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WO/2005/040459A2 |
Disclosed are electroplating compositions and methods for filling recessed microstructures of a microelectronic workpiece (101), such as a semiconductor wafer, with metallization. The electroplating compositions may comprise a mixture of...
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WO/2005/039647A2 |
The present invention relates to a radium target as well as to a method for producing it for the production of radionuclides by means of accelerated protons, wherein an electrodeposition of radium out of at least one aqueous organic solu...
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WO/2005/038095A2 |
The invention relates to a method for phosphating metal layers by electrodeposition from acidic aqueous solutions containing at least zinc ions and phosphate ions, and by using direct current. Electrodeposition of zinc takes place in the...
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WO/2005/035835A2 |
The invention relates to a coated workpiece comprising a substrate, a metallic intermediate layer applied to said substrate, and a layer containing an aluminum/magnesium alloy applied to the intermediate layer. The invention also relates...
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WO/2005/033374A1 |
The invention relates to an electrolyte for the galvanic deposition of aluminum-magnesium alloys, which comprises at least one aluminum-organic complex compound of the formula MAIR4 or mixtures thereof and a magnesium alkyl compound, whe...
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WO/2005/031812A2 |
Bottom-up filling of fine Damascene trenches and vias in semiconductor chips is attained using a copper pyrophosphate electroplating bath with a single accelerating additive species present at low concentration (< 5 µM). This bath is mu...
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WO/2005/028717A1 |
A method and apparatus for plating a metal onto a substrate. The apparatus includes a fluid basin configured to contain a plating solution, an anode fluid volume positioned in a lower portion of the fluid basin, a cathode fluid volume po...
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WO/2005/026403A1 |
Method for metallizing the surface of an object, for example a plate (20) of ceramics or other inert material, of stone, wood, plastics. The process begins with the location of the plate (20) in the vicinity of means for delivering molte...
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WO/2005/021839A1 |
The invention relates to a method for electrochemically depositing, in particular, a number of metals M1 and M2. The invention provides that, for example, indium or another metal having a very low exchange-current density with regard to ...
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WO/2005/021429A1 |
The invention relates to a method for producing a layer or a film from a metal nanotube composite material in a geometric configuration and a mechanical stability of such that permit the technical use of the advantageous nanotube materia...
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WO/2005/021836A2 |
The present invention is directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, ...
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WO/2005/021840A1 |
The invention relates to a device (1) for separating metals and/or metal alloys from metallo-organic electrolytes and depositing the same on products (7), said device comprising at least one coating section (3) for coating the products (...
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WO/2005/015036A1 |
The invention relates to the use of lead-free sliding layers in the laminated composite materials for slide bearings or bushes. According to the invention, the laminated composite material comprises a support layer, an antifriction layer...
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WO/2005/014891A2 |
The aqueous acidic solution for electrolytically depositing high polish, decorative bright, smooth and level copper coatings on large area metal or plastic parts contains a) at least one oxygen-containing, high molecular additive and b) ...
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WO/2005/015037A1 |
It is advisable to use lead-free anti-friction layers in the production of layered composite materials for plain bearings or bushes. The invention relates to a layered composite material comprising a support layer, a metal bearing layer ...
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WO/2005/014890A1 |
An electrolyte solution comprising at least one plateable metal ion capable of being reduced to the metallic form, at least one transition metal ion species, and a solvent, in which a passivated coating of the at least one plateable meta...
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WO/2005/014881A2 |
A method for producing a substrate with black film is provided, comprising forming a dull plating film on a surface of a substrate, forming an electroless plating film containing a sulfur or nitrogen compound on the surface of the platin...
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WO/2005/010239A1 |
An electrolytic copper foil of low profile whose surface roughness on the rough surface side (side opposite to shiny surface) in the electrolytic copper foil production using a cathode drum is low, which electrolytic copper foil can espe...
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WO/2005/010241A1 |
A surface-treated copper foil exhibiting excellent black color which can be worked by the customary copper etching process; and a conductive mesh for PDP produced from such a surface-treated copper foil. In particular, use is made of, fo...
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WO/2005/007933A1 |
Embodiments of the invention provide an electrochemical plating cell (100). The plating cell includes a fluid basin (101), (102) having an anolyte solution compartment and a catholyte solution compartment, an ionic membrane (112) positio...
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WO/2005/008759A1 |
Embodiments of the invention teach a method for depositing a copper seed layer to a substrate surface, generally to a barrier layer. The method includes placing the substrate surface into a copper solution, wherein the copper solution in...
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WO/2005/003411A1 |
Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell (102) containing an anolyte compartment (106) and a catholyte compartment (104) separated ...
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WO/2004/111288A2 |
A method for constructing a titanium film capacitor. The method includes fabricating an anode from at least one of titanium and a titanium alloy and forming a homogeneous anode film on at least one surface of the anode.
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WO/2004/108995A1 |
An apparatus (12) for applying a zinc or zinc-alloy electroplate to a workpiece comprises an electroplating bath (16) having a pH more than about 14. The electroplating bath includes zinc ions and an additive. A cathode workpiece (18) is...
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WO/2004/107833A1 |
Disclosed is a method for manufacturing a copper foil for use in formation of various circuit networks in the state of being layered on a printed circuit board. The method of the current invention includes electrolyzing a copper foil set...
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WO/2004/105051A1 |
Disclosed are aqueous solutions for use in high energy, highly efficient electrical energy storage devices. The solutions contain (a) a high purity sulfonic acid with a low concentration of low valent sulfur compounds or higher valent su...
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WO/2004/101859A1 |
A low surface roughness electrolytic copper foil having a surface roughness Rz not higher than 2.5 μm and an elongation percentage not smaller than 6% at 180&ring C in which tensile strength at 25&ring C measured within 20 min of the po...
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WO/2004/101860A1 |
Disclosed is a solution for an electrochemical process, the solution containing a sulfonic acid and having a low concentration of sulfur compounds, either low or high valence, that are susceptible to reduction and which is intended for u...
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WO/2004/094333A2 |
A ceramic coating is formed on a conductive article by immersing a first anodic electrode, including the conductive article, in an electrolyte comprising an aqueous solution of alkali metal hydroxide and an alkali metal silicate, providi...
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WO/2004/094699A1 |
The present invention relates to an electrolyte for producing a novel Fe-Ni alloy having an Ni content in a range of 33 to 42 wt%, specifically a nanocrystalline invar alloy having a grain size of 5 to 15 nm, by electroplating, and prepa...
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WO/2004/092075A1 |
A biofilm resistant fluid handling system is provided having at least one structural component adapted to retain or deliver fluid. The at least one structural component is formed from a biofilm resistant material (12) comprising polymeri...
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WO/2004/090197A1 |
An electrolytic copper foil with low roughness surface whose surface roughness (Rz) is 2.0 μm or less, the surface uniformly provided with low roughness without uneven surge, which electrolytic copper foil exhibits a percent elongation ...
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WO/2004/080887A1 |
Method for making three-dimensional structures. A template is provided having at least two conductive regions separated by a non-conductive region. The template is disposed in an electrolyte in an electrodeposition cell (10) and a voltag...
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WO/2004/079054A1 |
An electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives dissolved in the non-aqueous or non-aromatic organic solvent. Electrodeposition of a meta...
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WO/2004/079055A1 |
A method for producing a rare-earth permanent magnet, which comprises laminating a first protective layer comprising nickel and a second protective layer comprising nickel and sulfur on a magnet base material comprising a rare earth elem...
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WO/2004/074537A1 |
The invention relates to a method of depositing or fixing materials to surfaces. More specifically, the invention relates to a method of coating a surface with first and second materials, comprising the following steps consisting in: dep...
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WO/2004/074550A1 |
The present invention relates to an electrolyte for producing a low thermal expansion Fe-Ni alloy having a coefficient of thermal expansion of not more than 9 µm/m K by electrodeposition (electroforming), and processing conditions and a...
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WO/2004/072320A2 |
An aqueous acidic plating bath for the electrodeposition of a nickel or nickel alloy deposit. The bath includes nickel ions and an additive having the general formula: H2C=CHCH2NR1R2 or [H2C=CHCH2N+R1R2R3]nXn- wherein R1, R2 and R3 are s...
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WO/2004/065663A1 |
A tin-containing plating bath which contains (a) a soluble stannous salt, or a mixture of at least one soluble salt selected from the group consisting of copper salts, bismuth salts, silver salts, indium salts, zinc salts, nickel salts, ...
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WO/2004/061162A1 |
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects usi...
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WO/2004/061924A1 |
The invention relates to a method of producing thin films of compound CIGS by means of electrodeposition. According to the invention, a surface-active compound, such as dodecyl sodium sulphate, is added to an electrolysis bath solution i...
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WO/2004/059040A1 |
In the production of an electrolytic copper foil by means of a cathode drum, there is obtained a low-profile electrolytic copper foil having a low surface roughness on the roughened surface side (side opposite to glossy surface), especia...
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WO/2004/059042A1 |
A lead-free bump which is formed by reflowing an Sn-Ag based solder alloy plating film having an adjusted Ag concentration; and a method for forming the lead-free bump, which comprises forming an Sn-Ag based alloy plating film having an ...
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WO/2004/059041A1 |
The present invention provides a method of forming a biaxially textured gold buffer layer (14) on a substrate(16) by electrodeposition. A superconducting material (12) may be deposited onto the biaxially textured goldlayer (14). The biax...
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WO/2004/057061A1 |
For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phe...
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WO/2004/055246A1 |
A copper electrolytic solution for obtaining a low profile electrolytic copper foil having reduced surface roughness on the rough surface side (side opposite to glossy surface) in the production of an electrolytic copper foil by the use ...
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WO/2004/053202A1 |
A method of forming a copper interconnect, comprising forming an opening in a dielectric layer disposed on a substrate, forming a barrier layer over the opening, forming a seed layer over the metal layer, and forming a copper-noble metal...
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WO/2004/053203A2 |
The invention relates to a method for the electrolytic deposition of magnesium or magnesium-zinc on a substrate consisting of sheet metal (1) comprising a zinc or zinc alloy coating, especially a steel sheet. The electrolytic deposition ...
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WO/2004/053193A1 |
In one aspect, a copper foil (14, 60) for lamination to a dielectric substrate (62) includes a layer (64) deposited on a surface of the copper foil (14, 60). The layer (64) is formed from chromium and zinc ions or oxides and is treated w...
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WO/2004/054016A2 |
An electrochemical cell for a portable electronic device is provided, said cell having a positive electrode, a negative electrode and an electrolyte, characterised in that at least the positive electrode comprises a mesoporous structure ...
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