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WO/2002/068729A1 |
A process for electrochemical deposition of tantalum on an article in an inert, non-oxidizing atmosphere or under vacuum, in a molten electrolyte containing tantalum ions, comprising the steps of: immersing the article into the molten el...
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WO/2002/068728A1 |
The invention relates to a bath for the galvanic deposition of gold and gold alloys, and to the use thereof for producing dental shaped elements, wherein the gold is present in the form of a gold sulfite complex. The inventive bath and t...
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WO2002045476A9 |
A process and reactor for electrochemical processing of at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positio...
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WO/2002/064862A2 |
A method for producing a plated molded product is provided, in which a surface of a molded product having a thin portion obtained by coinjection molding of resin is subjected to plating. A surface of a molded product having a thin portio...
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WO/2002/063069A2 |
Methods of electrodeposition and electroless deposition are disclosed which afford super-filling of high-aspect ratio features on wafers by exposing wafers and electrolytic solutions in which they are immersed to conditions effective to ...
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WO/2002/063070A1 |
An electrolytic plating process is provided for electrodepositing a nickel or nickel cobalt alloy which contains at least 2 % to 25 % by atomic volume of phosphorous. The process solution contains nickel and optionally cobalt sulfate, hy...
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WO/2002/063071A2 |
The invention relates to a dip comprising an acid aqueous solution having no ammonium ion, fluoroborate ions or citrate ion and containing per litre: between 10 and 60g of Zn?2+¿ ions and between 20 and 100g of Mn?2+¿ ions. Said invent...
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WO/2002/062446A1 |
A process for removing oxygen from a copper plating solution is provided. The solution is passed through a degasser comprising a shell and hollow hydrophobic fiber porous membranes wherein the shell while a vacuum is drawn on the surface...
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WO/2002/061184A1 |
Conductors for use in batteries, storage batteries, and solar collectors are produced by means of electrolysis. According to the invention, a method of this type for the production of an electrical conductor, which conductor comprises a ...
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WO/2002/059397A1 |
A method for the continuous, electrolytic bonded deposition of a salt-free, dendritic nickel-containing coating on a metallic film (1), in particular, nickel film, is disclosed, whereby the deposition occurs from an aqueous deposition so...
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WO/2002/058775A2 |
The present invention is directed to a device for dilating and irradiating a vascular segment, body passageway or an obstruction in a vascular segment or body passageway. The device comprises electroless deposition, electro-deposition or...
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WO/2002/058114A1 |
A substrate processing apparatus comprises a plating section (32) having a plating bath (44) for holding a plating liquid therein, and a head assembly (42) for holding a substrate (W) and immersing the substrate (W) in the plating liquid...
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WO/2002/057517A1 |
The invention relates to an electrodeposited bearing alloy based on lead, tin and copper for producing sliding layers for plain bearings and to an electroplating bath comprising lead, tin, copper and antimony. The invention additionally ...
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WO/2002/058113A2 |
Methods for electrochemically polishing copper films on semiconductor substrates use an alkaline solution with a pH in the range of about 8.0 to 10.5. A constant current density of from 53.82 to 1076.36 amperes per square meter (5 to 100...
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WO/2002/055568A2 |
The invention relates to the use of polyolefins with alkaline, aromatic substituents of the general formula (I), wherein Ar is an alkaline aryl group or a phenyl, an alkyl having 1 to 8 carbon atoms or hydrogen, with at least 50 % of the...
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WO/2002/055763A1 |
A tin or tin alloy plating solution, characterized in that it contains, as an additive, at least one selected from the group consisting of a bisphenol A ethylene oxide adduct, a bisphenol A propylene oxide adduct, and a bisphenol F ethyl...
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WO/2002/054840A1 |
The invention relates to a method for producing electroconductive structures. An electrically isolating substrate (101) is produced or prepared in such a way that it comprises a surface having cavities at the sites where the electrocondu...
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WO/2002/052068A1 |
A Zn-Co-W alloy electropated_steel sheet with excellent corrosion resistance and weldability, and an electrolyte for manufacturing the same are provided.Accordingly, the present invention relates to a Zn-Co-W alloy electroplated steel sh...
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WO/2002/049773A1 |
Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one o...
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WO/2002/049077A2 |
A metal contact for a copper alloy surface, comprising: electroplated barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, wherein the barrier layer is selected from the group consisting of cobalt, cobal...
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WO/2002/046500A2 |
A method of forming a surface finish of trivalent chromium on metal or plastics substrates by electrodeposition from an aqueous plating solution of trivalent chromium ions in which the trivalent chromium is deposited on a layer of silver...
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WO2000061838A9 |
A corrosion resistant and wear resistant nickel-iron-cobalt/hardener alloy or nickel-cobalt/hardener alloy having a brilliant luster is electrodeposited onto the surface of a substrate as an alternative to chromium plating. The plating s...
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WO/2002/042519A1 |
A zinc-plated article being free from the occurrence of whisker having a multi-layered film which is excellent in rust resistance, self-recovering property and adhesion of layers; a composition for forming the multi-layered film; and a m...
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WO/2002/038326A2 |
The invention relates to an aluminium brazing product, such as a brazing sheet product, comprising an aluminium alloy base substrate (1) of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, and on at ...
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WO/2002/038835A1 |
The invention relates to a method for the electrolytic coating of materials, in particular metallic materials, whereby a chromium alloy is deposited from an electrolyte, comprising at least chromic acid, sulphuric acid, an isopolyanion-f...
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WO/2002/033153A2 |
In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with...
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WO/2002/031228A1 |
A copper electroplating using an insoluble anode is characterized in that a substrate is plated by a DC current by using an electrolytic copper plating solution containing a compound having in a molecule a -X-S-Y- structure (where X and ...
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WO/2002/026701A2 |
Ionic compounds with a freezing point of up to 100 °C are formed by the reaction of an one amine salt of formula (I) R?1¿ R?2¿ R?3¿ R?4¿ N?+¿ X?-¿, such as choline chloride with an organic compound (II) capable of forming a hydrog...
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WO/2002/026381A2 |
Ionic compounds having a freezing point of no more than 50 °C, formed by the reaction of at least one amine salt of the formula R?1¿R?2¿R?3¿R?4¿N?+¿X?-¿ (I) with at least one hydrated salts, which is a chloride, nitrate, sulphate ...
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WO/2002/024979A1 |
The invention relates to an acid electrolyte for depositing tin-copper alloys. Said electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble copper(II) sal...
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WO/2002/022913A2 |
The invention relates to ternary tin zinc alloy coatings 30 - 65 wt. % tin, 30 - 65 wt. % zinc and 0.1 - 15 wt . % metal from the following group as a third alloy component; iron, cobalt, nickel. Correspondingly, alloy coatings can be pr...
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WO/2002/016673A1 |
A novel electrochemical treating method such as elecrtoplating and an electrochemical reaction device therefor, which enables high-reaction, efficient electrochemical reaction, are environmentally friendly because they produce very littl...
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WO/2002/015297A2 |
An interchangeable electrolyte contains and additive that promotes interchangeable use between batteries and electroplating cells by limiting dendritic deposition in battery cells and promoting a smooth finish in an electroplating cell, ...
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WO/2002/012595A1 |
The present invention relates to a method of reducing a band mark on an electroplating steel sheet, which can also reduce plating defects and damages to the materials caused by the differences in the physical characteristics of compositi...
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WO/2002/008497A1 |
An additive for an alkaline zinc or zinc alloy electroplating bath medium, the additive comprising a random co-polymer comprising the reaction product of: (vii) one or more di-tertiary amines including an amide or thioamide functional gr...
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WO/2002/004714A1 |
An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co.) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) ...
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WO/2002/004713A2 |
The invention relates to a method for electrolytically coating metalswith zinc or a zinc alloy. Matt surfaces are obtained by depositing zinc from an electrolyte solution containing a zinc salt selected from zinc sulphate or an alkane su...
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WO2000061837A9 |
A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microeletronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (50...
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WO/2001/099217A1 |
Disclosed herein is a method of fabricating a catalyzed porous electrode for fuel cell, which electrode can be fabricated in a simple and easy manner without forming a catalyst support layer of carbon particles, and has an excellent, sta...
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WO/2001/096631A1 |
The present invention relates to an apparatus (12) for applying a zinc-nickel electroplate to a workpiece. The apparatus comprises a zinc-nickel electroplating bath (16) comprising an amine additive, such as poly(alkyleneimine), which is...
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WO2000029501A9 |
Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least on...
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WO/2001/092606A1 |
The invention relates to an acidic electrolyte used for depositing tin-silver alloys. The acidic electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble s...
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WO/2001/092605A1 |
A galvanic bath for the cathodic precipitation of zinc alloy coatings is used for reducing environmental burden by utilizing manganese.
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WO/2001/088227A1 |
In order to achieve an even satin-finished nickel or nickel alloy coating an acid nickel or nickel alloy electroplating bath is proposed which contains a sulfosuccinic acid compound of the general formula (I) additional to at least one q...
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WO/2001/088228A1 |
An electrolysis apparatus equipped with a circulating system, wherein an adjusted copper sulfate solution containing thiourea added thereto is electrolyzed in an electrolysis vessel to produce an electrolytic copper foil, a copper sulfat...
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WO/2001/089024A1 |
A method for carrying out electrochemical reactions in an electrochemical cell is disclosed. The method includes the step of enveloping in a plasma a respective part of each of two electrodes. The plasma is moved to the electrodes and ac...
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WO/2001/088226A2 |
The invention relates to a method of manufacturing an Al or alloy workpiece, comprising the steps of (a) providing an AlAl alloy workpiece, (b) pre-treating of the outersurface of the Al or Al alloy workpiece, and (c) plating a metal lay...
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WO/2001/083854A2 |
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to cooper electroplating in the fabrication of intercon...
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WO/2001/083856A1 |
The invention concerns a surface treatment for parts of plastic die-casting and extrusion machines which come into contact with molten plastics. Especially polyvinylchloride, polycarbonates, fluorcarbon derivates, polyethylene, ethylene ...
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WO/2001/077417A1 |
The invention concerns an aqueous electrolytic solution with acid pH for electrochemical deposit of palladium or its alloys comprising a palladium compound, and optionally at least a secondary metal compound to be co-deposited in the for...
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