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WO/2004/053202A1 |
A method of forming a copper interconnect, comprising forming an opening in a dielectric layer disposed on a substrate, forming a barrier layer over the opening, forming a seed layer over the metal layer, and forming a copper-noble metal...
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WO/2004/053203A2 |
The invention relates to a method for the electrolytic deposition of magnesium or magnesium-zinc on a substrate consisting of sheet metal (1) comprising a zinc or zinc alloy coating, especially a steel sheet. The electrolytic deposition ...
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WO/2004/053193A1 |
In one aspect, a copper foil (14, 60) for lamination to a dielectric substrate (62) includes a layer (64) deposited on a surface of the copper foil (14, 60). The layer (64) is formed from chromium and zinc ions or oxides and is treated w...
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WO/2004/054016A2 |
An electrochemical cell for a portable electronic device is provided, said cell having a positive electrode, a negative electrode and an electrolyte, characterised in that at least the positive electrode comprises a mesoporous structure ...
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WO/2004/053182A2 |
The invention is directed to a nodular nickel boron coating having lubricating properties. Nodular and columnar boron coatings made by the above methods disclosed in the above patents have a low coefficient of friction. The above process...
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WO/2004/050960A1 |
A method for the production of a structured hard chrome layer is disclosed, whereby chrome is deposited on a workpiece from an electrolyte comprising: (a) Cr(VI) compounds in an amount corresponding to 50 g/l to 600 g/l of chromic acid a...
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WO/2004/050959A2 |
Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coa...
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WO/2004/048646A1 |
An electrolytic silver plating solution using a cyanide as a silver source, characterized in that it contains a glossing agent comprising one or more of compounds of As, Tl, Se and Te and also a gloss adjusting agent having a benzothiazo...
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WO/2004/048645A1 |
The invention concerns a plain or zinc-plated steel plate, additionally coated on at least one of its surfaces with a single zinc or zinc alloy layer containing 0.15 to 1 wt. % of a polymer consisting of 6 to 150 identical or different u...
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WO/2004/044269A2 |
An aqueous alkaline non-cyanide zinc electroplating bath containing zinc ions for producing bright electrodeposits of zinc and a brightening agent comprising a polymeric quaternary amine, and a reducing sugar or a compound that forms a r...
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WO/2004/042344A2 |
The present invention relates to a method of manufacturing a detection device which involves providing a substrate having a layer of gold and a first layer of photosensitive material. Next, the substrate is subjected to a first level pho...
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WO/2004/040041A1 |
Although cobalt is used for a catalyst, a secondary-battery electrode material, a magnetic material or the like, almost no report is available on an efficient production method for a cobalt single-crystal whisker and nano-size metal coba...
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WO/2004/040044A1 |
A metal plating structure, characterized in that it comprises a metal plating film and, incorporated therein, a fine carbon fiber or a derivative thereof, wherein the fine carbon fiber represents a carbon fiber having a diameter of appro...
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WO/2004/039137A1 |
A plasma display panel-use copper foil excellent in shielding performance, characterized by being provided with a black nickel-plated layer having &Dgr L ≤ -85.00 where &Dgr L = 0: white and &Dgr L = -100: black on a color difference m...
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WO/2004/038070A2 |
Pulse reverse electrolysis of acid copper solutions is used for applying copper to decorative articles, such as aluminium alloy automotive wheels and plastic parts for automotive use. The benefits include an improved thickness distributi...
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WO/2004/035874A1 |
Production of an electrolytic copper foil with the use of a cathode drum, wherein there is obtained an electrolytic copper foil of low profile having a low surface roughness on the roughened surface side (side opposite to glossy surface)...
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WO/2004/035875A2 |
The invention relates to a method for bronze galvanic coating which consists in metallising a substrate to be coated by the immersion thereof in an acid electrolyte which contains at least tin and copper ions, alkyl sulfoacid and a wetti...
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WO/2004/033762A1 |
The invention concerns a method for electrolytic coating of materials with aluminium, magnesium or aluminium and magnesium alloys. Said method is characterized in that the material is pretreated by being immersed in an electrolytic solut...
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WO/2004/034421A2 |
The present invention is directed to a method for depositing unpatterned or selectively patterned nanoparticle films of controlled thickness on the respective film deposition surface of each of a pair of electrodes. In the present method...
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WO2003041661A9 |
The invention concerns a method which consists in creating, in accordance with a general concept in dentistry, a cushioning layer or a stable transfer layer exhibiting goof flexural strength and capable of distributing stresses, between ...
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WO/2004/027120A1 |
The invention relates to an alloy containing 1 - 15 % tin, 19 - 60 % copper and 30 - 80 % bismuth, an electrolytical method and electrolytic compositions for the production and use thereof.
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WO/2004/025760A1 |
Improved fuel compositions have improved flaw properties for use in zinc/air (oxygen) fuel cell systems. In some embodiments, an improved fuel composition comprises a collection of particles having zinc and at least one non-zinc metal ha...
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WO/2004/020696A2 |
The invention relates to a method for producing a foam metallic structure, said method comprising the following steps: a non-conductive substrate (10) having a foamed structure is prepared, conductive particles (16) are applied to said s...
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WO/2004/020697A1 |
Disclosed is a method of producing jewelry, which consists of the steps of forming a basic frame of the jewelry using a metal bar or a miscellaneous material to produce an early form of the jewelry; removing contaminants from the early f...
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WO2003066936B1 |
An aqueous bath for electroplating NiP coatings comprising, generally, a solution containing nickel salts, either a mixture of nickel sulfate and nickel chloride or an all nickel chloride source, sodium hypophosphite and boric acid. Thio...
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WO/2004/016829A2 |
Disclosed are copper electroplating solutions, methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the...
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WO2003023395A9 |
A method for detecting and quantifying analytes such as chemical additives in metal plating bath solutions, according to a scheme presented in Figure 3, is provided. Steps 202-214 comprise incorporating molecular tags into the chemical s...
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WO/2004/013382A1 |
The invention relates to an additive aqueous solution for an electrolytic bath used for the electrochemical depositing of tin or one of the alloys thereof. Said solution comprises an ethylene oxide and propylene oxide copolymer and an am...
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WO/2004/011698A1 |
A tin-silver-copper containing plating solution which comprises a medium having water as its primary component, a sulfonic acid, a tin ion, a copper ion and a silver ion, wherein concentrations of the silver ion, the tin ion and the copp...
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WO/2004/011188A1 |
the invention relates to a brazing sheet product including a core sheet, on at least one >ide of the core sheet a clad layer of an aluminium alloy including silicon in an amount in the range of 4 to 14% by weight, and further including o...
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WO/2004/009876A1 |
A copper electrolyte which comprises, as additives, an organic sulfur compound and an amine compound which is prepared by the addition reaction of a compound having one or more epoxy groups in one molecule with an amine compound and has ...
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WO/2004/007809A2 |
A plain bearing and method for making the plain bearing are described, the plain bearing having an overlay alloy layer at a sliding surface of the plain bearing, the plain bearing comprising a layer of a strong backing material, a layer ...
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WO/2004/005589A1 |
The invention relates to a bath for gold electrodeposition, comprising, in solution in water, gold sulphite, a grain refiner which is selected from soluble compounds of bismuth, tin, tellurium and selenium, a complex-forming agent and a ...
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WO/2004/005528A2 |
The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin...
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WO/2004/001099A2 |
The invention relates to a composition for treating the surfaces of metals and for depositing metals or metal alloys on plastic surfaces. Said composition contains: a) at least one polymer, as constituent A, containing at least one struc...
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WO/2004/001823A1 |
A method for manufacturing a semiconductor device capable of operating at high rate and having a high quality and a high reliability. The method in which a barrier film (7) having a copper diffusion preventive function is formed on a met...
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WO/2004/001101A2 |
The present invention herein refers to an electrolytic bath for the electrodeposition of noble metals, of their alloys, with or without tin and to the electrodeposition of noble metals and their alloys with tin using said bath. In an emb...
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WO/2003/102276A1 |
The invention relates to a method for producing electrolyte solutions consisting of trialkylaluminium AlR3, M1AlR4, M2AlR4 and an aromatic hydrocarbon. According to the invention, a mixture of M1OR and M2OR is reacted with trialkylalumin...
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WO/2003/100137A2 |
The plating bath for the deposition of satin nickel deposits according to the present invention contains at least one quaternary ammonium compound and at least one polyether, the at least one polyether having at least one strongly hydrop...
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WO/2003/100136A2 |
The invention concerns an electroplating bath as well as a method for cathode deposition of a zinc-nickel alloy coating. In accordance with the invention, the bath contains as complexing agent, at least a polyethylenamine. Through additi...
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WO/2003/098673A1 |
A polishing method and a polishing system in which accurate and stabilized electrolytic polishing is realized by controlling the potential of a working electrode correctly, and a method for fabricating a semiconductor device utilizing th...
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WO/2003/096776A1 |
A flexible printed wiring board that has an insulating layer of high light transmission, is excellent in adhesive strength and migration resistance and is suitable for chip-on-film (referred to as COF). In particular, a flexible printed ...
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WO/2003/092911A1 |
The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are essentially free of compressive stress or are predominantly in a predetermined crystal ...
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WO/2003/090965A1 |
A polishing method capable of energizing a polished object to the end of polishing with a stable current density distribution and allowing to use the other equipment such as conventional plating equipment and washing equipment and to per...
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WO/2003/087433A1 |
An improved electrode and method for manufacturing the improved electrode wherein the electrode having a fractal surface coating of platinum [which the present inventor refers to as “platinum gray”] with a increase in surface area of...
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WO/2003/085173A2 |
In the present invention, the test reference electrode used for voltammetric analysis of a plating bath is calibrated relative to the zero-current point between metal plating and stripping at a rotating platinum disk electrode in the pla...
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WO/2003/085713A1 |
Embodiments of the invention may generally provide a method for plating a homogenous copper tin alloy onto a semiconductor substrate. The method generally includes providing a plating solution to a plating cell, wherein the plating solut...
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WO/2003/083171A1 |
A conversion coating solution comprises at least one precursor agent, at least one activator agent, and water solvent, in which on provision to a solution suitable for the deposition of a substantially metallic coating, provides an in-si...
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WO/2003/083182A2 |
The present invention provides a composition and method for void−free plating of a metal into high aspect ratio features. The plating process is carried out in a plating solution containing metal at a molar concentration of between abo...
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WO/2003/080896A1 |
Disclosed is an aqueous copper plating bath containing sulfuric acid with a specific ratio to at least one supplemental acid selected from the group consisting of fluoboric acid, alkane sulfonic acids, and alkanol sulfonic acids; a coppe...
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