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JP2017053033A |
To provide a vertical deposition device of electrolytic metal onto substrate improved in uniformity of plating and facilitating exchange of an anode, particularly, a device suitable for composing an advantageous composite unit with a con...
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JP6092156B2 |
A plating apparatus 10 includes a rectifier 18 configured to apply a DC current to a substrate, and a plating apparatus control unit 30 that instructs the rectifier 18 on a value of the DC current. The plating apparatus control unit 30 h...
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JP6093646B2 |
A method of manufacturing plating films on a first main surface and a second main surface which is opposite to the first main surface, of a workpiece (12), respectively, includes preparing a periodic reverse current power source and a di...
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JP6089164B2 |
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JPWO2014185159A1 |
Without providing a circulation pump outside the plating tank, the flow velocity of the plating solution can be increased and the flow velocity can be made the same from the bottom of the plating tank to the liquid level. As a result, th...
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JP6084112B2 |
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JP6079368B2 |
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JP6078186B2 |
To swiftly and securely find the heavy failure of the sealability in a seal member, and further, to securely find an extremely trace amount of a leak beforehand or after that.A first stage leak test where the inside of an internal space ...
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JP2017023961A |
To provide a liquid processing device and a nozzle, which are able to emit a sufficient quantity of liquid from an emission hole located in an upper part in a vertical direction and are able to emit a sufficient quantity of liquid to an ...
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JP2017028187A |
To manufacture a semiconductor device with high efficiency.A manufacturing apparatus 1 of a semiconductor device comprises: process liquid tanks 10-14 for storing a process liquid; piping 20 connected to the process liquid tanks 10-14 to...
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JP6067037B2 |
The problem addressed by the present invention is to provide a method for facilitating the regenerating a waste plating solution as a plating solution. This method for regenerating an acidic waste plating solution containing, as ions, Fe...
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JP6067793B2 |
A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surfa...
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JP2017014539A |
To provide an electroplating method capable of effectively suppressing hydrogen bubbles stuck onto the surface of the material to be plated compared with the conventional electroplating technique, and capable of suppressing the generatio...
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JPWO2014115203A1 |
The method for forming the chromium plating film is a method of forming a chromium plating film on the object to be plated (cathode) 1 by electroplating. The chrome plating bath 15 includes a trivalent chromium ion, an organic carboxylic...
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JP6062600B2 |
Provided are a cylinder plating apparatus and a cylinder plating method, in which the distance between an insoluble electrode and a cylinder to be processed can be kept constant regardless of the diameter of the cylinder to be processed,...
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JP2017008416A |
To provide a manufacturing method of a surface treated metallic material which can form flat electrolytic oxidation coating layer with high efficiency continually, a manufacturing installation of the surface treated metallic material for...
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JP6059383B1 |
[Subject] Provide a metal ion feed unit which an equipment configuration is not complicated, a fall of a rate of solution of a metal grain is controlled, and sludge does not produce easily. [Means for Solution] It is metal ion feed unit ...
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JP2017002342A |
To prevent a plating film on a seal ring from becoming thicker in a peripheral part than in a center part of a substrate.The multi-piece substrate 1 (referred to as the substrate 1 hereinafter) includes a substrate main body 2, a wiring ...
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JP2017002397A |
To provide a passive radiation cooling panel manufacturing method for anodizing an aluminum foil sheet to constitute a meta-material nano structure and for creating a plated metal thereon to manufacture a super-black emitter, and for man...
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JP6054030B2 |
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JP6050888B2 |
There is provided a method for forming an aluminide coating on a surface of a heat resistant superalloy substrate, comprising the steps of: exposing a base metal of the substrate in a selective area; forming a aluminum or an aluminum all...
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JP6045309B2 |
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JP6040092B2 |
A substrate plating apparatus is disclosed. The apparatus includes a substrate holder; a plating bath configured to plate a surface of the substrate in a plating solution; a cleaning bath configured to clean the substrate holder and the ...
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JP6038492B2 |
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JP6032603B2 |
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JP6033234B2 |
A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps...
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JP6034495B2 |
Provided is a method of manufacturing a superconducting wire. A superconducting tape having an outer surface is provided, a copper layer is formed on the outer surface of the superconducting tape, and first metal tape and second metal ta...
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JP6029537B2 |
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JP6031277B2 |
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JP2016194102A |
To provide a method for treating an electrolytic solution, from an electrolytic solution containing sulfuric acid and organic acid after being used for alumite treatment, capable of separating eluted aluminum ions at high efficiency.Ther...
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JP6026976B2 |
Disclosed herein is an electro-copper plating apparatus in which a cathode, an insoluble anode, a copper ball, and a plating solution are included in a single bath, wherein the plating solution includes manganese oxide; or an electro-cop...
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JP6027523B2 |
A substrate entire region treatment process of discharging a processing fluid of a temperature different from a surface temperature of a substrate 3 from a first nozzle 24 toward the substrate is performed while moving the first nozzle t...
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JP6022922B2 |
An Sn alloy plating apparatus includes: a plating bath having a cathode chamber for holding therein an Sn alloy plating solution in which the substrate is to be immersed and an anode chamber for holding therein an anolyte containing Sn i...
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JP6018961B2 |
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JP6016539B2 |
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JP6013774B2 |
A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be ...
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JP6011559B2 |
A method of forming a metal coating includes: disposing a solid electrolyte membrane (13) between an anode (11) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side port...
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JP6004461B2 |
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JP6001302B2 |
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JP6000123B2 |
Provided are a plating method and a plating apparatus for a cylinder, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder...
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JP6000473B2 |
The present invention is related to a device for vertical galvanic metal deposition on a substrate like a wafer, preferably copper, wherein the device comprises a first device element and a second device element, which are arranged in a ...
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JP2016526094A |
The present invention relates to, but is not limited to, electroplating metal articles in the field of plating, eg, metal discs that can be used as coins or converted into coins. Embodiments of the invention described herein include lumi...
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JP5981534B2 |
A plating jig and a plating device used for plating treatment of a substrate. The plating jig includes a mechanism rotatably driving a substrate holder, and detachably mounted on a plating bath integrally with a support portion. The plat...
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JP5980735B2 |
There is provided an electroplating method for a through-hole. The method includes: a first plating process, a second plating process, and a third plating process. The first plating process is a plating process of forming a metal film wi...
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JP5980983B2 |
A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-currentdensity conditions. The plating appar...
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JP5978793B2 |
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JP5974933B2 |
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JP2016150377A |
To provide a casting package soldering method with silver solder that enables heat radiation casting package of a fin tube and a precision machined component into a special steel.A casting package soldering method with plating silver sol...
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JP2016151034A |
To manufacture a product without inferiority on quality by a consecutive plating processing unit even when an emergency shutdown of the unit occurs.A consecutive plating processing unit conducting plating process while feeding between a ...
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JP5969498B2 |
A device for metalizing wafers, in particular microchip wafers, in an electrolyte, contains a plurality of holder arrangements. Each holder arrangement has a chamber for the electrolyte which is separate from the electrolyte-receiving ch...
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