufacturing method therefor.A copper foil 100 comprises a copper layer 110, and has 29...
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JP6763626B1 |
[Task] A metal mask that is superior in printing durability to those produced by the conventional electro-nickel plating method, and is also excellent in printability because the plated precipitated surface is not glossy, and a method fo...
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JP2020152933A |
To provide an electrolytic aluminum foil manufacturing apparatus that can reduce the non-periodical occurrence of stripe shapes (hereinafter referred to as wrinkles) of a produced electrolytic aluminum foil in the crosswise direction of ...
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JP6759476B2 |
Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. ...
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JP6757773B2 |
To provide an electrolytic copper foil having high tensile strength, exhibiting high foldability resistance and foldability while maintaining high tensile strength even after heating.An electrolytic copper foil contains 20-150 mass ppm c...
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JP6756940B1 |
To provide an electrolytic copper foil, an electrode including the electrolytic copper foil, and a lithium ion battery including the electrolytic copper foil. The electrolytic copper foil includes a drum side and a deposition side which ...
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JP6755520B2 |
To provide a manufacturing method of a titanium foil capable of manufacturing the titanium foil with purity similar to industrial pure titanium, providing an electrodeposited titanium with a smooth surface even when thickness of the elec...
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JP6748169B2 |
To provide a copper-clad laminate using an electrolytic copper foil having less number of abnormal protrusions on a rough surface side, which may be suitably used for a flexible printed wiring board having a low HAZE value, while exhibit...
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JP2020125530A |
To provide a manufacturing method of a stamper in which unevenness is not produced on an outer shape of the mold with multistage structure.The stamper with a two-stage structure that is composed of a first-stage metal layer and a second-...
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JP6726210B2 |
A fuel cell electrode material is disclosed herein, which comprises a plurality of pores having a substantially uniform size of about 500 nm–5 mm, with a variation of < 20％, having a porosity of about 40-85％. This fuel cell electro...
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JP6727046B2 |
To provide a method for producing a pillar array structure capable of producing a pillar array structure including a metallic column with a higher aspect ratio.The surface of an aluminum substrate 1 is subjected to anode oxidation to for...
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JP6728733B2 |
To provide a method of manufacturing a vapor deposition mask having a through hole formed in a complicated shape by utilizing plating processing.A second film forming process of forming a first metal layer on a second metal layer include...
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JP6722452B2 |
The purpose of the present invention is to provide a surface-processed copper foil with which there is very little variation in the adherence of the surface-processed copper foil and an insulating resin substrate which constitute a print...
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JP6721547B2 |
To provide electrolytic copper foil used for producing a cathode current collector of a secondary battery or the like by way of a roll-to roll process, capable of preventing the deterioration of product productivity, which is caused by a...
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JP6723338B2 |
Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to ...
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JP6722266B2 |
Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with s...
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JP6724976B2 |
Provided is a metal oxide film including a metal oxide represented by formula (1) or a metal oxide that includes ZnO, the metal oxide film having a porous structure in which a plurality of needle-shaped or plate-shaped crystals are dispo...
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JP6720564B2 |
To provide a method for manufacturing a vapor deposition mask device having a vapor deposition mask to be properly welded to a frame.A vapor deposition mask device manufacturing method comprises: a preparation step of preparing a vapor d...
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JP2020097791A |
To provide an electrolytic copper foil having good mechanical properties, thereby reducing the breaking of the electrolytic copper foil to improve the production yield thereof.Provided are an electrolytic copper foil, an electrode compri...
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JP6709498B2 |
To provide a manufacturing method of an aluminum foil by improving detachability of the aluminum foil from an electrodeposition surface of a roughening treated cathode drum and the cathode drum used for manufacturing the aluminum foil.In...
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JP6708398B2 |
To provide a manufacturing method of a through wiring board capable of preventing a damage from occurring at detachment of the board.A manufacturing method of a through wiring board includes the steps of: preparing a laminate formed by c...
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JP2020087565A |
To eliminate an alignment between a conductive film and an object to be measured.A conductive film 1 includes: a resin sheet 12 having elasticity; and a plurality of metal rods 14 disposed at the inside of the resin sheet 12 and penetrat...
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JP6704445B2 |
Disclosed is an electrolytic copper foil for a lithium secondary battery, wherein a curl indicator C of the electrolytic copper foil, which is defined as 1.21R+1.12Cr+0.01G, is 0 or above and 4.0 or below, where R corresponds to ...
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JP6704267B2 |
To provide an electroforming apparatus that causes no failure due to generation of voids in an electroformed article when used in applying electroforming to a matrix having a recessed shape part (a shape part to which air bubbles are eas...
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JP6701543B2 |
To produce a vapor deposition mask capable of processing a large sized substrate.The vapor deposition mask 20 includes: a pair of ear parts 17 for constituting a pair of edge parts in a long direction of the vapor deposition mask 20; and...
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JP6700347B2 |
To provide a copper foil having minimized sags and tears, an electrode comprising the same, a secondary battery comprising the same, and a manufacturing method therefor.A copper foil 100 comprises a copper layer 110 and an antirust film ...
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JP6700350B2 |
To provide a copper foil having excellent workability and charge-discharge behavior, an electrode comprising the same, a secondary battery comprising the same, and a manufacturing method therefor.A copper foil 100 has a copper layer 110 ...
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JP6694578B2 |
To provide a method for producing aluminum foil capable of continuously performing an operation from the formation of an aluminum film to its coiling and further capable of suppressing the contact of an aluminum electrolytic solution wit...
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JP6695929B2 |
This hydrogen permeable membrane comprises an alloy film which contains Pd and Cu. This alloy film is an electrolytic plating film and has a BCC structure; and the Pd:Cu ratio (atomic ratio) in this alloy film is from 4:6 to 6:4.
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JPWO2018207788A1 |
An electrolytic copper foil having a surface treatment layer on the glossy surface side. In this electrolytic copper foil, the squared average square root height Sq of the surface of the surface treatment layer is 0.550 μm or less, and ...
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JP6680727B2 |
Provided are an electrolytic copper foil capable of improving a capacity retention rate of a secondary battery, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrol...
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JP6681152B2 |
To provide a stent manufacturing method that prevents heat that is generated in the case of laser processing from being generated at the time of processing.A tubular object manufacturing method of an embodiment includes: a process of dra...
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JP6670444B2 |
To provide a metal for manufacturing an electrolytic aluminum foil applicable for manufacturing the electrolytic Al foil using a nonaqueous electrolyte and effective for suppressing a sludge coated film, a manufacturing method therefor, ...
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JP2020508399A |
One embodiment of the present invention includes a copper layer and a rust preventive film arranged on the copper layer, and has 3800 to 4600 kgf / mm.2Provided are copper foils having a Young's modulus and a modulus bias factor (MBF) of...
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JPWO2018211740A1 |
An aluminum plating film containing aluminum as a main component, the aluminum plating film has an intervening layer containing a metal having a lower ionization tendency than aluminum between the coating surfaces at both ends in the thi...
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JP2020041178A |
To provide a vapor deposition mask capable of satisfying adhesion and dimensional accuracy.In a vapor deposition mask 20 including a metal layer, and a plurality of open holes 25 provided in the metal layer, the metal layer has an iron a...
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JP2020508231A |
The present invention includes at least one copper layer having a roughened surface, obtained by roughening at least one surface of the base copper layer to have a low profile, 5 μm to 70 μm. When the thickness of the copper layer exce...
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