| Document |
Document Title |
|
JPWO2018008261A1 |
To prevent foreign matter derived from a plating solution, a metal derived from a plated steel sheet, and an oxide of the metal from adhering to the surface of a conductor roll. This is a surface treatment method for surface-treating the...
|
|
JP6501700B2 |
An electrolytic treatment apparatus of the present disclosure includes a common electrode and a counter electrode that are disposed such that the treatment liquid is interposed therebetween. A first wiring and a second wiring are connect...
|
|
JP2019056174A |
To provide an improved distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid.A distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid in...
|
|
JP6497982B2 |
A plating apparatus is disclosed. According to one aspect of the present invention, the plating apparatus comprises: a positive electrode unit providing a current for plating an object to be plated inside a plating solution; a mixing uni...
|
|
JP6493520B2 |
Provided is a steel sheet for cans that has an excellent surface appearance. Also provided is a production method for the steel sheet for cans. The steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a c...
|
|
JP6494910B2 |
The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited....
|
|
JP6493519B2 |
Provided is steel sheet for cans that has excellent weldability and an excellent surface appearance. Also provided is a production method for the steel sheet for cans. The steel sheet for cans has, on the surface thereof, in order from t...
|
|
JP6491700B2 |
Provided herein are methods and apparatus for determining leveler concentration in an electroplating solution. The approach allows the concentration of leveler to be detected and measured, even at very low leveler concentrations. Accordi...
|
|
JP2019044233A |
To provide a plate processing device capable of obtaining a plating layer with a necessary thickness and suppressing a minute recess from being formed on an external surface of the playing layer.A plate processing device comprises a cond...
|
|
JP6485029B2 |
|
|
JP6488041B2 |
In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holde...
|
|
JP6485273B2 |
|
|
JP2019038136A |
To provide a double side metal laminate in which deviation of a wiring pattern hardly occurs in patterning processing.There is provided a double side metal laminate 10 comprising: a plastic film 11; metal seed layers 12A, 12B each of whi...
|
|
JP6464913B2 |
|
|
JP6459597B2 |
|
|
JP2019011500A |
To provide a technology in which a partial plating of a filamentous member can be simply performed.A filamentous member 9 that is a to-be-treated material is accommodated in a state of standing position in a cylindrical vessel 1 includin...
|
|
JP6455778B2 |
|
|
JP6457568B2 |
A float (10) floating in a liquid has a spherical body (12) having a spherical shape from which parts are cut off so as to form a regular hexagonal shape when viewed from one direction. In addition, the float (10) is shaped so as to form...
|
|
JP6455454B2 |
|
|
JP2019007029A |
To provide the maintenance jig for removing metallic impurity which has a lower ionization tendency than hydrogen and dissolved in the process liquid from the process liquid used for alumite treatment.The maintenance jig comprises a sacr...
|
|
JP2019007074A |
To provide an electrodeposition coating apparatus that can reduce a production cost.An electrodeposition coating apparatus comprises: an electrodeposition tank 4 in which an electrodeposition coating solution 3 is accommodated; an electr...
|
|
JP2019002065A |
To improve a method for confirming a position of a member in a plating bath.A plating apparatus for subjecting a substrate to a plating treatment comprises: a plating bath; a first member disposed in the plating bath; a second member dis...
|
|
JP6447575B2 |
In a film forming method, in a state where a metal solution (L) is sealed in a first accommodation chamber (21) of a housing (20) with a solid electrolyte membrane (13) and a fluid (45) is sealed in a second accommodation chamber (41) of...
|
|
JP6447487B2 |
|
|
JP6450838B2 |
According to the method for producing chromium plated parts, a plurality of workpieces are immersed in a chromium plating bath, a plating treatment is performed by using a pulse current, and chromium plating layers that have compressive ...
|
|
JP2018205148A |
To enable the state of an electrolytic plating solution to be analyzed with high accuracy.Na kinds of measurement result data D1 from a "first measurement result" with regard to a measurement process executed in a state where a contact a...
|
|
JP6438627B2 |
An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3...
|
|
JP2018197374A |
To provide a simulation method for plating that can precisely estimate an amount of metal precipitation.A simulation method for plating includes: acquiring velocity distribution of plating solution by performing a fluid analysis of the p...
|
|
JP2018197387A |
To provide a sliding member that has an excellent slidability and abrasion resistance.A sliding member 1 of the embodiment comprises: a sliding substrate 2; a pure copper plating layer 3 formed on the surface of the sliding substrate 2; ...
|
|
JP6435546B2 |
Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The pre...
|
|
JP6433414B2 |
|
|
JP2018188721A |
To provide a carbon nanotube deposition device which allows carbon nanotubes to deposition uniformly and continuously onto a metal surface.A cathode part 3 and an anode part 4 respectively having tabular metal plates 34 and 42 are dispos...
|
|
JP6431980B2 |
A method for electrochemically depositing metal on a sheet substrate, wherein an upper metal anode is disposed above an electrolyte solution on the upper surface of the sheet substrate waiting for an metal electrochemical deposition, or ...
|
|
JP6427316B2 |
A method of electroplating a metal on a cathodically biased wafer substrate employs an electroplating apparatus having a main anode, an auxiliary electrode and an ionic current collimator, where the ionic current collimator is configured...
|
|
JP2018176011A |
To provide a cleaning device, a cleaning method, and a manufacturing method of a member which can remove and recover a surface treatment chemical adhering to a surface of the member with a simple structure in cleaning the member to remov...
|
|
JP6423320B2 |
|
|
JP2018172729A |
To form a plating layer with a uniform film thickness on a to-be-plated material.A plating apparatus 1 comprises: a plating tank 2 with a pair of opposing sidewalls, in which plating solution is stored; an anode electrode 3 that is place...
|
|
JP3218713U |
To provide a conductive ring having excellent consistency of current density distribution. A conductive ring main body 3 having a divided type structure composed of a plurality of conductive steps is included, and adjacent conductive ste...
|
|
JP6416435B1 |
To provide a soluble copper oxide solid that can be supplied to a plating solution without scattering. A copper oxide solid material CS supplied to a plating solution for plating a substrate W contains a copper oxide powder and a liquid ...
|
|
JP6411928B2 |
|
|
JP6411741B2 |
An electrolytic treatment method in which a predetermined treatment is performed using treatment subject ions contained in a treatment liquid, the method including: an electrode positioning step for positioning a direct electrode and a c...
|
|
JP6411943B2 |
|
|
JP6408936B2 |
There is disclosed a plating apparatus which can dispose an anode, a substrate and a regulation plate parallel to each other in such a manner that the center of the anode, the center of the substrate and the center of an opening of the r...
|
|
JP6408309B2 |
|
|
JP6405393B2 |
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additi...
|
|
JP6407093B2 |
|
|
JP6403612B2 |
|
|
JP2018154924A |
A determination is made of a real-time azimuthal position of a notch alignment feature located on a support surface of a substrate holder relative to a fixed reference line extending perpendicularly away from a rotational axis of the sub...
|
|
JP6399973B2 |
There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle wi...
|
|
JP6400512B2 |
An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, includin...
|
