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JP6798069B1 |
In a plating facility mainly composed of a plating groove 1, a recovery groove 2, a cleaning groove 3, and a PLC automatic control system, the cleaning liquid recovered in the recovery groove is concentrated, and the concentrated liquid ...
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JP6798070B1 |
To provide a high-pressure spray spray device capable of reducing the amount of chromium-containing wastewater and at the same time reducing the amount of electroplating ions input and the amount of cleaning water input to obtain more th...
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JP6796243B2 |
To provide a plated material having conductivity, thermal conductivity and heat resistance comparable with a precipitation hardening copper alloy material used in a continuous casting mold or a metal mold and capable of thickening by a s...
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JP6793742B2 |
An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate includes a base body having a flat plate shape; an electrode provided at the base body; three or more terminals provided at ...
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JP6795821B2 |
To provide a processing method for removing an iron ion from gold plating liquid containing the iron ion.The processing method of the gold plating liquid comprises a step of bringing the gold plating liquid containing the iron ions and c...
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JP6795915B2 |
There is provided a feeder capable of reducing deterioration of the contact state between the feeder and an anode more than the prior art as dissolution of the anode progresses. The feeder can supply power to the anode 5 for use in plati...
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JP6793966B2 |
A workpiece holding jig that has: a conductive frame-like member 630; a plurality of conductive first chuck members 610 that are supported on an upper frame member 631 and grip an upper side of a rectangular workpiece 20; a plurality of ...
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JP6794138B2 |
An apparatus for automatically generating a metal-containing electrolyte (e.g., an electrolyte containing Sn2+ ions and an acid) includes an anolyte chamber configured to house an active anode (e.g., a metallic tin anode), an anolyte, an...
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JP6793063B2 |
To provide a partial plating method and device capable of inexpensively and efficiently performing partial plating by sufficiently stirring a plating solution and by securing a stable amount thereof, in performing electroplating partiall...
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JP6793991B2 |
A surface treatment device 10 is provided with: a surface treatment tank 200 which contains a treatment liquid Q, and has an upper opening 200A; a transport jig 30 which includes a workpiece holding part 340 which holds a workpiece 20 in...
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JP2020534430A |
Various embodiments herein relate to methods and devices for electroplating a material onto a semiconductor substrate. The device includes an ion-resistant element that separates the plating chamber into a orthogonal flow manifold (above...
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JP6789321B2 |
An electrolytic treatment apparatus 1 (1A) configured to perform an electrolytic treatment on a target substrate includes a substrate holder 10 and an electrolytic processor 20. The substrate holder 10 includes an insulating holding body...
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JP6790016B2 |
The purpose of the present invention is to provide a surface treatment device and a paddle (50) with improved strength and uniform plating thickness by uniformly stirring surface treatment solution near an object to be plated. Also, the ...
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JP6790502B2 |
To provide liquid cutting devices, even if the material to be treated is subjected to wet type surface treatment, hardly causing unevenness on the surface thereof.Provided is a continuous electroplating apparatus 10 containing liquid cut...
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JP2020186962A |
To analyze the concentration of nano diamond particles in a composite plating solution quickly and accurately in a simple manner and control the composite plating solution appropriately.A method of analyzing the concentration of nano dia...
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JP6783317B2 |
An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and...
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JP6781922B2 |
To provide a method for regenerating and restoring a copper-made continuous casting mold made to be a waste due to slight thickness reduction by regeneration by thickly plating the surface of such a mold with a plating film comprising co...
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JP6782116B2 |
To provide a silver coated material with a surface having a small coefficient of dynamic friction.The silver coated material comprises a metallic substrate 1 and a silver coating film 2 composed of silver or silver alloy and coating a su...
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JP2020180357A |
To provide an anode holder that can operate a valve without using any linkage mechanism.An anode holder comprises: an internal space formed in the inside of the anode holder for housing an anode; a diaphragm configured so as to cover a f...
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JP2020180369A |
To provide an apparatus and a method that avoid leakage in a processing chamber having a movable part.An apparatus 200 for electrochemically processing a semiconductor substrate 208 comprises: a processing chamber 202 of a kind capable o...
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JP6779728B2 |
The invention relates to a method for grafting an organic film onto an electically conductive or semiconductive surface by electro-reduction of a solution, wherein the solution comprises one diazonium salt and one monomer bearing at leas...
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JP6779545B2 |
A surface treatment device 10 is provided with: a surface treatment tank 200 which contains a treatment liquid Q, and has an upper opening 200A; a transport jig 30 which includes a workpiece holding part 340 which holds a workpiece 20 in...
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JP6781658B2 |
There is provided a method of supplying an indium ion to a plating solution for electrolytic plating using an insoluble anode. The method includes a step of preparing an acidic plating solution and a step of immersing indium metal in the...
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JP2020176311A |
To improve a cleaning apparatus.A cleaning apparatus for cleaning a substrate holder includes a tank for housing the substrate holder, a cleaning solution supply unit for supplying a cleaning solution into the tank, and a flat suction pl...
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JP2020176303A |
To improve a position adjustment apparatus used in a plating tank.A position adjustment apparatus for adjusting positions of a plurality of members disposed in a plating tank includes a first jig that is provided at a position where a ba...
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JP6777503B2 |
To specify concentrations of multiple kinds of contained substances in a short period of time.A storage unit 34 stores: data D2 in which analytical parameters based on results of measurement processing performed at a plurality of reducti...
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JP2020172682A |
To provide a technique for stably obtaining a proper shape of an opening of a shielding plate.A shape setting method for setting an opening shape of a shielding plate in a plating device comprises: a generation step of generating a devic...
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JP6773241B2 |
The present invention provides a high-concentration tin sulfonate aqueous solution, in which a divalent tin ion (Sn2+) concentration is 360 g/L to 420 g/L, a tetravalent tin ion (Sn4+) concentration is 10 g/L or less, a free methanesulfo...
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JP2020169393A |
To provide a surface treatment apparatus in which electrical contact between a jig and a cathode rail can be more surely secured.A surface treatment apparatus (1) includes: a treatment tank (3) for storing a treatment liquid; at least on...
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JP6767243B2 |
An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is conne...
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JP6768495B2 |
To suppress an influence of plating solution pressure in a substrate holder.A substrate holder including first and second holding members to hold a substrate comprises: an arm unit for installing the substrate holder in a plating tank, h...
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JP6768953B2 |
Disclosed in the present invention is an electroplating device for a small component. The electroplating device for a small component comprises one or more electroplating units (102). Each electroplating unit (102) is provided with an el...
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JP6761763B2 |
A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. Each agitation rod includes: a planar portion perpendic...
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JP2020152927A |
To provide a method of evaluating a plating solution and a mechanism of evaluating a plating solution having a simple structure, capable of estimating the state of a plating solution and a plating film, while concurrently applying a plat...
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JP2020147831A |
To provide an electroplating apparatus and an electroplating method that can suppress a current convergence to a width-direction end part of a to-be-plated material, make a plating solution flow sufficiently on a surface of the to-be-pla...
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JP6757073B2 |
A plating device comprising: a water tank into which a plating solution is poured; a tubular nozzle being disposed in the water tank and serving as an anode; a to-be-plated object being disposed in the water tank so as to be opposed to t...
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JP6756540B2 |
A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to th...
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JP6749056B2 |
To provide an electrolytic plating apparatus that can provide a plated high-quality object, wherein a current collector can steadily take out electric current necessary for electrolytic plating from a power supplying electrode.Plating ap...
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JP2020132983A |
To provide electroplating equipment in which film thickness distribution of plating can be measured.The electroplating equipment according to the present invention comprises: a plating bath 1 that stores a plating solution 9 for electrop...
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JP6748332B2 |
Provided is a current collecting member for a cylinder body plating apparatus, which is used at the base end of the spindle of a chuck cone, thereby making it possible to plate a sliding surface without oiling and to prevent efficiently ...
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JP6745603B2 |
There is disclosed an apparatus for use in an electroetching or electrodeposition process in which material is etched from or deposited onto the surface of an electrically conductive component. The apparatus comprises a support for suppo...
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JP6745310B2 |
The embodiments disclosed herein relate to methods and apparatus for promoting bubble-free circulation of processing fluids in a recirculation system. Certain disclosed techniques involve passive, mechanical valve designs that promote va...
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JP6740951B2 |
To provide a film deposition apparatus of a metallic film that can prevent a solid electrolyte membrane from getting caught by a chamber and can avoid a metallic solution in the chamber from spilling out of the chamber.A solid electrolyt...
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JP6744646B2 |
A surface treatment device (1) having: a treatment tank (3–1) housing treatment fluid; at least one positive electrode (20) arranged inside the treatment tank; an N number (N being an integer of at least 2) of negative electrode rails ...
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JP6741621B2 |
To provide a plating system and a plating method in which a circuit board can be plated while keeping metal ions in a plating solution into a desired concentration without metal powder being dispersed in a clean room.A plating system com...
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JP6737527B2 |
A surface treatment device (1) comprising: a treatment tank (3-1) accommodating a treatment fluid; at least one positive electrode (20) disposed inside the treatment tank; at least one negative electrode rail (40–1); intermittent conve...
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JP6739307B2 |
To suppress upsizing of a substrate and/or upsizing of a substrate holder due to an increase in supply current.A substrate holder comprises a first and a second holding members for sandwiching a substrate. The first holding member compri...
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JP6737867B2 |
The invention relates to a metal sheet which has a plurality of parts to be plated, a frame part and connector parts connecting the parts to be plated and the frame part and in which the plurality of the parts to be plated, the frame par...
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JP6735014B2 |
A plating processing apparatus in which a plating object is immersed in a plating solution to form a plating layer on a surface of the plating object, the plating processing apparatus including a plating tank containing the plating solut...
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JP6734850B2 |
To improve uniformity in the precipitating of a metal on substrate surfaces and in holes a method for electroplating a metal onto a substrate P is provided. Said method comprises the following method steps: (a) providing the substrate P ...
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