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WO/2006/028482A1 |
Platinum containing coatings for corrosion and oxidation protection of a substrate, and platinum electrodeposition methods for coating a substrate. The coating comprises platinum and at least one supplementary constituent, and the method...
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WO/2006/021031A1 |
A method of electrowinning or electrorefining copper from a copper electrolyte solution which contains chloride ions, the method comprising the steps of: (a) forming a polyacrylamide solution by dissolving polyacrylamide, having a molecu...
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WO/2006/022835A1 |
Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
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WO/2006/018872A1 |
An additive for copper plating, comprising a specified nitrided biphenyl derivative as an active ingredient; a copper plating solution containing a copper ion component and an anion component, obtained by addition of this additive for co...
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WO/2006/016570A1 |
[PROBLEM] To provide a method for producing a rare earth element based permanent magnet having a copper plating film on the surface thereof, which uses a novel plating solution for the electrolytic copper plating treatment and allows the...
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WO/2006/017327A2 |
A method of electrocodeposition of lead free tin alloys is disclosed. The method includes the following steps: electrocodepositing tin metal (10) and particles of a noble metal (12) to form a composite (FIG. 1A); and converting the compo...
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WO/2006/016603A1 |
Disclosed is an electroplating method realizing short-time processing which has been difficult for conventional tin-zinc alloy electroplating methods. Specifically disclosed is a method for performing tin-zinc alloy electroplating under ...
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WO/2006/011922A2 |
Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyal...
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WO/2006/006114A1 |
The invention relates to an electronic component with Sn rich deposit layer on the part for electric connection, wherein the Sn rich deposit layer is a fine grained Sn rich deposit layer composed of grains with smaller size in the direct...
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WO/2006/006992A1 |
An electrolyte bath (10) and method of electrolytically plating a layer of metallic chromium on a substrate comprises providing an electrolyte bath (10) of a trivalent chromium, passing a current through the bath from an anode to a catho...
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WO/2006/004299A1 |
The present invention relates to a method for producing a surface-blackened copper foil for electromagnetic radiation shielding and a copper foil produced by the method, which has low light reflectance and no stain on the surface and har...
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WO/2006/004298A1 |
Disclosed is a method for preparing a surface-blackened copper foil for electromagnetic radiation shielding and a copper foil produced by the method, which has low light reflectance and no stain and hardly has residues, thereby having a ...
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WO/2006/001594A1 |
The present invention relates to a method for producing a surface-blackened copper foil for electromagnetic radiation shielding, specifically relates to a method for producing a surface- treated copper foil for electromagnetic radiation ...
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WO/2005/124905A1 |
The invention is relative to gas diffusion electrodes, for use in fuel cells and other electrochemical applications, obtained by direct metallisation of a gas diffusion medium with low platinum loading, and to a membrane-electrode assemb...
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WO/2005/118918A2 |
Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two analyses. The suppressor analysis is perf...
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WO/2005/118917A1 |
The invention relates to an electroplating solution for providing a deposit of an alloy of gold and tin. This solution includes an aqueous solvent in which gold is present in the form of a solution soluble cyanide complex and tin is pres...
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WO2005093133B1 |
An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te<+4>, Bi<+3> and Sb<...
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WO/2005/110287A2 |
The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render th...
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WO/2005/111275A2 |
The present invention relates in general to real-time analysis of electrochemical deposition (ECD) metal plating solutions, for the purpose of reducing plating defects and achieving high quality metal deposition. The present invention pr...
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WO/2005/108651A2 |
The invention relates to a method for production of a corrosion-resistant and/or oxidation-resistant coating, whereby at least one metal of the platinum group, in particular, platinum and/or palladium, or an alloy made from at least one ...
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WO/2005/108648A2 |
The invention relates to a method for producing a structured hard chromium layer, during which chromium from an electrolyte is deposited onto a workpiece, which contains: a) a Cr(VI) compound in a quantity corresponding to between 50 and...
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WO/2005/108650A1 |
The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measur...
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WO/2005/103340A1 |
Disclosed is a composite foil which exhibits high tensile strength even after a high-temperature heat treatment and is suitably used as a current collector for nonaqueous electrolyte secondary batteries. Specifically disclosed are compos...
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WO/2005/100641A1 |
[PROBLEMS] To provide a method for imparting excellent resistance to hydrogen to various articles including a rare earth element based permanent magnet, with simplicity and ease, at a low cost. [MEANS FOR SOLVING PROBLEMS] A method for i...
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WO/2005/098095A1 |
A method which comprises a step of carrying out a molten salt electrolysis in an electrolytic bath, wherein at least one metal compound selected from the group consisting of actinoid compounds and rare earth compounds is molten, by the u...
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WO/2005/095667A1 |
A method of chromium coating a substrate is described, which method comprises: a) depositing, preferably electrodepositing, a metallic layer onto the substrate comprising chromium from a plating bath that includes trivalent chromium and ...
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WO/2005/093132A1 |
A zink electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.
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WO/2005/093134A2 |
In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) a sulfur-containing compound se...
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WO/2005/090646A1 |
The invention refers to a composition and method of electrolytic tinning in continuous a steel strip or plate with an electrolyte composition comprising the following components (g/l): Tin (in a form of tin sulfamate) 50-90, Sulfamic aci...
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WO/2005/081657A2 |
A copper foil (96) for lamination to a dielectric substrate (92) is coated with a laser ablation inhibiting layer (100) having an average surface roughness (RZ) of less than 1.0 micron and an average nodule height of less than 1.2 micron...
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WO/2005/083156A1 |
Disclosed is an electroplating solution for the deposition of silver; said solution containing silver in the form of a complex of silver with hydantoin or a substituted hydantoin compound; said solution also containing an excess of the h...
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WO2005017971A9 |
A nanomachined and micromachined electrode (10) is disclosed that is produced by providing a layer of aluminum (11) positioned upon a conductive substrate (12), anodizing the layer of aluminum to produce a layer of aluminum oxide (13) ha...
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WO/2005/078161A1 |
A method for performing electroplating in the co-presence of CO2 and an aqueous solution containing a metal salt is characterized in that CO2 is in a liquid, subcritical or supercritical state and a nonionic compound having a CO2 affinit...
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WO/2005/078162A1 |
The present invention relates to a diamond tool. An object of the present invention is to provide a diamond tool for a CMP pad, which has a superior corrosion resistance in slurry environment for CMP process. The diamond tool of the pres...
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WO/2005/078163A1 |
Disclosed are methods of electroplating a nickel cobalt ternary and quaternary alloys involving providing an electroplating bath comprising ionic nickel, ionic cobalt, ionic alloy metal(s), and at least one brightener; and applying a cur...
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WO/2005/075696A2 |
A wire (10) has a steel core (12), a nickel sub coating (14) and a zinc or zinc alloy top coating (16). The steel core (12) has a carbon content ranging from 0.15 per cent to 0.35 per cent. The nickel sub coating (14) and the zinc or zin...
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WO/2005/075697A1 |
A wire (10) for external exposure, i.e. without chemical binding with a polymer or rubber matrix. The wire (10) has a steel core (12), a nickel sub-coating (14) and a zinc or zinc alloy top coating (16) above the nickel sub-coating. The ...
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WO/2005/073437A1 |
A composite chromium plating film containing hard particles in fine cracks in the form of a network formed on the film, wherein the above fine cracks account for 10 to 20 area % of the surface thereof, the above fine cracks distribute in...
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WO/2005/073438A1 |
The invention relates to a zinc or zinc alloy deposition installation comprising a tank (14) which is subdivided by a separator into a cathodic compartment and an anodic compartment, said separator being made from an open-pore material.
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WO/2005/068688A2 |
A stable FePt plating solution is provided. Further a process for electroplating is provided for producing an FePt magnetic material having especially strong coercive force and excellent properties by use of the plating solution. The pla...
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WO/2005/068685A1 |
Disclosed is an alloy coating for diffusion barrier which comprises a diffusion barrier layer having more excellent diffusion barrier characteristics than Re-Cr alloy coatings and durable for use at a higher temperature (specifically at ...
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WO/2005/066391A1 |
A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a substituted pyridyl polymer compound for leveling.
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WO/2005/065436A2 |
Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (98) (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance...
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WO/2005/065430A2 |
Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus ...
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WO/2005/060379A2 |
Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to co...
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WO/2005/059207A1 |
The invention relates to an electrolyte for the galvanic deposition of aluminium containing a mixture of at least two organo-aluminium complexes of formulae NaF 2 Al(R1)3 (I) and NaH 2 Al(R2)3 (II), in which R1 and R2 are identical or di...
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WO/2005/056883A1 |
Disclosed is an electroplated coating of a zinc alloy which contains no environmentally harmful chromium and still exhibits a high corrosion resistance equivalent to that of a Zn-Cr alloy plating. Also disclosed is a plated metal materia...
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WO/2005/056884A1 |
Disclosed is an electroplating solution composition which enables to obtain a plating with excellent corrosion resistance which exhibits excellent adhesion with a coating film without being subjected to a surface treatment. Such an elect...
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WO/2005/057693A1 |
[PROBLEMS] To obtain a collector having, despite being thin, a high tensile strength at low cost. [MEANS FOR SOLVING PROBLEMS] There is provided a negative electrode collector for nonaqueous electrolyte secondary battery characterized in...
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WO/2005/056885A1 |
A metal-plated steel sheet for a battery case wherein the surface to be used for the inner side of the case has a dispersion plating layer in which an extremely fine carbon black powder having a particle diameter of 10 to 200 nm is dispe...
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