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WO/2003/078698A1 |
The invention relates to an electrolytic copper plating method using a phosphorus−containing copper anode, characterized in that the phosphorus−containing copper anode used has a crystal grain size of 1,500 µm to 20,000 µm. A metho...
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WO/2003/078686A1 |
The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article is first immersed in an acqeous nickel p...
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WO/2003/076695A1 |
A gold plating solution, characterized in that it comprises an iodide ion, a gold iodide complex ion and a nonaqueous solvent. The gold plating solution exhibits performance capabilities comparable to a cyanide based gold plating solutio...
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WO/2003/071001A1 |
A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound havin...
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WO/2003/062501A1 |
A method for forming a Re alloy coating film having a high Re content such as a Re coating film having a Re content of 98 atomic % or more, an alloy coating film containing Re in a content of 65 % ≤ Re < 98 % and at least one of Ni, Fe...
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WO/2003/062502A1 |
A method for forming a Re−Cr alloy coating film through electroplating, wherein a Re−Cr alloy coating film containing Re in an amount of 60 to 90 atomic % and Cr and inevitable impurities in the balanced amount is formed by the use o...
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WO/2003/062500A1 |
A method for forming a Re coating film or a Re−Cr alloy coating film through electroplating, wherein a Re−Cr alloy coating film having an atomic composition of 0 % < Re < 98 % and the balanced amount of Cr and inevitable impurities, ...
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WO/2003/060959A2 |
The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the meta...
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WO/2003/060198A1 |
A tubular member (12) having an internal and/or external metal thread (18, 20) at one end thereof, at least part of the thread (18, 20) being coated with an alloy of copper and tin, said alloy containing 5 wt% to 95 wt% copper. The tubul...
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WO/2003/058655A1 |
Introduction of a liquefied gas solution for deposition of a material on a semiconductor substrate. The substrate can have a trench etched thereinto with the solution including ions of the material to be deposited in the trench. The subs...
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WO/2003/056966A1 |
A first decorative article having a white coating, characterized in that it comprises a substrate for a decorative article comprising a metal or the like, an undercoat layer, preferably free of nickel, formed on the surface of the substr...
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WO/2003/056062A2 |
The invention relates to a composition for treating metal surfaces and for separating metals or metal alloys from plastic surfaces, containing: a) at least one polymer as component A, made of a polymer containing amino groups (component ...
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WO/2003/056061A2 |
The invention relates to a composition for treating metal surfaces and for separating metals or metal alloys from plastic surfaces, containing a) at least one polymer as component A made of structural element (1) and at least three struc...
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WO/2003/048427A2 |
The invention relates to a method for applying electro-deposited metal coatings (3) upon aluminium or aluminium alloy components (1). According to said method, the surface (4) of the component is cleaned in an appropriate solution, in pa...
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WO/2003/048429A1 |
An copper electroplating method for performing copper electroplating by using an anode formed of pure copper in which the grain size of the pure copper anode is not greater than 10 µm, or not smaller than 60 µm, or pure copper non−re...
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WO/2003/045618A1 |
A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer comprising one or more metals from the group co...
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WO/2003/045619A1 |
A family of low temperature brazing alloys wherein the alloy is utilized in the form of a filler metal or shim and consists of electroplated nickel on zinc shimstock, wherein the zinc shimstock includes zinc, aluminum and silicon, with o...
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WO/2003/046260A2 |
The invention relates to an electrolysis bath for electrodepositing silver-tin alloys that, in addition to water serving as a solvent with a pH value of less than 1.5, contains a water-soluble silver compound, a water-soluble tin compoun...
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WO/2003/043777A1 |
A method of manufacturing an article of manufacture for use in a fluxless brazing process is disclosed. The method comprises the step of applying a braze-promoting layer including one or more metals selected from the group consisting of ...
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WO/2003/035941A2 |
Electrolytic solutions containing organic additive(s) selected from a described class of additives (e.g., 4,6-dihydroxypyrimidine) reduce overall applied electrical potential of electrolytic cells and/or reduce gas formation at the anode...
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WO/2003/033775A1 |
A method of copper−plating the interiors of small−diameter holes in a material to be plated having small holes by a PPR method using a copper sulphate plating solution containing copper sulphate, sulfuric acid, chlorine ions, a sulfu...
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WO2002103084A9 |
A palladium plating solution, characterized in that it comprises a soluble palladium salt in an amount of 0.1 to 40.0 g/liter in terms of palladium, 0.01 to 10 g/liter of a pyridine-carboxylic acid and/or at least one selected from among...
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WO/2003/029779A2 |
Acid copper electroplating baths used to form ultra-fine circuitry features on semiconductor chips contain suppressor, anti-suppressor and leveler additives that must be closely controlled in order to obtain acceptable copper deposits. C...
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WO/2003/029526A1 |
A composition and process for electroplating tin or tin alloys onto a substrate at relatively high current densities. The electrolyte comprises toluene sulfonic acid and a source of ammonium ions and/or magnesium ions. The process is par...
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WO/2003/028534A2 |
A novel visual field test utilizing oscillating visual stimuli is proposed, which may be used to diagnose for eye disorders, such as glaucoma or macular degeneration. Such visual stimuli oscillate in color, polarity, saturation, luminanc...
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WO/2003/028130A1 |
A battery, a battery electrode structure, and methods to make the same. The product and method comprise applying a layer of lead-tin containing alloy to substrates for anodes or cathodes for lead-acid batteries, in which the substrates a...
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WO/2003/025368A1 |
A ferrous cylinder liner (14) for use in diesel engines (10) having exhaust gas recirculation (EGR) is protected from corrosive attack from the EGR environment by first final machining the inner running surface of the liner (14) and ther...
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WO/2003/021008A1 |
A tin electroplating solution, characterized in that it has a pH of 1.5 to 6.0 and comprises the following components: (1) 5 to 60 g&sol L of a tin(II) ion, (2) a complexing agent, (3) a surfactant and (4) 0.01 to 0.5 g&sol L of a bismut...
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WO/2003/018880A1 |
The invention concerns an aqueous electrolytic solution for electrochemical deposition of gold or of its alloys comprising at least a soluble gold compound designed for electrolytic deposition and, optionally at least a secondary metal c...
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WO/2003/016595A1 |
A member having excellent antibacterial and&sol or antialgae effects which is coated with a surface−treatment film having at least a layer having an antibacterial and&sol or antialgae effects laminated between the outmoust surface func...
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WO/2003/015483A1 |
A copper foil excellent in selective (resistance circuit layer or copper layer) etching property required when producing a printed wiring board, and also excellent in UL heat resistance. A printed wiring board−use copper foil (1), whic...
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WO/2003/014425A1 |
A composite for use if forming a multi-layer printed circuit board, comprised of an INVAR sheet (12) having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper (72) on at least one side thereof. The copper ha...
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WO/2003/012174A1 |
An electrolytic process for depositing copper on a steel wire in which said wire travels through an acidic electrolytic bath of an aqueous solution of Cu?2+¿ ions in the form of a salt of an acid, a direct electric current passing throu...
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WO/2003/006360A2 |
An alkaline zinc-nickel electroplating bath comprises zinc ions, nickel ions, a primary brightener which is an N-methylpyridinium compound substituted at the 3-position of the pyridine ring with a carboxylate group or a group hydrolyzabl...
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WO/2003/007412A1 |
Modified ion-conducting membranes (10), and a method for making the same, which increases the membrane (10) surface area, and, optionally, incorporates mono- and multi-metal ion-containing catalysts for both fuel consumption catalysis in...
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WO/2003/004732A1 |
Textured surfaces comprised of peaks which have been electrochemically deposited on a substrate are prepared using a pulsed direct current process. Typical substrates are machine components such as a machine roll. Improved textured surfa...
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WO/2003/000937A2 |
The invention relates to a method for heat-treating a cold-rolled strip with an Ni and/or Co surface coating and incorporated non-metal elements C and/or S, and optionally adding Fe, In, Pd, Au and/or Bi, said cold-rolled strip having a ...
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WO/2002/103751A2 |
A copper electroplating bath and a method to plate substrates with the bath are provided. The bath and method are particularly effective to plate electronic components such as semiconductive wafer VLSI and ULSI interconnects with void-fr...
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WO/2002/101119A1 |
The invention concerns a mixture in solid form containing: dithiocarbamoyldithiocarbazate of formula (I): H¿2?N-(C=S)-NH-NH-(C=S)-S?-¿M?+¿, wherein: M?+¿ represents an alkaline cation or an ammonium and a xanthate of formula (II): R-...
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WO/2002/097165A2 |
An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel (204). The reaction vessel includes: an outer container (220) having an outer wall (222); a fist outlet configured to introduce a p...
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WO/2002/092211A2 |
The present invention provides for the use of bis(perfluoroalkanesulfonyl)imide and its salts as surfactants or additives applications having an extreme environment.
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WO/2002/090623A1 |
A copper plating bath characterized by containing a reaction condensation product of a compound of amine and a glycidyl ether and/or a quaternary ammonium derivative of the product and a method for plating a substrate using the plating b...
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WO/2002/088434A1 |
Electroplating electrolyte compositions including CA•(nA1(C¿3?H¿7?)¿3?(2-n)A1R¿3?) where n is 0 and less than or equal to 2; C is Li, Na, K, Rb, Cs, NR'¿4?, or mixtures thereof wherein R' is H, CH¿3?, C¿2?H¿5?, C¿3?H¿7?, C¿4...
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WO/2002/088423A1 |
A copper plating solution which comprises 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenetetraacetic acid and 0.02 mol/L to 0.3 mol/L of a sulfite salt, and has a pH adjusted to 5.0 to 8.5; and a method for...
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WO/2002/086196A1 |
Electroplating baths, system and method for electroplating copper on a substrate (240) having high aspect ratio confirmations thereon and a photoresist deposited on portions of the substrate are disclosed. The substrate (240) is immersed...
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WO/2002/081782A1 |
The invention provides for a back-end metallisation process in which a recess is filled with copper and which includes the step of forming a plating base on the surfaces of the recess for the subsequent galvanic deposition of the said co...
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WO/2002/075797A2 |
A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating.
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WO/2002/072923A2 |
An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comp...
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WO/2002/068727A2 |
There is provided a copper-plating solution which, when used in plating of a substrate having an seed layer and fine recesses of a high aspect ratio, can reinforce the thin portion of the seed layer and ensures complete filling with copp...
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WO/2002/068007A1 |
An implant and a process of modifying an implant surface, which implant is in particular a hip implant, a tooth implant, a bone screw, fixation pin or a fixation nail (pin-fixation), comprising a metallic base body (1), which implant has...
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