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WO/2007/109784A2 |
A method for treating a substrate (such as the gears of a gear set) to provide the substrate with both wear protection and corrosion resistance is disclosed. The method comprises providing the substrate with a wear protection layer and p...
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WO/2007/096390A1 |
The object of the present invention is a method and compositions for direct copper plating and filling to form interconnects in the fabrication of semiconductor devices. According to the invention, this method comprises : providing an el...
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WO/2007/093574A2 |
The present invention relates to a method to electroplate or electropolish a metal on a substrate wherein an ionic liquid selected from the group of N+R1R2R3R4 X- or N+R5R6R7R8 Y- is employed as electrolyte, and a metal salt added to the...
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WO/2007/091732A2 |
A corrosion resistant surface-treated steel sheet suitable for an uncoated can accommodating an acidic food or beverage. The surface-treated steel sheet comprises: an alloy layer (1) on a surface of steel sheet (4) to be an inner wall of...
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WO/2007/091602A1 |
A process for the production of rare earth permanent magnets having copper plating films on the surfaces by using a novel copper electroplating solution which can form copper plating films on the surfaces of rare earth permanent magnets ...
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WO/2007/092172A2 |
A chlorine generator includes a main water channel for connecting to a pool and a subsidiary water channel connected between two points on the main water channel. A feed valve, a brine tank, a pump and an electrolytic tank are located on...
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WO/2007/088600A1 |
A process for producing a ceramic electronic part, in which in the formation of Sn plating layer, leaching of Ba from electronic part body is suppressed and in which not only is any cohesion between electronic part bodies by the Sn plati...
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WO/2007/086454A1 |
An additive added to a solution for electrolytic copper plating using an anode of phosphorated copper, comprising at least one component selected from the group consisting of alkenes and alkynes. Further, there is provided a solution for...
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WO/2007/087050A2 |
The invention provides a method and system for electrolytically coating an article. The method includes providing an article to be coated and disposing the article in an electrolytic cell. The cell includes an anode, a cathode in operabl...
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WO/2007/082528A1 |
The invention relates to a method for producing an alloy having a predetermined composition, said alloy having three or more components. The method according to the invention comprises the following steps: (a) determining the selectivity...
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WO/2007/082786A1 |
A flat product according to the invention which has been produced from a low-alloy steel containing iron and unavoidable impurities together with (in % by weight) up to 0.45% of C, up to 2.20% of Si, up to 2.50% of Mn, up to 0.12% of P, ...
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WO/2007/082112A2 |
A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress diff...
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WO/2007/077775A1 |
Disclosed is a gold plating film having excellent hardness and electrical conductivity. Specifically disclosed is a gold plating film which is composed of a single metal element. This gold plating film is composed of crystallites having ...
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WO/2007/076898A1 |
The present invention relates to an electrolyte and a process for depositing a matt metal layer on a substrate from an electrolyte comprising an emulsion and/or dispersion former or a wetting agent. According to the invention, many metal...
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WO/2007/073890A1 |
The invention relates to polymers which consist of at least partly crosslinked main chains formed from repeat units of the general formula (I), and optionally repeat units formed from five- or six-membered azaaromatics or nitrogen-contai...
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WO/2007/071542A1 |
According to the invention, the endurance and serviceable life of a highly-stressed component (6, 8, 12, 14, 24, 26, 34) of a steel foundry may be increased by means of electrolytic application of a coating (38) made from a ductile metal...
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WO/2007/066751A1 |
Disclosed is a method for producing a metal thin body by electroplating, which method enables to increase the relative integral intensity of a (111) surface of the metal thin body to 65% or more. By performing electroplating using an ele...
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WO/2007/059545A1 |
The invention relates to a tool with at least one convexly or pointedly formed region and at least one concavely or flatly formed region, which comprises a substrate and a boride layer electrochemically deposited on it, at least in parti...
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WO/2007/060078A1 |
The invention relates to a method for producing a layer on a metal element, which layer is capable of contact, by electroplating, at least one area of the metal element being provided with a tin/silver layer in a plating process by means...
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WO/2007/055764A2 |
A method for making a metal laminate comprising at least one plating step and at least one cold roll bonding step. A metal laminate comprising a plurality of alternating structural layers and non-structural layers, where the structural l...
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WO/2007/055172A1 |
Disclosed is an aluminum secondary battery exhibiting good characteristics. Specifically disclosed is a nonaqueous electrolyte solution containing an electrolyte containing Al(CF3SO3)3 and a room temperature molten salt of a quaternary a...
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WO/2007/050210A1 |
An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthe...
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WO/2007/050212A2 |
An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; a surface coating of platinum having a rough configuration and an increase in the surface area of 5 times to 500 t...
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WO/2007/050280A2 |
An improved platinum and method for manufacturing the improved platinum wherein the platinum having a fractal surface coating of platinum, platinum gray, with a increase in surface area of at least 5 times when compared to shiny platinum...
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WO/2007/046870A2 |
Bipolar (pulse reversal) current, with both positive and negative current portions, is used to electrodeposit a nanocrystalline grain size deposit. Polarity Ratio is the ratio of the absolute value of the time integrated amplitude of neg...
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WO/2007/045650A2 |
The invention relates to aqueous, alkali, cyanide-free baths containing: I) a zinc ion source and, optionally, a source for additional metal ions; II) at least one cationic polycondensation product that can be obtained by the condensatio...
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WO/2007/039035A1 |
The invention relates to a method for electrochemically depositing grey selenium onto a substrate in an ionic liquid, wherein the electrochemical deposition can be carried out at temperatures greater than 100ºC.
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WO/2007/041650A1 |
Single bath electrodeposition of polycrystalline Cu(In1Ga)Se2 thin films for photovoltaic applications is disclosed. Specifically, Cu(In1Ga)Se2 was deposited onto Mo electrodes from low concentration buffered (pH 2.5) aqueous baths conta...
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WO/2007/037144A1 |
A process for producing a composite-plated material which comprises using a composite plating liquid obtained by adding oxidized carbon particles and a silver-matrix orientation regulator to a silver plating solution to form on a materia...
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WO/2007/031712A2 |
A patterned electrical conductor having improved resolution and conductivity is obtained by forming a latent image by exposing, to pressure or sensitising radiation according to a desired conductive track pattern, a pressure-sensitive or...
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WO/2007/029395A1 |
[PROBLEMS] To provide a nanocarbon/aluminum composite material having both high strength and electrical conductivity, which is suitable for use in lead wires, heat exchangers, and automobile components, and a process for producing the sa...
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WO/2007/029663A1 |
Disclosed is a method for electrodepositing a metal wherein a molten salt is used. This method enables to easily electrodeposit various metals including high melting point metals and rare earth metals. Specifically disclosed is a method ...
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WO/2007/030010A1 |
Corrosion protection of steel by using Zn-Co-Fe alloy coatings. It is proposed to use a Zn-Co-Fe coating having a relatively high Co content. According to the invention at least 10 and more particular 10-40 % by wt. Co is used in the Zn-...
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WO/2007/025606A1 |
The invention concerns a nitrogen polymer additive for electrolytic deposition of zinc and zinc alloys as a reaction product of two amino derivatives with epichlorohydrin, dihalogenalkane or dihalogenelkylether. The invention describes a...
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WO/2007/026562A2 |
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WO/2007/019235A2 |
This invention discloses a metal product that is suitable for a forming process. By anodizing an oxide layer onto at least one surface of the metal product, the total amount of lubricant that is applied onto the metal product prior to be...
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WO/2007/008369A1 |
A tin deposit which is inherently less prone to tin whisker formation or growth is obtained by one or more of: (i) the deposition of a fine-grained tin deposit having an average grain diameter in the range of 0.05 to 5 microns; (ii) a ph...
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WO/2007/007617A1 |
In an electrochemical surface treatment, reduction of a metal waste liquid and formation of a high-quality metal film, which exhibits good adhesion and has no pinhole, are easily realized. Specifically disclosed is a surface treatment me...
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WO/2007/004581A1 |
Disclosed is an Sn-plated copper alloy bar having good fatigue characteristics wherein deterioration of fatigue characteristics due to Sn plating is prevented. In a copper alloy bar which is provided with an Sn or Sn alloy plating film b...
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WO/2007/003956A2 |
There is provided a mixture having a freezing point of up to 50°C, formed by reaction between: (A) one molar equivalent of a salt of formula I (Mn+)(X-)n I or a hydrate thereof; and (B) from one to eight molar equivalents of a complexin...
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WO/2007/000109A1 |
Soft blackplates for tinning comprise (wt.%) up to 0.006 C, 0.10-0.20 Mn, 0.025-0.075 Al, up to 0.03 Si, 0.03-0.08 Ti, up to 0.015 P, up to 0.015 S, up to 0.003 N, up to 0.004 O, and the balance Fe and other inevitable impurities. The me...
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WO/2007/002070A2 |
The invention provides an aqueous zinc-nickel alloy electroplating composition particularly useful in an electroplating method for depositing a zinc- nickel alloy layer on a substrate, wherein the deposited layer exhibits uniform nickel ...
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WO/2007/000108A1 |
Soft blackplates with hardness HR30T of 51±3 for tinning comprise (wt.%) up to 0.005 C, 0.20-0.30 Mn, 0.03-0.06 Al, up to 0.03 Si, 0.03-0.06 Ti, up to 0.012 P, up to 0.015 S, up to 0.003 N, up to 0.004 O, and the balance Fe and other in...
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WO/2007/002424A1 |
The invention relates to a method of reducing tin whisker formation in a plated substrate that includes a surface layer comprising tin. The method includes providing on electroplatable portions of the substrate (a) an underlayer comprisi...
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WO/2006/135735A2 |
Transparent conductive coated devices (films, three dimensional objects and others) produced through coating with a nano metal containing emulsion which forms a conductive pattern with enhanced electrical, optical and other properties.
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WO/2006/129886A1 |
A plating method comprising: continuously electroplating a film having a surface resistance of 1 to 1,000 ohms per square, wherein a plating solution has a copper content of 150 to 300 g/l as expressed by weight of copper sulfate pentahy...
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WO/2006/129540A1 |
An Nb-Al type superconducting wire which is in a state before transformation to an Nb3Al compound. It comprises an Nb-Al type wire in the state of a supersaturated solid solution, a nickel coating film as an interlayer, and a copper coat...
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WO/2006/129806A1 |
At first step S1, a passivation film (48) is removed by performing pickling on a separator (40) for fuel cell and then a new passivation film (42) is formed by performing heating at 200-280°C preferably. At second step S2, mechanical po...
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WO/2006/127320A2 |
Apparatus and methods for plating conductive materials on a substrate are disclosed. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate ...
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WO/2006/117920A1 |
Provided is a tin plating solution which is less susceptible to forming a sludge even after the storage for a long time and has a markedly long life as a plating solution. A tin plating solution for carrying out an electrolytic tin plati...
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