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JP6630015B2 |
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JP6627224B2 |
To reduce an elution amount of aluminum, form an anodic oxidation coating with a high coating density, and after then, perform sealing treatment only near pore surfaces in a short time and in an efficient manner, in surface treatment for...
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JP6628569B2 |
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JP6620958B2 |
A plating apparatus includes a plating tank and a plating unit that performs electrolytic plating on an object. The plating unit includes a workpiece passage region including a partition wall that allows passage of the plating solution b...
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JP6621377B2 |
There are provided a plating apparatus and a plating method that allow determining an appropriate replacement timing of a diaphragm. The plating apparatus includes an anode bath, a cathode bath, a diaphragm, an analyzer, and a control de...
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JP6619718B2 |
Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more t...
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JP6616856B2 |
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JP6604342B2 |
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JP6600869B1 |
A step of subjecting the surface of the skeleton of a sheet-like resin porous body having a skeleton having a three-dimensional network structure to a conductive treatment to obtain a conductive resin porous body having a conductive laye...
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JP6600724B1 |
To provide a conductive ring having excellent consistency of current density distribution, a power supply device using the conductive ring, and an electroplating jig by the power supply device. The present invention includes a conductive...
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JP6597771B2 |
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JP2019183246A |
PURPOSE: To prevent a decrease in plating accuracy close to a liquid level of a plating solution by reducing ruffle of the liquid level of the plating solution and fluctuation of a liquid level due to a reflection wave when plating is in...
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JP6594445B2 |
A manufacturing apparatus for a semiconductor device includes a substrate holding unit configured to hold a substrate; a processing liquid supply unit configured to supply a processing liquid onto the substrate held by the substrate hold...
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JP6591445B2 |
A device for performing anodizing treatment on a part, the device including a treatment chamber including a part for anodizing together with a counter-electrode situated facing the part to be treated, the part to be treated constituting ...
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JP6589748B2 |
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JP6589747B2 |
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JP6590855B2 |
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JP2019174249A |
To provide a method for measuring the distance between holes which can accurately measure the distance between holes of a porous body accurately.The method for measuring the distance between holes includes the steps of: emitting an X-ray...
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JP6588973B2 |
An object of the present invention is to provide a product excellent in corrosion resistance and abrasion resistance. In order to achieve the above object, a laminated body according to the invention includes a substrate and a coating fo...
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JP6585434B2 |
A method of plating a substrate, such as a wafer, by applying a voltage between the substrate and an anode is disclosed. The plating method includes: preparing a substrate having a recess formed in a surface thereof, a conductive layer b...
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JP6581121B2 |
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JP6576619B2 |
The invention relates to an electrochemical analysis method for monitoring and controlling the quality of electrochemical deposition and/or plating processes whereby the electrochemical analysis method uses a fingerprinting analysis meth...
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JP6573437B1 |
To provide an electroplating apparatus having a simple structure, a good perturbation effect of an electroplating liquid, and a good forming mass of a plating layer. In an electroplating apparatus, a stirring component is installed betwe...
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JP2019148563A |
To accurately determine the concentration of an accelerant added to a copper plating solution.In "analysis processing" of a copper plating solution X, a processing unit 43 of an analysis device 4 brings a reference electrode 11R, a worki...
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JP6567437B2 |
To provide a water plating treatment device and a water plating treatment method, in plating treatment using a chamber, capable of preventing the leakage of a plating solution from the chamber and further capable of preventing the phenom...
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JP6558424B2 |
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JP2019131854A |
To provide a bath-liquid control device and a bath-liquid control method for an electrodeposition coating line with low cost and high coating quality without causing any coating defects in an electrodeposition coating line even in a low ...
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JP6556221B2 |
[Problem] To reliably evaluate the degree of degassing of a processing liquid for processing a work object having a fine pattern comprising grooves or holes in the surface thereof, regardless of the type of gas and the like. [Solution] T...
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JP6555455B1 |
This electric Sn-plated steel sheet includes a base steel sheet, an electric Sn-plated layer arranged on the base steel sheet, having a Sn layer and an alloy layer, and containing a predetermined component. The Pb content of the entire e...
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JP6551550B2 |
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JP2019126146A |
To perform high-quality plating in which a thickness of a plating film is stable without much labor.The electroplating apparatus according to the embodiment comprises: a mounting portion 21 which forms a sealed space 22 together with a b...
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JP6548960B2 |
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JP2019520484A |
Described is an electrochemical deposition system with two or more electrochemical deposition modules located on a common platform and configured to deposit one or more metals on a substrate. Each electrochemical deposition module separa...
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JP6543616B2 |
To provide a technique of increasing a rate of filling holes or grooves formed in a substrate, by changing the temperature, the concentration, the current density, and the other conditions of the ordinary copper plating. A method for fil...
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JP6542168B2 |
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JP6537130B2 |
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JP6539390B2 |
A distribution system 10 for chemical and/or electrolytic surface treatment of a substrate 30 in a process fluid, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, and a distribution method fo...
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JP2019104973A |
To detect abnormality in electrical resistance due to a cause of occurrence in a substrate holder.The substrate holder comprises a plurality of internal contacts in contact with the periphery of a substrate, a plurality of external conta...
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JP2019099828A |
To provide an electroplating apparatus anode unit in which, since the optimal power supply position to the anode in an electroplating apparatus may vary depending on a variety of conditions, then, in order to perform optimal plating-proc...
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JP2019094518A |
To carry out inspection of poor plating of a substrate at the same time as processing in a plating apparatus.A washing apparatus is intended to wash a plated substrate. The washing apparatus includes a washing tank configured to store th...
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JP6531708B2 |
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JP6531140B2 |
The disclosure provides an intelligent water control equipment for intermittently countercurrent rinsing plating articles, comprising: a multi-stage countercurrent rinse tank, a PLC automatic control system, a liquid level sensor, a wate...
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JP6524939B2 |
In a method of manufacturing a Ni plated coating that includes at least one Ni plated layer, an agitation intensity of a plating bath is changed while the Ni plated layer is being electrodeposited to change potential of the deposited Ni ...
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JP6526868B2 |
To suppress thicknesses of a plating film of dies adjacent to a portion in which patterns are not formed on a resist, and improve uniformity of a plated metal layer thickness in a substrate surface. A substrate holder according to the pr...
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JP6517252B2 |
An electroplating clamp conductive-type reel-to-reel vertical continuous electroplating device, composed of an unreeling machine (1), a pre-treatment section (2), an electroplating section (3), a post-treatment section (4), and a reeling...
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JP6517574B2 |
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JP6515146B2 |
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JP6508935B2 |
A substrate holder according to the present invention comprises a first power supply member and a second power supply member which allow power to be supplied to substrates having different properties. The first power supply member compri...
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JP6509549B2 |
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JP6510993B2 |
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