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JP2017186677A |
To reduce an amount of a black film falling from a soluble anode as much as possible by maintaining the black film on a surface of the soluble anode consisting of phosphorous-containing copper stably.An electrolytic copper plating device...
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JP2017176976A |
To provide a solid-liquid separation device capable of performing solid-liquid separation of liquid containing fine particles with a high filtration speed and capable of easily recovering the fine particles captured on filter material.Fi...
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JP6209668B1 |
[Subject] It makes it possible to be hard to produce poor plating in a processed material at the time of plating processing, and for a processed material to be unable to remain easily into a basket, and to move a processed material to ea...
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JP2017171980A |
To provide a double-side plating device capable of suppressing generation of surface defects of a processed film substrate to overcome an increase in the surface defects of the processed film substrate caused by accumulation of a plating...
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JP6198456B2 |
A substrate processing method of performing a predetermined processing by supplying a processing liquid to a processing region of a substrate and using processing target ions in the processing liquid, includes: arranging a template to fa...
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JP2017160503A |
To provide a plating device, a plating method and a manufacturing method of a conductive pattern, which can apply suitable electrolytic plating in particular even when electric resistance of a material to be plated is large, in the elect...
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JP2017154059A |
To properly adjust a supply quantity and a discharge quantity of fluid supplied to a treatment tank, in a treatment device.An auxiliary device executes predetermined treatment to a work by using fluid R supplied to a treatment tank from ...
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JP6193005B2 |
Providing a holding device which can hold a plurality of types of workpieces and can reliably prevent a liquid in a liquid tank from leaking. The holding device (40) includes a holding member (41) configured to hold an article (workpiece...
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JP2017152492A |
To provide a plating method for a printed wiring board and an electrolytic plating apparatus capable of easily controlling variations in plating thickness of a printed wiring board due to a plating method of a printed wiring board by a d...
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JP6187725B1 |
To the inside of the fusion salt consisting of chlorination lithium, potassium chloride, and alkaline metal fluoride, It is in the state which dissolved at least 1 side of silicon content alkali metal salt and silicon content ammonium sa...
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JP6189656B2 |
Providing a power-supplying member capable of desirably performing plating for a long period of time. A second power-supplying member (30) is brought into contact with an article (1) to be plated to apply negative voltage to the article ...
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JP2017147441A |
To provide a direct current plating method for inhibiting void formation, reducing dimples and eliminating nodules.After a period of time, walls of a through-hole is conformal plated (II). By the end of a high current density time period...
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JP2017145502A |
To provide a method of filling through-holes to reduce voids and other defects.A direct current plating method is for inhibiting void formation, reducing dimples and eliminating nodules. The method involves electroplating copper at a hig...
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JP2017145505A |
To provide a manufacturing method of an electrogalvanized steel sheet capable of easily inhibiting deterioration of appearance of products due to corrosion of a conductor roll contacting a steel sheet by a simple method.In an electrogalv...
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JP2017137519A |
To provide a plating device and a plating method capable of automatically and properly adjusting the diameter of an opening of an anode mask or of a regulation plate.There is provided a plating device which includes: an anode holder; a s...
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JP6176235B2 |
Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A fil...
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JP6173197B2 |
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JP6170938B2 |
Provided herein are methods and apparatus for determining leveler concentration in an electroplating solution. The approach allows the concentration of leveler to be detected and measured, even at very low leveler concentrations. Accordi...
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JP6168101B2 |
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JP6169719B2 |
A device for electrolytically coating an object is disclosed. In one aspect, the device includes an electrolyte container containing an electrolyte and a first DC power source. The device also includes at least one soluble anode which is...
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JP6162881B2 |
The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than ...
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JP6162079B2 |
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JP6161863B2 |
A substrate with a through-hole is immersed in a plating solution in a plating tank. A pair of anodes are disposed in the plating solution in the plating tank in facing relation to face and reverse sides, respectively, of the substrate i...
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JP6157873B2 |
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JP2017118069A |
To provide an electrolytic plating method which allows for desired electrolytic plating even when a low resistance part to be plated relatively easily and a high resistance part not to be plated easily exist on a plated material, especia...
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JP2017115170A |
To provide a plating device and a plating method suppressing the decomposition and denaturation of an addition agent added to a plating liquid.Provided is the plating device comprising: an anode tank 20 holding a plating liquid Q1 and st...
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JP2017101300A |
To provide a method for manufacturing a wiring board allowing for formation of a metal film F having a more uniform film thickness on a base layer U formed on a resin substrate B.A method for manufacturing a wiring board: comprises a ste...
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JP6142199B2 |
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JP6142198B2 |
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JP2017095762A |
To provide a metal plating processing system capable of reducing a size and a weight of a carrier holding mechanism, on a multijoint robot for detachably holding a work carrier which holds a metal plating processing object, and capable o...
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JP6139379B2 |
An Sn alloy plating apparatus is disclosed which can relatively easily perform control of an Sn alloy plating solution, including control of the Sn ion concentration and the acid concentration of the plating solution. The Sn alloy platin...
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JP6135538B2 |
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JP2017080740A |
To provide a waste water treatment apparatus, method, and system capable of performing advanced treatment of waste water containing heavy metals and compounds forming metal complexes without adding a flocculant thereto and capable of suf...
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JP6129497B2 |
The serial galvanizing system comprises: a galvanizing tank (10), which contains a galvanizing solution (11); galvanizing workpieces that are transferred serially, while they are held by a transfer support and are attached to a cathode; ...
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JP6123087B2 |
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JP6121944B2 |
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JP6121090B2 |
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JP6119722B2 |
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JP6119353B2 |
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JP6114903B2 |
To provide a method for regenerating waste water of nickel plating by which waste water of nickel plating discharged from a plating plant is generated not to a reusable sludge, but to a valuable plating solution usable in the plating pla...
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JP6117891B2 |
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JP6115309B2 |
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JP6118893B2 |
For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electro...
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JP6114007B2 |
It is an object of the present invention to provide a cage for a rolling bearing having a film, formed on a surface thereof, which wears little over a long period of time from an initial stage of sliding contact between the film and roll...
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JP6111241B2 |
The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler and/or promoter for copp...
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JP6106698B2 |
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additi...
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JP6103050B2 |
Provided is a method for manufacturing a plating film having excellent mass-productivity and high uniformity. This method for manufacturing a plating film includes readying a substrate and a plating solution in which Bi and Te are dissol...
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JP6100049B2 |
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JP2017052986A |
To provide a method for adjusting the distance between a substrate and the cylindrical body of an adjustment plate without changing the position of the electric field adjustment plate.Provided is: an adjustment plate in which an edge 31 ...
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JP2017053008A |
To provide a plating method capable of reducing treatment cost by simplifying a process, a plating device, and a method for producing a semiconductor device.Provided is an electroplating method where pattern-shaped anode and cathode are ...
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