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JP3218165U |
To provide an electroplating apparatus which increases the contact frequency between an electroplating liquid and a wafer surface, improves the molding mass of a plating layer, and reduces the amount of the electroplating liquid used to ...
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JP2018528327A |
The present invention provides a chromium-finished lightness L that is electrolytically precipitated on a workpiece obtained by an electroplating bath containing at least chromium (III) ions and sulfur-containing organic compounds.*The p...
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JP6397620B2 |
The disclosed embodiments relate to methods and apparatus for immersing a substrate in electrolyte in an electroplating cell under sub-atmospheric conditions to reduce or eliminate the formation/trapping of bubbles as the substrate is im...
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JP6394515B2 |
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JP2018145524A |
To provide a lipseal allowing optimal electric connection while an electroplating device is operating.There is provided a lipseal 212 for an electroplating device wherein a clamshell engages and supplies electrical current to a semicondu...
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JP6392681B2 |
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JP6384369B2 |
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JP2018135544A |
To provide a method of producing a metal film capable of producing a metal film having a uniform thickness across the whole film, even if the area of a solid electrolyte membrane is large and the ratio of the area of a produced film rela...
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JP6381248B2 |
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JP6382096B2 |
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JP2018131679A |
To provide a workpiece washing system capable of achieving increased water conservation.A workpiece washing system 10 includes a plurality of water purifying apparatuses in a purification line 20 successively purifying the wash water use...
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JP6375385B2 |
The present invention relates to an aqueous coating composition (A) having a pH in a range from 4.0 to 6.5 and comprising at least one cathodically depositable binder (A1), a total amount of at least 130 ppm of Bi, based on the total wei...
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JP2018521224A |
The present invention can detect currents and optionally, for example, in electrowinning of metals, especially in electrolytic cells for electrodeposition of nonferrous metals for electrolytic production of copper and other nonferrous me...
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JP6367427B1 |
To easily position an object to be plated at the time of attachment to a jig for plating, to attach and detach the object to be plated to the jig for plating, to suspend and hold the object to be plated without shaking, and to be plated ...
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JP2018115367A |
To provide a surface treatment apparatus and a surface treatment method that can surely prevent the free end of a workpiece suspended in a surface treatment tank from moving during transportation without damaging the workpiece.A surface ...
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JP2018104747A |
To provide a plating apparatus and a plating method that can make metal ion concentration high and uniform in a plating solution that exists in the vicinity of a surface to be plated during a plating process.A plating apparatus 1 compris...
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JP6344269B2 |
A plating method has an electroless plating step for forming a conductive coating on a non-conductive substrate and an electrolytic plating step for forming a metallic coating on the conductive coating by using an auxiliary electrode. In...
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JP2018091660A |
To provide a method capable of promptly measuring a film thickness of a zinc nickel alloy plating layer formed on a base material via a nickel plating layer even in a manufacturing site.A method for measuring a film thickness of a zinc n...
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JP6342538B2 |
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JP6342543B2 |
The serial galvanizing system comprises: a galvanizing tank (10), which contains a galvanizing solution (11); galvanizing workpieces that are transferred serially, while they are held by a transfer support and are attached to a cathode; ...
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JP6337016B2 |
An electrolytic treatment device that performs a prescribed treatment using ions to be treated that are contained in a treatment liquid, and includes a direct electrode and a counter electrode which are arranged on either side of the tre...
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JP6329681B1 |
To reduce vibration of a paddle. A plating apparatus for plating a substrate is provided. This plating apparatus includes a plating tank configured to contain the plating solution and a paddle arranged in the plating tank and moved in a ...
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JP6328582B2 |
A plating apparatus that can obtain each one of electric resistances of plural inner contacts of a substrate holder is disclosed. The plating apparatus includes a resistance-measuring device configured to measure a combined resistance of...
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JP6319439B2 |
A basket-type anode stores plating pellets in a plating bath and is used for electrolytic plating of a steel strip. The basket-type anode comprises a reticulated member made of Ti to be placed facing the steel strip. The reticulated memb...
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JP6319297B2 |
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JP2018067694A |
To provide a printed wiring board array in which the characteristics of a plurality of functional parts are relatively constant irrespective of directions and a method of manufacturing the same.The printed wiring board array has a plural...
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JP6310642B2 |
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JP6297660B1 |
To stably convey an object to be processed while suppressing bending of a substrate (object to be processed). A processing device is provided. This processing device has at least one of polishing and cleaning for a transport portion that...
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JP2018040048A |
To provide a plating method, a plating device, and a method for producing a semiconductor device that achieve a simplified process and reduction of processing cost.The present invention provides an electric plating device, an electric pl...
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JP6281565B2 |
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JPWO2016174705A1 |
As a follow-up measure, instead of managing the number of defective products and the conventional management of copper sulfate plating solution, which has been renewing and purifying the plating solution based on empirical judgment, obje...
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JP2018026546A |
To provide a soft copper foil laminate film and manufacturing method therefor, capable of preventing circuit disconnection and/or short-circuit by guaranteeing uniform chemical polishing.A soft copper foil laminate film 100 includes a no...
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JP2018016852A |
To efficiently and continuously dissolve zine for a long time.Upon zinc dissolution, zinc hydroxide is deposited on the surface of the zinc, and the zinc is passivated. In the passivated zinc, the dissolution amount of the zinc is reduce...
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JP6266013B2 |
The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate, a container suitable for receiving such a device and a substrate holder, which is suitable for receiving a substrate ...
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JP6268271B2 |
A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surfa...
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JP6262140B2 |
There is provided a method of manufacturing a metal sheet having an alloy plated layer, the method including a step of passing a metal strip continuously through a plating bath to perform electroplating in the plating bath, the plating b...
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JP2018003092A |
To provide a method for manufacturing a plating coated roll that uses CFRP as a roll base material and can produce a high-quality plating surface by inhibiting the occurrence of plating failure.The method for manufacturing a plating coat...
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JP2018003052A |
To provide a filled plating method free from the generation of voids.Provided is a filled plating method where the first plating treatment is performed till the plating thickness from the inner wall face of a pore reaches 11 to 16% of th...
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JP6254307B2 |
To enable a serious trouble of sealability of a sealing member to be quickly and certainly detected, and to enable even an extremely small amount of leakage to be certainly detected before or after the fact.A leakage inspection method of...
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JP2017222907A |
To provide a plating device capable of film making a plating film with suppressed unevenness on appearance.There is provided a plating device for forming a plating film on a film substrate, having an electrolytic plating tank, an anode i...
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JP6250663B2 |
The present invention refers to an electrodeposition process of nickel-cobalt coatings (2), from aqueous solutions containing nickel and cobalt salts, by applying a pulsed waveform in the cathodic current range. It also refers to nickel-...
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JP2017218603A |
To provide a means capable of practically suppressing passivation of an anode and depositing a film at high speed in a film deposition method of a metal film.There is provided a film deposition method of a metal film including a process ...
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JP6242962B2 |
The invention provides a method of reducing the content of polluting positive ions in an electrolyte. Via a deioning circulating system, the method provides a proper reduction potential to reduce and solidify specific polluting positive ...
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JP2017210644A |
To provide a soluble copper anode, an electrolytic copper plating apparatus, an electrolytic copper plating method, and a storage method of an acidic electrolytic copper plating liquid, which can stably suppress production of an anode sl...
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JP6227803B2 |
Microelectronic substrates having copper alloy conductive routes to reduce warpage due to differing coefficient of thermal expansion of the components used to form the microelectronic substrates. In one embodiment, the conductive routes ...
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JP6226229B2 |
A plating apparatus (1) includes: a holding member (2) that holds a plated object (W); a spacer (4) that is stacked on the holding member (2) via a first seal member (3) in an annular shape surrounding the plated object (W), and has a th...
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JP6221817B2 |
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JP6222145B2 |
A film forming apparatus includes: an anode; a solid electrolyte membrane that is arranged between the anode and an substrate that serves as a cathode, and that contains metal ions; a power supply that applies a voltage between the anode...
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JP6223199B2 |
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JP6217511B2 |
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