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JP5971312B2 |
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of meta...
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JP5967034B2 |
A solid electrolyte membrane (13) is arranged on a surface of an anode (11) between the anode (11) and a substrate (B) that serves as a cathode. The solid electrolyte membrane (13) is brought into contact with the substrate (B). At the s...
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JP3205423U |
[Subject] An automation electroplating system is provided. [Means for Solution] Host computer main controller 1 and first radio transceiver antenna 3, Second radio transceiver antenna 4, CPU5, address block group 6, data memory 7, curren...
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JP5958225B2 |
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JP2016130363A |
To stably obtain a plating film which can selectively remove an organic compound which causes defects in a plating solution, without reducing density of a useful additive, and in which haze or projection is not generated for a long perio...
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JP2016519720A |
Provided are methods and devices of electrical deposition in cylindrical structures. The present invention is a method of electrochemically depositing a thin layer on a flexible substrate, which is a step of attaching the flexible substr...
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JP5941525B2 |
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JP2016113652A |
To efficiently perform predetermined electrolytic treatment to a treated body, using a treated ion contained in a treatment liquid.The electrolytic treatment method comprises: a step A1 for, applying voltage to an indirect electrode, and...
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JP2016113638A |
To provide a method for producing an aluminum membrane, which enables aluminum membrane having excellent surface smoothness to be produced continuously, on a large scale and at a low cost.The method for producing an aluminum membrane is ...
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JP5938426B2 |
An electroplating cell (10) includes an anode chamber (12) in which an anode chamber solution (20) is stored and a separator (16) that separates the anode chamber (12) and a cathode (26) from each other. An organic plating additive is ad...
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JP5938530B2 |
The device 1 according to the invention is suggested for gentle treatment of a flat material B to be treated with a treatment liquid F. The device 1 has the following components: at least one treatment chamber 20, in which the treatment ...
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JP2016108593A |
To provide a plating film forming method that can maintain the film anticorrosion property and throwing power capability well, as well as that can suppress the generation of hexavalent chromium.The method includes forming a chromium plat...
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JP2016108576A |
To provide a plating method and a plating device capable of preferably performing plating, even when electric resistance of a material to be plated is high.The plating method and the plating device of the invention are configured so that...
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JP5932870B2 |
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JP5927635B2 |
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JP5916807B2 |
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JP5915294B2 |
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JP2016069699A |
To solve such problems that upon forming a transparent electrode layer by electroplating on a film substrate where a resist layer having a resist opening is formed, more charges are supplied to both side portions in a width direction of ...
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JP5912914B2 |
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JP2016056401A |
To provide a metallic film having an extremely large specific surface area and a rough surface structure, and a suitable production method of the metallic film.A production method of a copper three-dimensional nanostructure comprises a s...
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JP5901132B2 |
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JP5900213B2 |
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JP5901269B2 |
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JP5898540B2 |
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JP5900046B2 |
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JP5894721B2 |
Provided are a surface-treatedmetal sheet which includes a nickel layer having improved corrosion resistance and a method of manufacturing a formed article. In a surface-treated metal sheetwhereanickel layer is formedonasubstrate, thepro...
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JP5893914B2 |
A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating soluti...
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JP5894254B2 |
A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing...
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JP5888732B2 |
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JP5890655B2 |
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JP5884181B2 |
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JP5884169B2 |
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JP5881861B2 |
An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having ...
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JP5880364B2 |
The invention offers an aluminum-plating apparatus that can satisfactorily form an aluminum plating even on the surface of a base body that has a surface on which an insulating or poorly conductive metal oxide film or the like is formed....
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JP5880510B2 |
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JP5876767B2 |
A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating sol...
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JP5874107B2 |
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JP5867178B2 |
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JP5865958B2 |
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JP5863301B2 |
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JP5862891B2 |
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JP5862269B2 |
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JP5861176B2 |
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JP5862917B2 |
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JP5861145B1 |
To provide a nozzle-anode unit which is used in a plating apparatus provided with an anode displacement mechanism and whose position of an anode can be easily controlled during electroplating. A NAU 10 including a plating solution ejecti...
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JP5859072B1 |
To provide a method for producing a surface-treated steel sheet, which can stably form a sufficient amount of a metallic oxygen compound film on a steel sheet and is more cost-effective. A steel sheet is immersed in an electrolytic treat...
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JP2016017223A |
To provide a method of easily evaluating the superiority/inferiority of the generation of iron seeding in a cationic electrodeposition coating material in an electrodeposition coating line by a small quantity scale-compact apparatus.Prov...
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JP5841387B2 |
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JP2016002500A |
To provide a liquid surface purifying device which can inexpensively and efficiently remove foreign matters floating on a liquid surface even in a storage tank of which a liquid surface level fluctuates significantly.A liquid surface pur...
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JP5838431B1 |
To provide a zinc dissolution promoting member which can be easily manufactured with little deterioration of a film even when used for a long time. In the zinc dissolution promoting member of the present invention, an acidic electroplati...
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