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JP2019143168A |
To provide a laminate capable of providing an electrocast layer, to which a surface shape of a base material is accurately transferred.A laminate 1 according to the disclosure comprises a base material 2 having an electrical insulation p...
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JP6567929B2 |
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JP2019137902A |
To provide an aluminum foil having softness (flexibility) suitable for use of a current collector with a degree that can wind and manufacture a coil-like aluminum foil.An aluminum foil has a thickness of 20 μm or lower and is composed o...
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JP6561825B2 |
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JP6558424B2 |
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JP6557493B2 |
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JP6554203B2 |
The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untre...
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JP2019116689A |
To provide a copper foil with a carrier capable of well suppressing generation of copper residue exceeding a circuit width when forming a predetermined circuit on an ultrathin copper layer after laminating on a resin substrate and peelin...
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JP6545300B2 |
The present invention provides an electrolytic copper foil almost without wrinkling defect, an electrode comprising the same, a secondary battery comprising the same and a method for manufacturing thesame. The electrolytic copper foil ha...
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JP6545854B2 |
Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a p...
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JP6546836B2 |
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JP6545395B2 |
Provided are a method of producing a mesh filter, which is capable of forming more minute holes than by punching processing, and which makes it possible, by forming meshes of different openings on the same base material, to appropriately...
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JP6545389B2 |
The present invention provides a method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, wit...
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JP6546252B2 |
The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer hav...
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JP2019112724A |
To provide a copper foil with a carrier capable of favorably suppressing the generation of a copper residue exceeding a width of a predetermined circuit when the circuit is formed on an ultrathin copper layer after the copper foil is lam...
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JP2019108970A |
To provide a strut capable of being used in a variety of environments, which has features adaptable to a desired environment in operation.A method of forming a strut (20) includes providing a ring (24) with a threaded section (24T), coup...
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JP6537279B2 |
To provide a surface-treated copper foil which adheres suitably to a resin, is excellent in transparency of a resin after removing the copper foil by etching and has less transmission loss of signal and to provide a laminated board using...
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JP6537278B2 |
To provide a surface-treated copper foil showing good adhesion with a resin and giving excellent transparency of the resin after the copper foil is removed by etching, and a laminate sheet using the surface-treated copper foil.In the sur...
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JP6537280B2 |
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JP6539281B2 |
Provided is a blackened surface treated copper foil having a treated surface that is blackened by fine roughening with the use of copper grains. The treated surface of the blackened surface treated copper foil has a root mean square slop...
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JP6537155B2 |
A titanium foil or a titanium sheet is produced by electrodeposition from molten salt using constant current pulse, the method comprising: forming an electrodeposited titanium film on a surface of a cathode electrode made of glassy carbo...
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JP6535098B2 |
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JP2019099863A |
To restrain damage occurrence such as a crack in a vapor deposition mask.In the vapor deposition mask where a plurality of through holes are formed from a first face to a second face, a side wall of the through hole is constituted so as ...
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JP2019516858A |
A method of metallizing vias in a substrate is disclosed. In one embodiment, the method of metallizing vias comprises placing the substrate on a growth substrate. The oval has a first side, a second side, and at least one via. The first ...
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JP6533520B2 |
Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conduc...
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JP6533267B2 |
Disclosed are an electrolytic copper foil with a minimized curl preventable from being folded and/or wrinkled during a roll-to-roll (RTR) process, a manufacturing method thereof, and an electrode and a secondary battery capable of guaran...
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JP6529646B2 |
A purpose of the present invention is to provide an electrolytic copper foil which is superior in physical properties after high-temperature heating to conventional electrolytic copper foils and which is suitable also as the negative-ele...
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JP6529640B2 |
Provided is an ultrathin copper foil with carrier capable of obtaining both microcircuit formability and laser processability, from the machining of a copper-clad laminate to the manufacture of a printed wiring board. This ultrathin copp...
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JP6529516B2 |
In manufacturing of a first electroformed component (40) and a second electroformed component (60) having portions fitted to each other into close contact, after the first electroformed component (40) is formed, the first electroformed c...
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JP6528939B2 |
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JP6529684B2 |
Provided is a surface-treated copper foil which has fine line-to-line spaces or line widths, has excellent etching properties, laser processability, and thin foil handling properties, and has less pinholes and a higher tensile strength. ...
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JP6526558B2 |
The purpose of the present invention is to provide a composite metal foil for the production of a printed wiring board, which has a good balance among three characteristics, namely low thermal expansion properties better than those of co...
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JP6527219B2 |
Provided is an electrolytic copper foil, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil has an optimizedpeak roughness so as to improve a capa...
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JP6526748B2 |
A method for fabrication of a piece including, superposing an electrically insulating layer including a first orifice, an additional layer including a first aperture, an intermediate layer including a first hole, and a base layer surmoun...
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JP6521806B2 |
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JP6519395B2 |
To provide a vapor deposition mask manufacturing method capable of suppressing the occurrence of delamination between a first metal layer and a second metal layer forming a vapor deposition mask.A vapor deposition mask manufacturing meth...
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JP6522974B2 |
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JP6521074B2 |
Provided are a novel electrode device capable of simultaneously solving a problem of sludge coat covering an anode surface, and a problem of increase in the inter-electrode distance between the anode and cathode, and a method for manufac...
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JP6518307B2 |
A method for manufacturing a metallic nanospring includes preparing a nanotemplate having a nanopore and including a working electrode disposed on its one surface, preparing a first metal precursor mixture including ascorbic acid (C6H8O6...
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JP6511398B2 |
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JP6510601B2 |
Provided are an easily handleable electrolytic copper foil which secures a highly durable secondary battery, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolyti...
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JP6509392B2 |
A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminate...
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JP6505169B2 |
Provided are an electrolytic copper foil capable of securing a secondary battery having a high capacity retention rate, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The ...
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JP6501889B2 |
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JP6498091B2 |
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JP6499598B2 |
Provided is a method of producing a transdermal absorption sheet using an electroforming mold. A method of manufacturing an electroforming mold includes preparing a mold which is a matrix having a recessed pattern, immersing the mold in ...
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JP6500138B2 |
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JP6495058B2 |
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JP2019508579A |
The present invention relates to a Fe-Ni-P alloy multilayer steel sheet and a method for producing the same. One embodiment of the present invention is an Fe-Ni alloy layer containing Ni: 30-85% by weight, the balance Fe and other unavoi...
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JP2019044220A |
To provide a demolding method in which a member is easy to demold from a matrix regardless of the size of a gap between the matrix and an electroformed film.A demolding method for a cylindrical member comprises: a step in which an insula...
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